Aperture feed network with common mode rejection

Patent metadata

Field	Value
Publication number	US-10826173-B2
Application number	US-201916251519-A
Country	US
Kind code	B2
Filing date	Jan 18, 2019
Priority date	Jan 18, 2019
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

An aperture feed network includes a substrate having a first surface and a parallel second surface, first and second conductive traces on the first surface of the substrate, a third conductive trace on the second surface of the substrate, a conductive via extending through a thickness of the substrate, and one or more ground plane structures on the second surface of the substrate. The substrate comprises a dielectric material. The first and second conductive traces together form a differential signal line. The third conductive trace comprises a first branch and a second branch. The conductive via contacts the first branch of the third conductive trace on the second surface of the substrate and the second conductive trace on the first surface of the substrate. The one or more ground plane structures have irregular shapes.

First claim

What is claimed is:

1. An aperture feed network, comprising:
a substrate having a first surface and a second surface, the substrate comprising a dielectric material, wherein the second surface of the substrate is opposite and parallel to the first surface of the substrate;
a first conductive trace on the first surface of the substrate, and a second conductive trace on the first surface of the substrate, wherein the first conductive trace and the second conductive trace together form a differential signal line;
a third conductive trace on the second surface of the substrate, wherein the third conductive trace includes a first branch and a second branch;
a conductive via extending through a thickness of the substrate and contacting the first branch of the third conductive trace on the second surface of the substrate and the second conductive trace on the first surface of the substrate; and
one or more ground plane structures having irregular shapes on the second surface of the substrate.

2. The aperture feed network of claim 1 , wherein the one or more ground plane structures are substantially aligned on the opposite side of the substrate from the first conductive trace and the second conductive trace.

3. The aperture feed network of claim 1 , further comprising one or more striplines on the second surface of the substrate, the one or more striplines being adjacent to the one or more ground plane structures.

4. The aperture feed network of claim 3 , wherein the one or more ground plane structures are provided between at least two of the striplines.

5. The aperture feed network of claim 3 , wherein at least one of the one or more striplines is coupled to a resistor.

6. The aperture feed network of claim 1 , wherein a portion of the second branch of the third conductive trace is substantially aligned on the opposite side of the substrate from the first conductive trace.

7. The aperture feed network of claim 1 , wherein the differential signal line is configured to feed into an antenna.

8. The aperture feed network of claim 1 , further comprising a first wing structure and a second wing structure patterned on the first surface of the substrate.

9. An RF system, comprising:
one or more antennas;
an aperture feed network electrically coupled to the one or more antennas, the aperture feed network including
a substrate having a first surface and a second surface, the substrate comprising a dielectric material, wherein the second surface of the substrate is opposite and parallel to the first surface of the substrate,
a first conductive trace on the first surface of the substrate, and a second conductive trace on the first surface of the substrate, wherein the first conductive trace and the second conductive trace together form a differential signal line,
a third conductive trace on the second surface of the substrate, wherein the third conductive trace includes a first branch and a second branch,
a conductive via extending through a thickness of the substrate and contacting the first branch of the third conductive trace on the second surface of the substrate and the second conductive trace on the first surface of the substrate, and
one or more ground plane structures having irregular shapes on the second surface of the substrate; and

a RF circuitry configured to one of or both filter and amplify an RF signal, wherein either the RF signal is received by the RF circuitry from the one or more antennas via the aperture feed network, or the filtered and/or amplified version of the RF signal is provided by the RF circuitry to the one or more antennas via the aperture feed network.

10. The RF system of claim 9 , wherein the differential signal line is coupled to the one or more antennas and the third conductive trace is coupled to the RF circuitry.

11. The RF system of claim 9 , wherein the one or more ground plane structures are substantially aligned on the opposite side of the substrate from the first conductive trace and the second conductive trace.

12. The RF system of claim 9 , further comprising one or more striplines on the second surface of the substrate, the one or more striplines being adjacent to the one or more ground plane structures.

13. The RF system of claim 12 , wherein the one or more ground plane structures are provided between at least two of the striplines.

14. The RF system of claim 12 , wherein at least one of the one or more striplines is coupled to a resistor.

15. The RF system of claim 9 , wherein a portion of the second branch of the third conductive trace is substantially aligned on the opposite side of the substrate from the first conductive trace.

16. An impedance matching structure, comprising:
a first conductive trace on a first surface of a substrate, and a second conductive trace on the first surface of the substrate, wherein the first conductive trace and the second conductive trace together form a differential signal line;
a third conductive trace on a second surface of the substrate opposite to the first surface of the substrate, wherein the third conductive trace includes a first branch and a second branch;
a conductive via extending through a thickness of the substrate and contacting the first branch of the third conductive trace on the second surface of the substrate and the second conductive trace on the first surface of the substrate;
one or more ground plane structures having irregular shapes on the second surface of the substrate; and
one or more striplines on the second surface of the substrate, the one or more striplines being adjacent to the one or more ground plane structures.

17. The impedance matching structure of claim 16 , wherein the one or more ground plane structures are substantially aligned on the opposite side of the substrate from the first conductive trace and the second conductive trace.

18. The impedance matching structure of claim 16 , wherein the one or more ground plane structures are provided between at least two of the striplines.

19. The impedance matching structure of claim 16 , wherein at least one of the one or more striplines is coupled to a resistor.

20. The impedance matching structure of claim 16 , wherein a portion of the second branch of the third conductive trace is substantially aligned on the opposite side of the substrate from the first conductive trace.

Assignees

• Bae Sys Inf & Elect Sys Integ

Inventors

• Maccabe Andrew Cannon

Classifications

• H01Q5/371

  Branching current paths · CPC title

• H01Q5/45

  using two or more feeds in association with a common reflecting, diffracting or refracting device · CPC title

• H01Q9/0485

  Dielectric resonator antennas · CPC title

• H01P5/10

  for coupling balanced lines or devices with unbalanced lines or devices · CPC title

• H01Q9/045

  with particular feeding means (for circular polarisation H01Q9/0428) · CPC title