Substrate transport apparatus, substrate processing apparatus, and dew condensation suppression method

Patent metadata

Field	Value
Publication number	US-10816259-B2
Application number	US-201715474113-A
Country	US
Kind code	B2
Filing date	Mar 30, 2017
Priority date	Apr 4, 2016
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

A substrate transport apparatus includes a substrate holding unit configured to hold a substrate; a casing; and a drive mechanism at least partially provided within the casing and configured to drive the substrate holding unit using air. The drive mechanism is capable of supplying air into the casing.

First claim

What is claimed is:

1. A substrate transport apparatus comprising:
a casing;
a pair of movable arms that extend from opposite sides of the casing, each movable arm having a support arm fixed to a distal end of each of the movable arms, each support arm extending in a direction orthogonal to each of the movable arms, the support arms configured to hold a substrate;
an air chuck disposed within the casing that includes a first air cylinder attached to one of the pair of movable arms and a second air cylinder attached to an other of the pair of movable arms, the air chuck configured to drive each support arm simultaneously towards and away from each other using air; and
a first pipe and a second pipe configured to supply the air to each of the first air cylinder and the second air cylinder respectively, through the casing,
wherein the second pipe is split within the casing to form a third pipe having an opening positioned in the casing and outside of the air chuck, and the opening is configured to supply air to the casing.

2. The substrate transport apparatus of claim 1 , wherein the first pipe is pressurized when the support arms hold the substrate, and the second pipe is pressurized when the support arms do not hold the substrate, and
wherein the air is supplied from the opening of the second pipe into the casing when the second pipe is pressurized.

3. The substrate transport apparatus of claim 1 , further comprising:
an orifice provided in the third pipe.

4. The substrate transport apparatus of claim 1 , further comprising:
a filter provided in the third pipe,
wherein the air is supplied into the casing through the filter.

5. The substrate transport apparatus of claim 1 , wherein the second pipe is configured to supply the air into the casing through the opening when the pair of arms do not hold the substrate.

6. The substrate transport apparatus of claim 1 , wherein the air chuck further includes a housing,
wherein the first pipe is split within the housing and has a first distal end attached to the first cylinder and a second distal end attached to the second cylinder, and
wherein the second pipe is split within the housing and has a third distal end attached to the first cylinder and a fourth distal end attached to the second cylinder.

7. A substrate processing apparatus comprising:
a polisher that polishes a substrate;
a cleaner that cleans the substrate;
a dryer that dries the substrate; and
a substrate transporter configured to transport a substrate among the polisher, the cleaner, and the dryer, the substrate transport transporter including:
a casing;
a pair of movable arms that extend from opposite sides of the casing, each movable arm having a support arm fixed to a distal end of each of the movable arms, each support arm extending in a direction orthogonal to each of the movable arms, the support arms being configured to hold a substrate;
an air chuck disposed within the casing that includes a first air cylinder attached to one of the pair of movable arms and a second air cylinder attached to an other of the pair of movable arms, the air chuck configured to drive each support arm simultaneously towards and away from each other using air; and
a first pipe and a second pipe configured to supply the air to each of the first air cylinder and the second air cylinder respectively, through the casing,
wherein the second pipe is split within the casing to form a third pipe having an opening positioned in the casing and outside of the air chuck, the opening configured to supply air to the casing.

8. A method of suppressing an occurrence of dew condensation in a substrate transport apparatus, the method comprising:
providing the substrate transport apparatus including a casing, a pair of arms that extend from opposite sides of the casing, the pair of arms being configured to hold a substrate, and an air chuck disposed within the casing that includes a pair of air cylinders attached to the pair of arms and configured to drive the pair of arms using air;
supplying air for driving the pair of cylinders via a pair of pipes configured to supply air to the pair to the cylinders; and
supplying the air to the casing of the substrate transport apparatus via an opening on a third pipe split from one of the pair of pipes when the substrate is not held, the opening being positioned in the casing and outside the air chuck.

Assignees

• Ebara Corp

Inventors

• Suzuki Kenichi
• Kosuge Ryuichi
• Saito Kenichiro

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3402 Primary

  Mechanical parts of transfer devices · CPC title

• H10P72/3302 Primary

  Mechanical parts of transfer devices · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title