Control of particle layer depth and thickness during powder printing

US10814649B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10814649-B2
Application numberUS-201816210656-A
CountryUS
Kind codeB2
Filing dateDec 5, 2018
Priority dateDec 5, 2018
Publication dateOct 27, 2020
Grant dateOct 27, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A printing system includes a liquid ejector configured to deposit a curable layer on a surface of a substrate, the layer having a free surface and an interface between the layer and the substrate. A pre-curing device pre-cures the layer such that a first region closer to the free surface is less cured than a second region closer to the interface. The curing device includes a pre-curing initiator source configured to provide a pre-curing initiator that polymerizes the layer. The curing device also includes a pre-curing inhibitor source configured to deliver an inhibitor that inhibits polymerization of the layer. A particle delivery device delivers particles to the layer after the layer is pre-cured.

First claim

Opening claim text (preview).

What is claimed is: 1. A printing system comprising: a liquid ejector configured to deposit a curable layer on a surface of a substrate, the layer having a free surface and an interface between the layer and the substrate; a pre-curing device configured to pre-cure the layer such that a first region closer to the free surface is less cured than a second region closer to the interface, the pre-curing device comprising: a pre-curing initiator source configured to provide a pre-curing initiator that polymerizes the layer; and a pre-curing inhibitor source configured to deliver an inhibitor that inhibits polymerization of the layer; a particle delivery device configured to deliver particles to the layer after the layer is pre-cured. 2. The system of claim 1 , wherein: the pre-curing initiator source comprises an ultraviolet (UV) radiation source configured to generate UV radiation; and further comprising a controller configured to control an intensity of the UV radiation. 3. The system of claim 1 , wherein: the pre-curing inhibitor source comprises an oxygen source configured to deliver oxygen; and further comprising a controller configured to control a concentration of oxygen. 4. The system of claim 1 , further comprising a curing device configured to substantially cure the first region of the layer after the particles have been delivered to the free surface of the layer. 5. The system of claim 1 , further comprising one or both of a heat source and a heated roller configured to heat the free surface of the layer after the particles have been delivered. 6. The system of claim 1 , wherein the pre-curing device is configured to provide a spatial pattern of the pre-curing initiator that extends along one or both of a lateral axis and a longitudinal axis of the layer, wherein the spatial pattern of the pre-curing initiator provides one or more first areas with a first amount of the pre-curing initiator and provides one or more second areas with a different second amount of the pre-curing initiator. 7. The system of claim 6 , wherein: the pre-curing initiator source comprises an array of UV radiation sources and the pre-curing initiator comprises UV radiation; and further comprising a controller configured to independently modulate an intensity of each of the UV radiation sources to provide the spatial pattern of the UV radiation. 8. The system of claim 6 , wherein the pre-curing device comprises: at least one UV radiation source configured to provide the pre-curing initiator comprising UV radiation; and a spatial patterning device optically coupled to the at least one UV radiation source, the at least one UV radiation source and the spatial patterning device configured to provide a spatial pattern of UV radiation. 9. The system of claim 1 , further comprising a pre-curing initiator patterning device configured to produce a gradient of the pre-curing initiator with respect to one or both of a lateral axis and a longitudinal axis of the free surface. 10. The system of claim 9 , wherein the spatial patterning device is a moveable shutter. 11. The system of claim 1 , further comprising a pre-curing inhibitor patterning device configured to provide a spatial pattern of a pre-curing inhibitor provided by the pre-curing inhibitor patterning device. 12. A method, comprising: depositing a curable layer on a surface of a substrate, the layer having a free surface and an interface between the layer and the substrate; pre-curing the layer such that a first region closer to the interface of the layer is more cured than a second region closer to the free surface of the layer and that the first region is located a predetermined distance from the free surface; and delivering particles to the free surface of the layer after pre-curing the layer such that a depth of the particles is limited by the predetermined distance from the free surface. 13. The method of claim 12 , further comprising curing the layer after the particles have been delivered to the free surface. 14. The method of claim 12 , wherein pre-curing the layer comprises directing a pre-curing gas toward the free surface in the presence of a pre-curing inhibitor. 15. The method of claim 14 , further comprising controlling pre-curing of the layer comprising controlling one or more of an intensity of the UV radiation, a concentration of the oxygen, and a temperature of the layer such that the first region is located a predetermined distance from the free surface. 16. The method of claim 12 , wherein pre-curing the layer comprises directing UV radiation toward the free surface in the presence of oxygen. 17. The method of claim 12 , wherein pre-curing the layer comprises at least one of: generating a spatial pattern of a pre-curing initiator, the spatial pattern configured to pattern the second region along at least one of a lateral axis and a longitudinal axis of the layer; and generating a gradient of the pre-curing initiator with respect to one or both of a lateral axis and a longitudinal axis of the free surface. 18. The method of claim 17 , further comprising at least one of: controlling a thickness of a band of the particles in the layer; reorienting the particles after delivering the particles to the free surface of the layer; and modifying a surface roughness of the free surface after delivering the particles to the free surface of the layer. 19. The method of claim 12 , wherein pre-curing the layer and delivering the particles to the free surface comprise controlling the depth of the particles in the layer. 20. The method of claim 12 , wherein: delivering the particles to the free surface of the layer after pre-curing the layer comprises a delivering a second type of particles; and further comprising delivering a first type of particles to the free surface of the layer before pre-curing the layer.

Assignees

Inventors

Classifications

  • B41J2/2117Primary

    Ejecting white liquids · CPC title

  • B33Y30/00Primary

    Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Inkjet printing inks · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • Heating elements · CPC title

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What does patent US10814649B2 cover?
A printing system includes a liquid ejector configured to deposit a curable layer on a surface of a substrate, the layer having a free surface and an interface between the layer and the substrate. A pre-curing device pre-cures the layer such that a first region closer to the free surface is less cured than a second region closer to the interface. The curing device includes a pre-curing initiato…
Who is the assignee on this patent?
Palo Alto Res Ct Inc
What technology area does this patent fall under?
Primary CPC classification B41J2/2117. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 27 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).