Circuit module

Patent metadata

Field	Value
Publication number	US-10818566-B2
Application number	US-201916454302-A
Country	US
Kind code	B2
Filing date	Jun 27, 2019
Priority date	Dec 28, 2016
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

A circuit module (101) includes a substrate (1) having a principal surface (1a), a first component (6) mounted on the principal surface (1a), and a sealing resin portion (3) that covers at least a side surface of the first component (6) while covering the principal surface (1a). The first component (6) includes an empty portion (6c) and a connection portion (6b) exposed to the empty portion (6c). The sealing resin portion (3) is arranged to avoid at least a part of a region that is included in an upper surface of the first component (6) and corresponds to the empty portion (6c).

First claim

The invention claimed is:

1. A circuit module comprising:
a substrate having a principal surface;
a first component mounted on the principal surface; and
a sealing resin portion covering at least a side surface of the first component while covering the principal surface,
the first component including an empty portion and a connection portion exposed to the empty portion,
the sealing resin portion being not arranged on at least a part of a region included in an upper surface of the first component and overlapping with the empty portion when viewed in a plan view; and
the upper surface of the first component is positioned lower than an upper surface of the sealing resin portion.

2. The circuit module according to claim 1 , wherein
the first component includes a first resin portion at a higher level than the empty portion, the first resin portion comprising a first resin, and
an upper surface of the first resin portion and an upper surface of the sealing resin portion are in an identical plane.

3. The circuit module according to claim 1 , wherein
a second resin portion is arranged over the first component, the second resin portion comprising a second resin having a lower Young's modulus than a material for the sealing resin portion, and an upper surface of the second resin portion and the upper surface of the sealing resin portion are in an identical plane.

4. The circuit module according to claim 1 , wherein
a conductor film is arranged to cover at least a boundary between the upper surface of the first component and the upper surface of the sealing resin portion.

5. The circuit module according to claim 3 , wherein
a conductor film is arranged to cover at least a boundary between the upper surface of the second resin portion and the upper surface of the sealing resin portion.

6. The circuit module according to claim 2 , wherein
a conductor film is arranged to cover at least a boundary between the upper surface of the first component and the upper surface of the sealing resin portion.

Assignees

• Murata Manufacturing Co

Inventors

• Okada Ken
• Sato Kazushige
• Funakawa Shingo
• Fujikawa Katsuhiko
• Amachi Nobumitsu

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title