Method of manufacturing a multi-material conveyor component
US-10016920-B2 · Jul 10, 2018 · US
Multi-material conveyor component
US10821639B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10821639-B2 |
| Application number | US-201816008445-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 14, 2018 |
| Priority date | Mar 30, 2015 |
| Publication date | Nov 3, 2020 |
| Grant date | Nov 3, 2020 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
A conveyor component comprises a thermoformable portion chemically bonded to an injection molded base portion. A surface of the thermoformable portion is prepared for bonding. Then an injection moldable material is injected onto the prepared surface to form the injection molded base portion.
First claim
Opening claim text (preview).
What is claimed is: 1. A conveyor component, comprising: a base portion formed of an injection moldable material; and an upper layer comprising UHMW polyethylene, wherein the upper layer has a bonding surface chemically bonded to the injection moldable material, and an opposite surface that is substantially smooth and undeformed. 2. The conveyor component of claim 1 , wherein the conveyor component comprises one of a conveyor belt module, a position limiter and a wear strip. 3. The conveyor component of claim 1 , further comprising a magnetic element sandwiched between the thermoformable material and the injection moldable material. 4. The conveyor component of claim 1 , wherein the base portion comprises a snap clamp for mounting the conveyor component to a conveyor frame and the upper layer is a limiting surface for ensuring engagement between a conveyor belt and a drive. 5. A conveyor component comprising: a thermoformed first layer comprising UHMW polyethylene, the thermoformed first layer having a top surface that is substantially smooth and undeformed and an opposite bonding surface; and an injection molded base portion chemically bonded to the bonding surface of the thermoformed first layer. 6. The conveyor component of claim 5 , further comprising a magnetic element sandwiched between the thermoformed first layer and the injection molded base portion. 7. The conveyor component of claim 5 , wherein the injection molded base portion comprises one of polypropylene, polyethylene, and acetal. 8. The conveyor component of claim 5 , wherein the injection molded base portion comprises a composite polymer. 9. A conveyor component, comprising: a base portion formed of an injection moldable material; and an upper layer comprising a ceramic-impregnated plastic chemically bonded to the injection moldable material. 10. The conveyor component of claim 9 , wherein the conveyor component comprises one of a conveyor belt module, a position limiter and a wear strip.
Assignees
Inventors
Classifications
Shaping in several steps · CPC title
HDPE, i.e. high density polyethylene · CPC title
Means for holding or retaining the loads in fixed position on the load-carriers, e.g. magnetic · CPC title
using means for bonding the coating to the articles (B29C45/14795 takes precedence) · CPC title
Chains acting as load-carriers · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10821639B2 cover?
- A conveyor component comprises a thermoformable portion chemically bonded to an injection molded base portion. A surface of the thermoformable portion is prepared for bonding. Then an injection moldable material is injected onto the prepared surface to form the injection molded base portion.
- Who is the assignee on this patent?
- Laitram Llc
- What technology area does this patent fall under?
- Primary CPC classification B29C45/14549. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Nov 03 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).