Phenol novolak resin, curable resin composition, and cured product thereof

Patent metadata

Field	Value
Publication number	US-10808085-B2
Application number	US-201716312588-A
Country	US
Kind code	B2
Filing date	Jun 15, 2017
Priority date	Jun 29, 2016
Publication date	Oct 20, 2020
Grant date	Oct 20, 2020

Abstract

A phenol novolak resin having an excellent balance between the mold shrinkage of a composition containing the phenol novolak resin during heat curing and the modulus of elasticity at high temperature. A phenol novolak resin that is an alkyl phenol novolak resin produced by bonding alkyl phenol (I), in which an alkyl group having a carbon number of 4 to 8 is included as a substituent on an aromatic ring, to each other with a methylene group interposed therebetween, wherein the ratio (a)/(b) of a value (a) of integration from 146 to 148 ppm to a value (b) of integration from 146 to 153 ppm based on the 13C-NMR measurement is within the range of 0.05 to 0.30, and the area ratio of alkyl phenol (I) based on GPC measurement is within the range of 0.01% to 3.0%, a curable resin composition using the same, and a cured product thereof.

First claim

The invention claimed is:

1. A phenol novolak resin that is an alkyl phenol novolak resin produced by bonding alkyl phenol (I), in which an alkyl group having a carbon number of 4 to 8 is included as a substituent on an aromatic ring, to each other with a methylene group interposed therebetween, the number of the alkyl group having 4 to 8 carbon atoms in the alkylphenol (I) is 1 to 3, the substitution position of the alkyl group is the ortho position or the para position of the hydroxyl group, and a number of aromatic units ranging from 1 to 6,
wherein the ratio (a)/(b) of a value (a) of integration from 146 to 148 ppm to a value (b) of integration from 146 to 153 ppm based on the 13 C-NMR measurement is within the range of 0.05 to 0.30, and
the area ratio of alkyl phenol (I) based on GPC measurement is within the range of 0.01% to 3.0%.

2. The phenol novolak resin according to claim 1 , wherein the ICI viscosity of the phenol novolak resin at 150° C. is 0.01 to 3.0 dPa·s.

3. The phenol novolak resin according to claim 1 , wherein the area ratio of the alkyl phenol (I) based on GPC measurement of the phenol novolak resin is within the range of 0.4% to 3.0%.

4. The phenol novolak resin according to claim 1 , an average number of hydroxyl groups in each molecular chain in the phenol novolak resin is in the range of 1.01 to 3.

5. A curable resin composition comprising, the phenol novolak resin according to claim 1 and a resin having a functional group that reacts with a hydroxy group.

6. The curable resin composition according to claim 5 , wherein the resin having a functional group that reacts with a hydroxy group is an epoxy resin.

7. The curable resin composition according to claim 6 , further comprising an epoxy resin curing agent other than the phenol novolak resin.

8. A cured product of the curable resin composition according to claim 5 .

9. A semiconductor sealing material comprising the curable resin composition according to claim 5 and an inorganic filler.

10. A semiconductor device that is a cured product of the semiconductor sealing material according to claim 9 .

11. A prepreg that is a semi-cured product of an impregnation base material including the curable resin composition according to claim 5 and a reinforcing base material.

12. A circuit board comprising a tabularly shaped product of the curable resin composition according to claim 5 and copper foil.

13. A build-up film comprising a cured product of the curable resin composition according to claim 5 and a base material film.

14. A fiber-reinforced composite material comprising the curable resin composition according to claim 5 and reinforcing fiber.

15. A fiber-reinforced molded article that is a cured product of the fiber-reinforced composite material according to claim 14 .

16. The phenol novolak resin according to claim 1 , wherein alkyl phenol (I) is t-butylphenol and/or di-t-butylphenol.

17. The phenol novolak resin according to claim 16 , wherein the ICI viscosity of the phenol novolak resin at 150° C. is 0.01 to 3.0 dPa·s.

18. The phenol novolak resin according to claim 16 , wherein the area ratio of the alkyl phenol (I) based on GPC measurement of the phenol novolak resin is within the range of 0.4% to 3.0%.

19. The phenol novolak resin according to claim 16 , an average number of hydroxyl groups in each molecular chain in the phenol novolak resin is in the range of 1.01 to 3.

20. A curable resin composition comprising, the phenol novolak resin according to claim 16 and a resin having a functional group that reacts with a hydroxy group.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Hirota Yousuke
• Tanii Shota

Classifications

• H10W74/40

  characterised by their materials · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W70/695

  Organic materials · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• C08J5/24

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title