Flexible device on which pattern of 2-dimensional material is formed and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10804102-B2
Application number	US-201916274375-A
Country	US
Kind code	B2
Filing date	Feb 13, 2019
Priority date	Apr 19, 2018
Publication date	Oct 13, 2020
Grant date	Oct 13, 2020

Abstract

The present disclosure provides a method for manufacturing a flexible device having a pattern of a two-dimensional material formed thereon includes: a step of forming a two-dimensional material layer on a substrate; a step of forming a pattern of the two-dimensional material; a step of coating a flexible substrate solution on the patterned two-dimensional material layer and curing the same; and a step of removing the substrate.

First claim

What is claimed is:

1. A method for manufacturing a flexible device having a pattern of a two-dimensional material formed thereon, comprising:
a step of forming a two-dimensional material layer on a substrate;
a step of forming a pattern of the two-dimensional material;
a step of coating a flexible substrate solution on the patterned two-dimensional material layer and curing the same; and
a step of removing the substrate,
wherein the flexible substrate solution is one selected from a group consisting of polyimide (PI), acryl, polycarbonate, polyvinyl alcohol, polyacrylate, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polynorbornene and polyethersulfone (PES).

2. The method for manufacturing a flexible device of claim 1 , wherein the step of forming the pattern of the two-dimensional material comprises a step of forming a micro-pattern or a nano-pattern of the two-dimensional material through a photolithography or e-beam lithography process.

3. The method for manufacturing a flexible device of claim 1 , wherein the substrate is a metal substrate made of a transition metal.

4. The method for manufacturing a flexible device of claim 3 , wherein the substrate is a metal substrate made of copper or nickel.

5. The method for manufacturing a flexible device of claim 4 , wherein the step of removing the substrate comprises a step of removing the metal substrate comprising copper or nickel with ammonium persulfate, an aqueous FeCl 3 solution or a strong acid.

6. The method for manufacturing a flexible device of claim 1 , further comprising a thermal lamination step after the formation of the flexible substrate.

7. The method for manufacturing a flexible device of claim 1 , wherein the two-dimensional material comprises graphene or a transition metal dichalcogenide (TMD).

8. A method for manufacturing a flexible device having a pattern of a two-dimensional material formed thereon, comprising:
forming a two-dimensional material layer on a substrate;
patterning the two-dimensional material in a desired shape;
coating a flexible substrate solution on the patterned two-dimensional material layer; and
removing the substrate,
wherein the flexible substrate solution is one selected from a group consisting of polyimide (PI), acryl, polycarbonate, polyvinyl alcohol, polyacrylate, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polynorbornene and polyethersulfone (PES).

9. The method for manufacturing a flexible device of claim 8 , wherein the step of patterning comprises a step of forming a micro-pattern or a nano-pattern of the two-dimensional material through a photolithography or e-beam lithography process.

10. The method for manufacturing a flexible device of claim 8 , wherein the substrate is a metal substrate made of a transition metal.

11. The method for manufacturing a flexible device of claim 10 , wherein the substrate is a metal substrate made of copper or nickel.

12. The method for manufacturing a flexible device of claim 11 , wherein the step of removing comprises a step of removing the metal substrate comprising copper or nickel with ammonium persulfate, an aqueous FeCl 3 solution or a strong acid.

13. The method for manufacturing a flexible device of claim 8 , further comprising thermal laminating after the formation of the flexible substrate.

14. The method for manufacturing a flexible device of claim 8 , wherein the two-dimensional material comprises graphene or a transition metal dichalcogenide (TMD).

Assignees

• Seoul Nat Univ R&Db Foundation

Inventors

• Jang Ho Won
• Kim Yeonhoo
• Hong Byung Hee

Classifications

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H10P14/3436

  being chalcogenide semiconductor materials not being oxides, e.g. ternary compounds · CPC title

• H10P14/2923

  being conductive materials, e.g. metallic silicides · CPC title

• H10P14/3406 Primary

  Carbon, e.g. diamond-like carbon · CPC title

• H10P14/3402

  characterised by the chemical composition · CPC title