Method for closing a hole with a diecut

US10828841B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10828841-B2
Application numberUS-201414913410-A
CountryUS
Kind codeB2
Filing dateJul 23, 2014
Priority dateAug 23, 2013
Publication dateNov 10, 2020
Grant dateNov 10, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A blank and/or diecut permanently closes of holes in metal sheets and/or in plastic parts. The blank and/or diecut comprises at least one carrier having a laminate of at least two polymeric films, wherein the lower film has a basis weight of at least 1.5 kg/m2 and the side of the lower film opposite the upper film has an applied adhesive thereon.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method comprising: applying a diecut to a hole such that the hole is covered by the diecut; and causing temperatures of 120° C. to 200° C. to act on the diecut so that an applied adhesive cures and closes the hole, wherein: the diecut comprises an upper polymeric film and a lower polymeric film; the lower polymeric film comprises a polyolefin and a mineral filler; the lower polymeric film has a basis weight between 1.5 and 3.9 kg/m 2 ; the lower polymeric film has a thickness between 600 and 3,500 μm; the lower polymeric film is disposed between the upper polymeric film and the applied adhesive; and the applied adhesive is a curable adhesive. 2. The method according to claim 1 , wherein the upper polymeric film consists of polyethylene terephthalate. 3. The method according to claim 1 , wherein the upper polymeric film has a thickness between 15 and 350 μm. 4. The method according to claim 1 , wherein the cured adhesive is a self-adhesive and the self-adhesive is an acrylate-based self-adhesive composition. 5. The method according to claim 1 , wherein the diecut is applied concentrically over the hole. 6. The method according to claim 1 , wherein: the diecut further comprises a first contour; the edge of the hole comprises a second contour; and the first contour and the second contour correspond. 7. The method according to claim 1 , wherein: the diecut further comprises a first contour; the edge of the hole comprises a second contour; and the first contour and the second contour correspond such that the diecut overlaps the hole by between 1 and 20 mm. 8. The method according to claim 1 , wherein the lower polymeric film has a basis weight of between 1.5 and 2.5 kg/m 2 . 9. The method according to claim 3 , wherein the thickness of the upper polymeric film is between 15 and 150 μm. 10. The method according to claim 1 , wherein the thickness of the lower polymeric film is between 1,700 and 3,500 μm. 11. The method according to claim 1 , wherein the curable adhesive is a structural adhesive. 12. The method according to claim 11 , wherein the curable adhesive is a reactive, heat-activatable adhesive composition. 13. The method according to claim 12 , wherein the curable adhesive comprises a nitrile rubber and a phenolic resin. 14. The method according to claim 1 , wherein the curable adhesive is disposed between the lower polymeric film and a self-adhesive. 15. The method according to claim 1 , wherein the lower polymeric film is 0.015 to 12 mm thick. 16. The method according to claim 1 , wherein the lower polymeric film further comprises 8 to 20 vol % of an oil. 17. The method according to claim 1 , wherein a metal foil is disposed between the upper polymeric film and the lower polymeric film. 18. The method according to claim 1 , wherein the upper polymeric film further comprises a filament. 19. The method according to claim 1 , wherein the lower polymeric film further comprises a filament. 20. The method according to claim 2 , wherein: the upper polymeric film has a thickness between 15 and 350 μm; and the cured adhesive is a self-adhesive and the self-adhesive is an acrylate-based self-adhesive composition.

Assignees

Inventors

Classifications

  • B60R13/06Primary

    Sealing strips (sealing arrangements for vehicle windows, windscreens, non-fixed roofs, doors, or similar devices B60J10/00) · CPC title

  • using patches sealing on the surface of the article (B29C73/14 takes precedence) · CPC title

  • Vehicles, e.g. ships or aircraft, or body parts thereof {(vanes or blades B29L2031/08, air bags B29L2022/027)} · CPC title

  • B29C65/48Primary

    using adhesives {, i.e. using supplementary joining material; solvent bonding} · CPC title

  • by heating, with or without pressure · CPC title

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Frequently asked questions

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What does patent US10828841B2 cover?
A blank and/or diecut permanently closes of holes in metal sheets and/or in plastic parts. The blank and/or diecut comprises at least one carrier having a laminate of at least two polymeric films, wherein the lower film has a basis weight of at least 1.5 kg/m2 and the side of the lower film opposite the upper film has an applied adhesive thereon.
Who is the assignee on this patent?
Tesa Se
What technology area does this patent fall under?
Primary CPC classification B60R13/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 10 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).