Semiconductor device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10811371-B2
Application number	US-201816218352-A
Country	US
Kind code	B2
Filing date	Dec 12, 2018
Priority date	Jan 14, 2016
Publication date	Oct 20, 2020
Grant date	Oct 20, 2020

Abstract

A semiconductor device includes: a semiconductor substrate; a semiconductor layer on the semiconductor substrate; a source electrode and a drain electrode spaced apart from each other on the semiconductor layer; a gate electrode on the semiconductor layer between the source electrode and the drain electrode; and an insulating film covering the semiconductor layer, the source electrode, the drain electrode and the gate electrode, the gate electrode has an eaves structure including a lower electrode joined to the semiconductor layer and an upper electrode provided on the lower electrode and wider than the lower electrode, a principal ingredient of the insulating film is an oxide film where atomic layers are alternately arrayed for each monolayer, and a film thickness of the insulating film that covers the lower electrode of the gate electrode is equal to a film thickness of the insulating film that covers the upper electrode.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a semiconductor chip;
a package in which the semiconductor chip is mounted; and
an insulating film covering all exposed portions of the package,
wherein a principal ingredient of the insulating film is an oxide film where atomic layers are alternately arrayed for each monolayer, and
the principal ingredient of the insulating film is a layered structure of a Ta oxide film and a Si oxide film.

Assignees

• Mitsubishi Electric Corp

Inventors

• Ando Naoto

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W44/251

  for monolithic microwave integrated circuits [MMIC] · CPC title

• H10W74/137

  the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence) · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/016

  using moulds · CPC title