Electronic device housing, method for manufacturing electronic device housing, development plan-shaped metal resin joint plate, and electronic apparatus

Patent metadata

Field	Value
Publication number	US-10827658-B2
Application number	US-201716326897-A
Country	US
Kind code	B2
Filing date	Aug 23, 2017
Priority date	Aug 26, 2016
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

An electronic device housing of the present invention is a housing for internally accommodating an electronic device and is provided with a metal bottom plate, and metal side plates folded and integrally connected to the bottom plate, in which, in a metal member (M) formed of at least the bottom plate and the side plate, a thermoplastic resin member is joined to a portion of the surface of the plate-shaped metal member (M), the metal member (M) is reinforced by a thermoplastic resin member, and the thermoplastic resin member is joined to both surfaces of the plate-shaped metal member (M).

First claim

The invention claimed is:

1. An electronic device housing for internally accommodating an electronic device, the housing comprising:
a metal bottom plate; and
a metal side plate folded and integrally connected to the bottom plate,
wherein, in a metal member (M) formed of at least the bottom plate and the side plate, a thermoplastic resin member is joined to a portion of a surface of the plate-shaped metal member (M) and the metal member (M) is reinforced by the thermoplastic resin member, and
the thermoplastic resin member is joined to both surfaces of the plate-shaped metal member (M), and
wherein at least a portion of the thermoplastic resin member is formed in a frame shape on the surface of the metal member (M),
wherein the metal member (M) has a fine concavo-convex structure on at least a surface of a joined portion with the thermoplastic resin member, and
the metal member (M) and the thermoplastic resin member are joined by allowing a portion of the thermoplastic resin member to penetrate into the fine concavo-convex structure, and
the fine concavo-convex structure on the surface of the metal member (M) is a fine concavo-convex structure in which convex portions having a spacing period of 5 nm or more and 500 μm or less stand close together,
wherein a surface area of the joined portion of the thermoplastic resin member occupied in an entire surface area of the metal member (M) is 1 area % or more and 50 area % or less, and
wherein the frame shape is at least one kind of shape selected from a bracing shape, a lattice shape, a truss shape, and a Rahmen shape.

2. The electronic device housing according to claim 1 ,
wherein the metal member (M) has an average thickness of 0.2 mm or more and 1.0 mm or less.

3. The electronic device housing according to claim 1 ,
wherein the thermoplastic resin member joined to one surface of the plate-shaped metal member (M) and at least a portion of the thermoplastic resin member joined to another surface are arranged to face each other in a vertical direction of a plate surface of the metal member (M).

4. The electronic device housing according to claim 1 ,
wherein the thermoplastic resin member is joined to at least a peripheral edge portion of the surface of the metal member (M).

5. The electronic device housing according to claim 1 ,
wherein the thermoplastic resin member includes an injection molded body.

6. The electronic device housing according to claim 1 ,
wherein the thermoplastic resin member has an average thickness of 1.0 mm or more and 10 mm or less.

7. The electronic device housing according to claim 1 ,
wherein a metal material forming the metal member (M) includes a metal which has an electromagnetic wave shielding property.

8. The electronic device housing according to claim 1 , the housing further comprising:
a metal lid plate folded and integrally connected to the side plate,
wherein the thermoplastic resin member is joined to a portion of a surface of the lid plate, and the lid plate is reinforced by the thermoplastic resin member.

9. The electronic device housing according to claim 8 ,
wherein the lid plate has a fine concavo-convex structure on at least a surface of a joined portion with the thermoplastic resin member, and
the lid plate and the thermoplastic resin member are joined by allowing a portion of the thermoplastic resin member to penetrate into the fine concavo-convex structure.

10. The electronic device housing according to claim 1 ,
wherein the thermoplastic resin member is not joined to a boundary linear portion between the bottom plate and the side plate.

11. A method for manufacturing the electronic device housing according to claim 1 , the method comprising:
a step (A) of preparing a development plan-shaped metal plate provided with a metal bottom plate and a metal side plate integrally connected to the bottom plate, and having a fine concavo-convex structure on at least a surface of a joined portion to which a thermoplastic resin member is joined;
a step (B) of manufacturing a development plan-shaped metal resin joint plate by installing the development plan-shaped metal plate in a metal mold, injecting a thermoplastic resin composition into the metal mold, and joining the thermoplastic resin member to a surface of the development plan-shaped metal plate; and
a step (C) of forming the development plan-shaped metal resin joint plate into a box shape by folding a boundary linear portion between the bottom plate and the side plate of the development plan-shaped metal resin joint plate.

12. The method for manufacturing the electronic device housing according to claim 11 ,
wherein, in the step (B), the thermoplastic resin composition is injected into the metal mold such that the thermoplastic resin member is not joined to the boundary linear portion between the bottom plate and the side plate.

13. An electronic apparatus comprising:
the electronic device housing according to claim 1 ; and
an electronic device accommodated in the electronic device housing.

14. A development plan-shaped metal resin joint plate for manufacturing a housing for internally accommodating an electronic device, the development plan-shaped metal resin joint plate including a metal bottom plate, and a metal side plate folded and integrally connected to the bottom plate,
wherein, in a metal member (M) formed of at least the bottom plate and the side plate, a thermoplastic resin member is joined to a portion of a surface of the plate-shaped metal member (M), and the metal member (M) is reinforced by the thermoplastic resin member,
wherein the thermoplastic resin member is joined to both surfaces of the plate-shaped metal member (M), and
wherein at least a portion of the thermoplastic resin member is formed in a frame shape on the surface of the metal member (M),
wherein the metal member (M) has a fine concavo-convex structure on at least a surface of a joined portion with the thermoplastic resin member, and
the metal member (M) and the thermoplastic resin member are joined by allowing a portion of the thermoplastic resin member to penetrate into the fine concavo-convex structure, and
the fine concavo-convex structure on the surface of the metal member (M) is a fine concavo-convex structure in which convex portions having a spacing period of 5 nm or more and 500 μm or less stand close together,
wherein a surface area of the joined portion of the thermoplastic resin member occupied in an entire surface area of the metal member (M) is 1 area % or more and 50 area % or less, and
wherein the frame shape is at least one kind of shape selected from a bracing shape, a lattice shape, a truss shape, and a Rahmen shape.

Assignees

• Mitsui Chemicals Inc

Inventors

• Naito Shinya
• Shimbori Nobuyoshi

Classifications

• H05K5/15

  assembled by resilient members · CPC title

• H05K9/0049 Primary

  being metallic containers · CPC title

• H05K9/0045

  being rigid plastic containers having a coating of shielding material · CPC title

• B29C45/14467

  Joining articles or parts of a single article (B29C45/14377, B29C45/14385, B29C45/14581, B29C45/14614 and B29C45/006 take precedence) · CPC title

• H05K9/00

  Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) · CPC title