Optoelectronic assembly and method for producing an optoelectronic assembly
US-2017317310-A1 · Nov 2, 2017 · US
US10804497B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10804497-B2 |
| Application number | US-201716087306-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 20, 2017 |
| Priority date | Mar 21, 2016 |
| Publication date | Oct 13, 2020 |
| Grant date | Oct 13, 2020 |
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An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit a radiation during operation of the component, and a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, and a difference in the refractive indices of the structured layer and the planarization layer is smaller than 0.3 at least in places.
Opening claim text (preview).
The invention claimed is: 1. An organic optoelectronic component comprising an organic functional layer stack between a first electrode and a second electrode comprising a light-emitting layer formed to emit a radiation during operation of the component, a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer, and a protective layer above the coupling-out layer, wherein the coupling-out layer comprises a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, a difference in the refractive indices of the structured layer and the planarization layer is smaller than 0.3 at least in places, the protective layer is irreversibly bonded to the planarization layer, and adhesion of the structured layer to the planarization layer is smaller than the adhesion of the protective layer to the planarization layer. 2. The organic optoelectronic component according to claim 1 , wherein the refractive index of the structured layer and the refractive index of the planarization layer is the same at least in places. 3. The organic optoelectronic component according to claim 1 , wherein the structured layer has structures not visible at least in places for a viewer from outside the organic optoelectronic component. 4. The organic optoelectronic component according to claim 1 , further comprising a protective layer above the coupling-out layer, wherein the protective layer is irreversibly bonded to the planarization layer. 5. The organic optoelectronic component according to claim 1 , wherein adhesion of the structured layer to the planarization layer is smaller than the adhesion of the protective layer to the planarization layer. 6. The organic optoelectronic component according to claim 1 , wherein the structured layer has structures sized in the range of 1 nm to 100 m. 7. The organic optoelectronic component according to claim 1 , wherein the structuring is periodic or non-periodic. 8. The organic optoelectronic component according to claim 1 , wherein the planarization layer comprises a polymer or consists of a polymer and the polymer is selected from the group consisting of polyimides, polyacrylates, epoxy resins and silicones. 9. The organic optoelectronic component according to claim 1 , wherein the difference between the refractive indices of the structured layer and the planarization layer is equal to 0 . 1 or greater than 0 . 1 in places. 10. The organic optoelectronic component according to claim 1 , wherein the difference between the refractive indices of the structured layer and the planarization layer is equal to 0.1 or greater than 0.1 in places so that the structures at these points are visible to a viewer from outside the organic optoelectronic component. 11. The organic optoelectronic component according to claim 1 , wherein the planarization layer comprises nanoparticles of a metal oxide at least in places. 12. The organic optoelectronic component according to claim 1 , wherein the structured layer is a substrate, a scattering layer or an encapsulation layer. 13. The organic optoelectronic component according to claim 1 , wherein the structured layer comprises glass or consists of glass. 14. The organic optoelectronic component according to claim 1 , wherein a self-organizing monolayer is arranged between the structured layer and the planarization layer. 15. The organic optoelectronic component according to claim 14 , wherein the self-organizing monolayer is formed from thiols, silanes, silanols or phosphonates.
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