Switching device and electronic circuit

Patent metadata

Field	Value
Publication number	US-10826481-B2
Application number	US-201916270248-A
Country	US
Kind code	B2
Filing date	Feb 7, 2019
Priority date	Nov 20, 2013
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

A switching device 1 includes a SiC semiconductor chip 11 which has a gate pad 14, a source pad 13 and a drain pad 12 and in which on-off control is performed between the source and the drain by applying a drive voltage between the gate and the source in a state where a potential difference is applied between the source and the drain, a sense source terminal 4 electrically connected to the source pad 13 for applying the drive voltage, and an external resistance (source wire 16) that is interposed in a current path between the sense source terminal 4 and the source pad 13, is separated from sense source terminal 4, and has a predetermined size.

First claim

The invention claimed is:

1. A switching device comprising: a gate electrode, a source electrode, and a drain electrode, further comprising:
a drain terminal electrically connected to the drain electrode,
wherein the drain terminal comprises a SiC switching element, and has an island on which the SiC switching element is mounted;

a gate terminal electrically connected to the gate electrode;
a source terminal electrically connected to the source electrode;
a sense source terminal electrically connected to the source electrode and spaced apart from the source terminal; and
a resin package sealing the SiC switching element, a part of the gate terminal, a part of the source terminal, a part of the sense source terminal, and a part of the drain terminal, wherein
the gate terminal, the source terminal, the sense source terminal and the drain terminal each include a sealing portion sealed in the resin package and a terminal portion protruding in the same direction with respect to the resin package and protruding therefrom, and
the distance between the terminal portion of the source terminal and the terminal portion of the drain terminal is greater than the spacing between the terminal portion of the sense source terminal and the terminal portion of the gate terminal.

2. The switching device according to claim 1 , wherein a distance between a terminal portion of the source terminal and a terminal portion of the drain terminal is greater than a spacing between a sealing portion of the source terminal and a sealing portion of the drain terminal.

3. The switching device according to claim 1 , wherein the island of the drain terminal is included in a sealing portion of the drain terminal,
the source terminal has an island wider in width than a terminal portion of the source terminal in a sealing portion of the source terminal, and
a distance between a terminal portion of the source terminal and a terminal portion of the drain terminal is greater than a spacing between an island of the drain terminal and an island of the source terminal.

4. The switching device according to claim 3 , wherein the source electrode is connected to the island of the source terminal by a first bonding wire,
the gate terminal is connected to a sealing portion of the gate terminal by a second bonding wire, and
a sealing portion of the sense source terminal is connected to an island of the source terminal by a third bonding wire.

5. The switching device according to claim 1 , wherein the SiC switching element is a SiC trench MOSFET.

Assignees

• Rohm Co Ltd

Inventors

• Hayashiguchi Masashi
• Ino Kazuhide

Classifications

• H10W72/07653

  changes in shapes · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/886

  Die-attach connectors and strap connectors · CPC title

• H10W72/871

  Bond wires and strap connectors · CPC title