Polyacetal resin composition and molded product thereof

Patent metadata

Field	Value
Publication number	US-10815371-B2
Application number	US-201716087901-A
Country	US
Kind code	B2
Filing date	Mar 28, 2017
Priority date	Mar 30, 2016
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

A polyacetal resin composition and a molded product thereof are provided which are excellent in thermal stability, little elution of components of the resin composition upon brought into contact with fuel, and good releasability from the mold at the time of molding, and which is excellent in the points of thermal stability, fuel oil resistance and mold releasability. Provided is a polyacetal resin composition which includes (A) a polyacetal resin and (B) a mold release agent, (B) the mold release agent is a polyolefin-based wax and/or a polytetrafluoroethylene-based wax, and a content of (B) the mold release agent in the polyacetal resin composition is 0.01 part by mass or more and 1.0 part by mass or less based on 100 parts by mass of (A) the polyacetal resin.

First claim

The invention claimed is:

1. A polyacetal resin composition which comprises (A) a polyacetal resin, (B) a mold release agent, and (C) an antioxidant, wherein (B) the mold release agent is a polyolefin-based wax and/or a polytetrafluoroethylene-based wax, a content of (B) the mold release agent in the polyacetal resin composition is 0.01 part by mass or more and 1.0 part by mass or less based on 100 parts by mass of (A) the polyacetal resin, and (C) the antioxidant is selected from the group consisting of pentaerythritol-tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, and mixtures thereof.

2. The polyacetal resin composition according to claim 1 , wherein (B) the mold release agent is a polyethylene-based wax and/or a polytetrafluoroethylene-based wax.

3. The polyacetal resin composition according to claim 2 , wherein (B) the mold release agent is a polyethylene-based wax, and a viscosity average molecular weight of the polyethylene-based wax is 500 to 15,000.

4. The polyacetal resin composition according to claim 1 , wherein a content of (B) the mold release agent in the polyacetal resin composition is 0.04 part by mass or more and 0.15 part by mass or less based on 100 parts by mass of (A) the polyacetal resin.

5. The polyacetal resin composition according to claim 1 , wherein the (C) antioxidant is present in a content of 0.01 part by mass or more and 3.0 parts by mass or less based on 100 parts by mass of (A) the polyacetal resin.

6. The polyacetal resin composition according to claim 5 , wherein the content of (C) the antioxidant in the polyacetal resin composition is 0.03 part by mass or more and 0.15 part by mass or less based on 100 parts by mass of (A) the polyacetal resin.

7. A molded product obtained by molding the polyacetal resin composition according to any one of claims 1 to 5 or 6 .

8. The polyacetal resin composition according to any one of claims 1 to 5 or 6 which is used for a part brought into contact with fuel.

9. The molded product according to claim 7 , which is a part brought into contact with fuel.

10. The molded product according to claim 9 , wherein the fuel is one kind or two or more kinds selected from the group consisting of gasoline fuel, gasohol fuel, diesel fuel and biofuel.

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Hirooka Masato
• Sunaga Daisuke

Classifications

• C08K5/01 Primary

  Hydrocarbons {(C08K5/0091 takes precedence)} · CPC title

• C08L23/00

  Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers · CPC title

• C08L59/00

  Compositions of polyacetals; Compositions of derivatives of polyacetals (of polyvinyl acetals C08L29/14) · CPC title

• C08L5/00

  Compositions of polysaccharides or of their derivatives not provided for in groups C08L1/00 or C08L3/00 · CPC title

• C08L59/02 Primary

  Polyacetals containing polyoxymethylene sequences only · CPC title