Conformal coating composition containing metal nanoparticles to prevent sulfur related corrosion
US-2015197642-A1 · Jul 16, 2015 · US
US10800930B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10800930-B2 |
| Application number | US-201514871870-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 30, 2015 |
| Priority date | Jan 16, 2014 |
| Publication date | Oct 13, 2020 |
| Grant date | Oct 13, 2020 |
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A conformal coating composition for protecting a metal surface from sulfur related corrosion includes a polymer and metal nanoparticles blended with the polymer. In accordance with some embodiments of the present invention, an apparatus includes an electronic component mounted on a substrate, metal conductors electronically connecting the electronic component, and a polymer conformal coating containing metal nanoparticles overlying the metal conductors. Accordingly, the metal nanoparticle-containing conformal coating is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air. That is, the metal nanoparticles in the conformal coating react with any corrosion inducing sulfur component in the air and prevent the sulfur component from reacting with the underlying metal conductors.
Opening claim text (preview).
What is claimed is: 1. An apparatus, comprising: a substrate; an electronic component mounted on the substrate; metal conductors electrically connecting the electronic component; and a conformal coating overlying the metal conductors and the substrate, wherein the conformal coating comprises a polymer and metal nanoparticles blended with the polymer, wherein the metal nanoparticles have an average diameter within a range of 5 nm to 200 nm, and wherein the concentration of the metal nanoparticles in the conformal coating is approximately 5 wt % of the conformal coating and provides a level of electrical conduction sufficiently below the electric conducting percolation threshold to avoid shorting of the electronic component and the substrate. 2. An apparatus, comprising: a substrate; an electronic component mounted on the substrate; metal conductors electrically connecting the electronic component; and a conformal coating overlying the metal conductors and the substrate, wherein the conformal coating comprises a polymer and copper nanoparticles blended with the polymer, wherein the copper nanoparticles have an average diameter of approximately 100 nm, and wherein the copper nanoparticles comprise approximately 5 wt % of the conformal coating.
Copper · CPC title
Particle size smaller than 100 nm · CPC title
for encapsulating mounted components (H05K1/185 takes precedence) · CPC title
Polysiloxanes · CPC title
Other methods of preventing corrosion or incrustation · CPC title
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