Power couplers and related devices having antenna element power absorbers

Patent metadata

Field	Value
Publication number	US-10811754-B2
Application number	US-201816157679-A
Country	US
Kind code	B2
Filing date	Oct 11, 2018
Priority date	Oct 13, 2017
Publication date	Oct 20, 2020
Grant date	Oct 20, 2020

Abstract

A power coupler includes an input port, first and second output ports and an antenna element that is electrically coupled between the first output port and the second output port or that is electrically coupled to an isolation port of the power coupler. The power coupler is configured to split a radio frequency signal incident at the input port and/or to combine radio signals incident at the respective first and second output ports.

First claim

What is claimed is:

1. A power coupler, comprising:
an input port;
a first output port;
a second output port;
an isolation port;
an antenna element that is electrically coupled to the isolation port;
wherein the power coupler is configured to split a radio frequency (“RF”) signal incident at the input port and/or to combine radio signals incident at the respective first and second output ports.

2. The power coupler of claim 1 , wherein the antenna element comprises a patch radiating element.

3. The power coupler of claim 1 , in combination with first and second filters that are coupled to the respective first and second output ports and a second power coupler that is coupled to the first and second filters opposite the power coupler, the combination of the power coupler, the second power coupler and the first and second filters comprising a balanced filter.

4. The power coupler of claim 1 , in combination with first and second amplifiers that are coupled to the respective first and second output ports and a second power coupler that is coupled to the first and second amplifiers opposite the power coupler, the combination of the power coupler, the second power coupler and the first and second amplifiers comprising a balanced amplifier.

5. The power coupler of claim 1 , wherein the power coupler is implemented in a printed circuit board that includes a dielectric substrate, a conductive ground plane on a first surface of the dielectric substrate and a conductive pattern on a second surface of the dielectric substrate that is opposite the first surface.

6. The power coupler of claim 5 , wherein at least a portion of the power coupler is implemented as a substrate integrated waveguide power coupler that includes an array of plated through holes that connect the conductive ground plane to the conductive pattern.

7. The power coupler of claim 5 , wherein at least a portion of the power coupler is implemented as a coplanar waveguide that includes an array of plated vias that connect the conductive ground plane to first and second ground portions of the conductive pattern, the conductive pattern further including a conductive track that is separated from the first and second ground portions by respective first and second gaps.

8. The power coupler of claim 5 , wherein the antenna element is a patch radiating element that includes a patch radiator that is part of the conductive pattern, and wherein the patch radiator has an inset feed.

9. The power coupler of claim 1 , wherein the antenna element is configured to function as a power absorber for RF signals in an operating frequency band of the power coupler.

10. A printed circuit board structure, comprising:
a dielectric substrate having a first surface and a second surface opposite the first surface;
a conductive ground plane on the first surface of the dielectric substrate; and
a conductive pattern on the second surface of the dielectric substrate, the conductive pattern including an antenna element,
wherein a power coupler that includes an input port, a first output port and a second output port is integrated within the printed circuit board structure,
wherein the antenna element is electrically coupled to an isolation port of the power coupler.

11. The printed circuit board structure of claim 10 , wherein the patch radiating element includes a patch radiator that is part of the conductive pattern, and wherein the patch radiator has an inset feed.

12. The printed circuit board structure of claim 10 , wherein the power coupler comprises a four port power coupler that includes the isolation port.

13. The printed circuit board structure of claim 10 , wherein at least a portion of the power coupler is implemented as a substrate integrated waveguide that includes an array of plated through holes that connect the conductive ground plane to the conductive pattern.

14. The printed circuit board structure of claim 10 , wherein at least a portion of the power coupler is implemented as a co-planar waveguide that includes an array of plated vias that connect the conductive ground plane to first and second ground portions of the conductive pattern, the conductive pattern further including a conductive track that is separated from the first and second ground portions by respective first and second gaps.

15. A substrate integrated waveguide power coupler, comprising:
an input port;
a first output port;
a second output port;
an isolation port;
a coupling region that is between the input port and the first and second output ports and that is between the isolation port and the first and second output ports; and
an antenna element that is electrically coupled to the isolation port opposite the first and second output ports;
wherein the power coupler is configured to split a radio frequency (“RF”) signal incident at the input port and/or to combine radio signals incident at the respective first and second output ports.

16. The substrate integrated waveguide power coupler of claim 15 , wherein the antenna element comprises a patch radiating element.

17. The substrate integrated waveguide power coupler of claim 15 , wherein the power coupler is implemented in a printed circuit board that includes a dielectric substrate, a conductive ground plane on a first surface of the dielectric substrate and a conductive pattern on a second surface of the dielectric substrate that is opposite the first surface, and first and second rows of plated holes that connect the conductive ground plane to the conductive pattern, the first and second rows of plated holes lining respective first and second sides of the coupling region.

18. A power coupler, comprising:
an input port;
a first output port;
a second output port;
a first coupling transmission line coupled between the input port and the first output port;
a second coupling transmission line coupled between the input port and the second output port; and
an antenna element having a first port that is electrically coupled to the first coupling transmission line and a second port that is electrically coupled to the second coupling transmission line;
wherein the power coupler is configured to split a radio frequency (“RF”) signal incident at the input port and/or to combine radio signals incident at the respective first and second output ports.

19. The power coupler of claim 18 , wherein impedances of the first and second coupling transmission lines are higher than impedances of the first and second output ports.

20. The power coupler of claim 18 , wherein the power coupler comprises a Wilkinson power divider.

Assignees

• Commscope Technologies Llc

Inventors

• Wang Huan
• Brobston Michael

Classifications

• H01P5/182 Primary

  the waveguides being arranged in parallel · CPC title

• H01P5/20

  Magic-T junctions · CPC title

• H01P3/121

  integrated in a substrate · CPC title

• H01P5/184 Primary

  the guides being strip lines or microstrips · CPC title

• H01P1/2133

  using coaxial filters (H01P1/2131, H01P1/2136 take precedence) · CPC title