Boiling cooling device and boiling cooling system

US10816273B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10816273-B2
Application numberUS-201615781568-A
CountryUS
Kind codeB2
Filing dateJan 8, 2016
Priority dateJan 8, 2016
Publication dateOct 27, 2020
Grant dateOct 27, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump 11; and a gas-liquid separator 15 to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump.

First claim

Opening claim text (preview).

The invention claimed is: 1. A boiling cooling device comprising: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump; and a gas-liquid separator to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump, wherein the microbubble generator is a fluid flow type microbubble generator, taking in gas via an intake port by using liquid flow force to produce microbubbles, wherein the gas liquid separator includes an exhaust port to exhaust gas, and wherein gas which is not made from the refrigerant, flows from the intake port to the exhaust port. 2. The boiling cooling device according to claim 1 , wherein the microbubbles are non-condensable gas. 3. The boiling cooling device according to claim 1 , further comprising a connecting pipe to connect a gas inlet port of the microbubble generator and an exhaust port of a gas container containing the gas separated in the gas-liquid separator. 4. The boiling cooling device according to claim 3 , wherein the connecting pipe comprises a valve to adjust a flow rate. 5. A boiling cooling system comprising: a boiling cooling device according to claim 1 ; and a heat producing device to be cooled in thermal contact with the boiling cooler. 6. A boiling cooling system comprising: a boiling cooling device according to claim 2 ; and a heat producing device to be cooled in thermal contact with the boiling cooler. 7. A boiling cooling system comprising: a boiling cooling device according to claim 3 ; and a heat producing device to be cooled in thermal contact with the boiling cooler. 8. A boiling cooling system comprising: a boiling cooling device according to claim 4 ; and a heat producing device to be cooled in thermal contact with the boiling cooler.

Assignees

Inventors

Classifications

  • Fluid driving means, e.g. pumps, fans · CPC title

  • F28D15/00Primary

    Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} · CPC title

  • with means to remove contaminants, e.g. getters · CPC title

  • with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

  • having non-capillary condensate return means · CPC title

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What does patent US10816273B2 cover?
A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing …
Who is the assignee on this patent?
Mitsubishi Electric Corp
What technology area does this patent fall under?
Primary CPC classification F28D15/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Oct 27 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).