Polishing pads produced by an additive manufacturing process

Patent metadata

Field	Value
Publication number	US-10821573-B2
Application number	US-201514887240-A
Country	US
Kind code	B2
Filing date	Oct 19, 2015
Priority date	Oct 17, 2014
Publication date	Nov 3, 2020
Grant date	Nov 3, 2020

Abstract

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

First claim

The invention claimed is:

1. A polishing pad having a polishing surface that is configured to polish a surface of a substrate, comprising:
a plurality of polishing elements each having a surface that forms at least a portion of the polishing surface and comprising a first polymer composition; and
a base layer comprising a second polymer composition, wherein:
the first polymer composition is formed from a first droplet formulation comprising one or more first precursor components having a glass transition temperature (Tg) of greater than or equal to 40° C. and one or more second precursor components having a glass transition temperature of less than 40° C.,
an amount of first precursor components in the first droplet formulation is greater than an amount of the one or more second precursor components in the first droplet formulation,
the second polymer composition is formed from a second droplet formulation comprising the one or more first precursor components and the one or more second precursor components,
an amount of the one or more second precursor components in the second droplet formulation is greater than an amount of the one or more first precursor components in the second droplet formulation,
the one or more first precursor components and the one or more second precursor components are selected from the group consisting of monomers, oligomers, and functional polymers,
at least portions of the plurality of polishing elements extend above a surface of the base layer, and
the first polymer composition of the polishing elements is chemically bonded to the second polymer composition of the base layer at boundaries thereof.

2. The polishing pad of claim 1 , wherein the first polymer composition has a storage modulus that is greater than the second polymer composition.

3. The polishing pad of claim 1 , wherein:
the plurality of polishing elements are formed from a plurality of sequentially deposited first layers,
the first polymer composition is formed from first droplets of the first droplet formulation and second droplets of the second droplet formulation,
the first droplets are individually positioned to form a first pattern within each of the sequentially deposited first layers and the second droplets are individually positioned to form a second pattern that at least partially overlaps with the first pattern within each of the sequentially deposited layers, and
a ratio of the first droplets to the second droplets used to form the plurality of sequentially deposited first layers is more than one.

4. The polishing pad of claim 1 , wherein the first polymer composition comprises a polymeric material selected from the group consisting of: polyamides, polyether ketones, polyethers, polyether sulfones, polyetherimides, polyimides, polysiloxanes, polysulfones, polyphenylenes, polyphenylene sulfides, polystyrene, polyacrylonitriles, polymethylmethacrylates, polyurethane acrylates, polyester acrylates, polyether acrylates, epoxy acrylates, melamines, polysulfones, acrylonitrile butadiene styrene (ABS), halogenated polymers, block copolymers and copolymers thereof.

5. The polishing pad of claim 1 , wherein an interface between the plurality of polishing elements and the base layer comprises a concentration gradient that is a mixture of the first polymer composition and the second polymer composition.

6. The polishing pad of claim 3 , wherein:
the base layer is formed from a plurality of sequentially deposited second layers,
the second polymer composition is formed from the first droplets and the second droplets,
the ratio of the first droplets to the second droplets used to form the plurality of sequentially deposited second layers is less than one,
the first droplet formulation comprises one or more functional polymers having a glass transition temperature (Tg) of greater than or equal to about 40° C.

7. The polishing pad of claim 1 , further comprising one or more substrate observation windows, wherein the substrate observation windows are formed through at least a portion of the base layer, wherein a transmittance of the substrate observation window is greater than 35% to electromagnetic radiation within the wavelengths from 280 nm to 800 nm.

8. The polishing pad of claim 1 , wherein each of the plurality of polishing elements have a lateral dimension, which is parallel to the polishing surface, that is between about 250 micrometers and about 3 mm in size.

9. The polishing pad of claim 3 , wherein the first droplet formulation and the second droplet formulation further comprise one or more functional oligomers, wherein the first droplet formulation has a greater amount of the oligomers than the second droplet formulation, and wherein the first droplet formulation comprises oligomers and precursor components having a functionally of greater than or equal to two.

10. The polishing pad of claim 3 , wherein the second droplet formulation comprises precursor components that have a functionality less than or equal to two.

11. A polishing pad having a polishing surface that is configured to polish a surface of a substrate, comprising:
a plurality of polishing elements forming at least a portion of the polishing surface, each of the plurality of polishing elements comprising a first polymer material formed from first droplets of a first resin precursor composition and second droplets of a second resin precursor composition, wherein the first polymer material is formed of a greater amount of precursor components having a glass transition temperature (Tg) of greater than 40° C. than precursor components having a glass transition temperature (Tg) of less than or equal to 40° C.;
a base region disposed between the plurality of polishing elements and a supporting surface of the polishing pad, wherein:
the base region comprises a second polymer material formed from first droplets of the first resin precursor composition and second droplets of the second resin precursor composition,
the second polymer material is formed of a greater amount of precursor components having a glass transition temperature (Tg) of less than or equal to 40° C. than precursor components having a glass transition temperature (Tg) of greater than 40° C., and
the precursor components used to form the first and second polymer materials are selected from the group consisting of monomers, oligomers, and functional polymers; and

a cohesive transition between each of the plurality of polishing elements and the base region, wherein the cohesive transition comprises a compositional gradient from the first polymer material to the second polymer material.

12. The polishing pad of claim 11 , wherein a storage modulus of the first polymer material is greater than a storage modulus of the second polymer material.

13. The polishing pad of claim 11 , wherein first polymer material comprises a polymeric material selected from the group consisting of: polyamides, polyether ketones, polyethers, polyether sulfones, polyetherimides, polyimides, polysiloxanes, polysulfones, polyphenylenes, polyphenylene sulfides, polystyrene, polyacrylonitriles, polymethylmethacrylates, polyurethane acrylates, polyester acrylates, polyether acrylates, epoxy acrylates, melamines, polysulfones, acrylonitrile butadiene styrene (ABS), halogenated polymers, block copolymers and copolymers thereof.

14. The polishing pad of claim 11 , wherein: a ratio of the first droplets to the second droplets in forming the first polymer material is more than 1, and
a ratio of the first droplets to the second droplets in forming the second polymer material is less than one.

15. The polishing pa

Assignees

• Applied Materials Inc

Inventors

• Bajaj Rajeev
• Redfield Daniel
• Orilall Mahendra C
• Fu Boyi
• Khanna Aniruddh
• Fung Jason G
• Cornejo Mario
• Chockalingam Ashwin
• Yamamura Mayu
• Kakireddy Veera Raghava Reddy
• Kumar Ashavani
• Hariharan Venkat
• Menk Gregory E
• Redeker Fred C
• Patibandla Nag B
• Ng Hou T
• Davenport Robert E
• SINHA Amritanshu

Classifications

• B24B37/22 Primary

  characterised by a multi-layered structure · CPC title

• B24D3/28

  Resins {or natural or synthetic macromolecular compounds (B24D3/22 takes precedence)} · CPC title

• B24B37/24

  characterised by the composition or properties of the pad materials · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title