Function panel, manufacturing method thereof and display device

Patent metadata

Field	Value
Publication number	US-10824198-B2
Application number	US-201816100359-A
Country	US
Kind code	B2
Filing date	Aug 10, 2018
Priority date	Oct 26, 2017
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

A function panel, a manufacturing method thereof and a display device are provided. The function panel is in the display device, and includes: a base substrate, a plurality of conductive structures and a plurality of bonding structures on the base substrate, the plurality of conductive structures being connected with the plurality of bonding structures in one-to-one correspondence; and a core obstructing structure being provided on each of the bonding structures for obstructing overflow of conductive particles in an anisotropic conductive film. By providing the core obstructing structure on the bonding structure, the core obstructing structure can obstruct overflow of the conductive particles in the anisotropic conductive film. After the display device is formed, an overall width of the frame of the display device can be reduced effectively.

First claim

What is claimed is:

1. A function panel, comprising:
a base substrate;
a plurality of conductive structures and a plurality of bonding structures provided on the base substrate, the plurality of conductive structures being connected with the plurality of bonding structures in one-to-one correspondence; and
a core obstructing structure provided on each of the bonding structures, which comprises a plurality of pore-like structures in an array and is configured to obstruct overflow of conductive particles in an anisotropic conductive film,
wherein the width of each of the pore-like structures is equal to one third of the diameter of the conductive particle.

2. The function panel according to claim 1 , wherein the pore-like structures are blind holes.

3. The function panel according to claim 1 , wherein the core obstructing structure comprises: protruding structures provided at two sides of the bonding structures, a height of the protruding structure being smaller than a diameter of the conductive particle.

4. The function panel according to claim 3 , wherein the height of the protruding structure is equal to one third of the diameter of the conductive particle.

5. The function panel according to claim 3 , wherein,
each of the bonding structures comprises: a first indium tin oxide layer, a metal layer and a second indium tin oxide layer which are stacked in sequence; and
the protruding structures are provided at two sides of the second indium tin oxide layer.

6. The function panel according to claim 1 , wherein when the function panel is a touch panel, the plurality of conductive structures are a plurality of touch electrodes, which are connected with the plurality of bonding structures in one-to-one correspondence.

7. The function panel according to claim 1 , wherein when the function panel is an array substrate, the plurality of conductive structures are a plurality of signal lines, which are connected with the plurality of bonding structures in one-to-one correspondence.

8. The function panel according to claim 1 , wherein,
each of the bonding structures comprises: a first indium tin oxide layer, a metal layer and a second indium tin oxide layer which are stacked in sequence; and
the metal layer is provided with a plurality of first via holes, the second indium tin oxide layer is provided with a plurality of second via holes, and the first via holes are communicated with the second via holes in one-to-one correspondence.

9. A manufacturing method of a function panel, comprising steps of:
forming a plurality of conductive structures and a plurality of original bonding structures on a base substrate, and processing the plurality of original bonding structures using a one-time patterning technology to form the plurality of bonding structures, wherein the plurality of conductive structures are connected with the plurality of bonding structures in one-to-one correspondence; and
providing a core obstructing structure for obstructing overflow of conductive particles in an anisotropic conductive film on each of the bonding structures, wherein the core obstructing structure comprises a plurality of pore-like structures in an array, and the width of each of the pore-like structures is equal to one third of the diameter of the conductive particle.

10. The method according to claim 9 , wherein the core obstructing structure comprises: protruding structures provided at two sides of the bonding structure;
and wherein a height of the protruding structure is smaller than a diameter of the conductive particle.

11. The method according to claim 9 , wherein
when the function panel is a touch panel, the plurality of conductive structures are a plurality of touch electrodes, which are connected with the plurality of bonding structures in one-to-one correspondence.

12. The method according to claim 9 , wherein
when the function panel is an array substrate, the plurality of conductive structures are a plurality of signal lines, which are connected with the plurality of bonding structures in one-to-one correspondence.

13. A display device, comprising:
a function panel, a flexible circuit board and an anisotropic conductive film,
wherein the function panel comprises:
a base substrate;
a plurality of conductive structures and a plurality of bonding structures provided on the base substrate, the plurality of conductive structures being connected with the plurality of bonding structures in one-to-one correspondence; and
a core obstructing structure provided on each of the bonding structures, which comprises a plurality of pore-like structures in an array and is configured for obstructing overflow of conductive particles in an anisotropic conductive film, wherein
the width of each of the pore-like structures is equal to one third of the diameter of the conductive particle, and
the bonding structures in the function panel are connected to the flexible circuit board by the anisotropic conductive film.

14. The display device according to claim 13 , wherein the pore-like structures are blind holes.

15. The display device according to claim 13 , wherein the core obstructing structure comprises: protruding structures provided at two sides of the bonding structure, a height of the protruding structure being smaller than a diameter of the conductive particle.

16. The display device according to claim 15 , wherein the height of the protruding structure is equal to one third of the diameter of the conductive particle.

17. The display device according to claim 13 , wherein when the function panel is a touch panel, the plurality of conductive structures are a plurality of touch electrodes, which are connected with the plurality of bonding structures in one-to-one correspondence.

18. The display device according to claim 13 , wherein when the function panel is an array substrate, the plurality of conductive structures are a plurality of signal lines, which are connected with the plurality of bonding structures in one-to-one correspondence.

19. The display device according to claim 13 , wherein,
each of the bonding structures comprises: a first indium tin oxide layer, a metal layer and a second indium tin oxide layer which are stacked in sequence; and
the metal layer is provided with a plurality of first via holes, the second indium tin oxide layer is provided with a plurality of second via holes, and the first via holes are communicated with the second via holes in one-to-one correspondence.

20. The display device according to claim 19 , wherein,
each of the bonding structures comprises: a first indium tin oxide layer, a metal layer and a second indium tin oxide layer which are stacked in sequence; and
the protruding structures are provided at two sides of the second indium tin oxide layer.

Assignees

• Boe Technology Group Co Ltd
• Chengdu Boe Optoelect Tech Co

Inventors

• Luo Hongqiang
• Wu Jianjun
• Jang Kwanggyun

Classifications

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• H10D84/01

  Manufacture or treatment · CPC title

• H10D86/00 Primary

  Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates · CPC title

• G06F3/04164 Primary

  Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads · CPC title

• G06F3/0446

  using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes · CPC title