Compositions comprising ethylene-carbon monoxide copolymers

US10815375B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10815375-B2
Application numberUS-201716096847-A
CountryUS
Kind codeB2
Filing dateApr 19, 2017
Priority dateApr 29, 2016
Publication dateOct 27, 2020
Grant dateOct 27, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The invention provides a composition comprising an ethylene-based polymer and wherein the ethylene-based polymer has the following properties: (A) a CO content from greater than 0 to less than 10 weight percent CO (carbon monoxide), based on the weight of the polymer, and (B) a melt index (I2) from 0.1 to less than 3 g/10 min; and (C) a density from 0.923 to 0.928 g/cc; and wherein the ethylene-based polymer has a melting point, Tm, in ° C., that meets the following relationship: Tm (° C.)<601.4*(Density N in g/cc)−447.8° C.

First claim

Opening claim text (preview).

What is claimed is: 1. A composition comprising an ethylene-based polymer consisting of ethylene, carbon monoxide, and propylene, wherein the ethylene-based polymer has the following properties: (A) a CO content from 0.2 to 0.9 weight percent CO (carbon monoxide), based on the weight of the polymer; and (B) a melt index (I 2 ) from 0.3 to 1.0 g/10 min; and (C) a density from 0.923 to 0.928 g/cc; and (D) a 2% secant modulus (measured on a compression molded plaque) in the range of 27,000 to 34,000 psi; and (F) C1 branching; and wherein the ethylene-based polymer has a melting point, Tm, in ° C., that meets the following relationship: Tm (° C.)<601.4*(Density in g/cc) 447.8° C. 2. The composition of claim 1 , wherein the ethylene-based polymer has a MWD(conv) from 4.0 to 10.0. 3. The composition of claim 1 , wherein the ethylene-based polymer is formed from a high pressure, free-radical polymerization. 4. The composition of claim 1 , wherein the ethylene-based polymer has a melting point, Tm, in ° C., that meets the following relationship: Tm (° C.)<601.4*(Density in g/cc)−448.5 (0C). 5. The composition of claim 1 , wherein the ethylene-based polymer has a melt strength(190°) less than, or equal to, 17.0 cN. 6. The composition of claim 1 , wherein the ethylene-based polymer has an amyl group level greater than, or equal to, 0.5 amyl group per 1000 carbon atoms, as determined by 13C NMR. 7. The composition of claim 1 , wherein the ethylene-based polymer has a melt strength of at least 10.0 cN. 8. An article comprising at least one component formed from the composition of claim 1 . 9. The article of claim 8 in the form of a film or sheet. 10. The composition of claim 1 , wherein the ethylene-based polymer has a melting temperature from 105° C. to 110° C.

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Classifications

  • Adhesives based on macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C09J159/00 - C09J171/00; Adhesives based on derivatives of such polymers · CPC title

  • Coating compositions based on macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C09D159/00 - C09D171/00; Coating compositions based on derivatives of such polymers · CPC title

  • with non-conjugated dienes, e.g. EPT rubbers · CPC title

  • Copolymers of carbon monoxide and aliphatic unsaturated compounds · CPC title

  • Copolymers of ethene (C09D123/16 takes precedence) · CPC title

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What does patent US10815375B2 cover?
The invention provides a composition comprising an ethylene-based polymer and wherein the ethylene-based polymer has the following properties: (A) a CO content from greater than 0 to less than 10 weight percent CO (carbon monoxide), based on the weight of the polymer, and (B) a melt index (I2) from 0.1 to less than 3 g/10 min; and (C) a density from 0.923 to 0.928 g/cc; and wherein the ethylene…
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification C08L73/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 27 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).