Resin powder for solid freeform fabrication and device for solid freeform fabrication object

Patent metadata

Field	Value
Publication number	US-10800096-B2
Application number	US-201815919251-A
Country	US
Kind code	B2
Filing date	Mar 13, 2018
Priority date	Mar 17, 2017
Publication date	Oct 13, 2020
Grant date	Oct 13, 2020

Abstract

A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

First claim

What is claimed is:

1. A resin powder for solid freeform fabrication, comprising:
resin particles having a significantly pillar-like form, including resin particles having a concave portion on a circumferential side surface,
wherein the resin powder has a repose angle of 55 degrees or less.

2. The resin powder according to claim 1 , wherein the resin powder has a 50 percent cumulative volume particle diameter from 5 to 200 μm.

3. The resin powder according to claim 1 , wherein the resin powder has an average circularity of 0.80 or greater in a particle diameter range of from 0.5 to 200 μm.

4. The resin powder according to claim 1 , wherein the resin powder has an average circularity of 0.83 or greater in a particle diameter range of from 0.5 to 200 μm.

5. The resin powder according to claim 1 , wherein the resin powder has a particle diameter ratio of a volume average particle diameter to a number average particle diameter of 2.00 or less.

6. The resin powder according to claim 1 , wherein the resin powder has a specific gravity of 0.8 or greater.

7. The resin powder according to claim 1 , further comprising at least one member selected from the group consisting of polyolefin, polyamide, polyester, polyether, polyarylketone, polyphenylene sulfide, a liquid crystal polymer, polyacetal, polyimide, and a fluorochemical resin.

8. The resin powder according to claim 7 , wherein the polyamide comprises an aromatic polyamide.

9. The resin powder according to claim 7 , wherein the polyamide comprises at least one member selected from the group consisting of polyamide 410, polyamide 4T, polyamide 6, polyamide 66, polyamide MXD6, polyamide 610, polyamide 6T, polyamide 11, polyamide 12, polyamide 9T, polyamide 10T, and aramid.

10. The resin powder according to claim 7 , wherein the polyester comprises at least one member selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, and polylactate.

11. The resin powder according to claim 7 , wherein the polyether comprises at least one member selected from the group consisting of polyether ether ketone, polyether ketone, and polyether ketone ketone.

12. The resin powder according to claim 1 , satisfying at least one of the following relations (1) to (3):
(1): Tmf1>Tmf2, where Tmf1 represents a melting starting temperature of an endothermic peak as the resin powder is heated to a temperature 30 degrees C. higher than a melting point of the resin powder at a temperature rising speed of 10 degrees C. per minute and Tmf2 represents a melting starting temperature of an endothermic peak as the resin powder is heated to a temperature 30 degrees C. higher than the melting point of the resin powder at a temperature rising speed of 10 degrees C. per minute, cooled down to −30 degrees C. or lower at a temperature falling speed of 10 degrees C. per minute, and heated to the temperature 30 degrees C. higher than the melting point at a temperature rising speed of 10 degrees C. per minute for a second time, and both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146 regulation, wherein the melting starting temperature of the endothermic peak represents a temperature at a point −15 mW lower from a straight line drawn parallel to X axis from a site where quantity of heat becomes constant after endotherm at the melting point is finished to a lower temperature side,
(2): Cd1>Cd2, where Cd1 represents a crystallinity obtained from an energy amount of the endothermic peak when the resin powder is heated to a temperature 30 degrees C. higher than the melting point of the resin powder at a temperature rising speed of 10 degrees C. per minute and Cd2 represents a crystallinity obtained from an energy amount of the endothermic peak as the resin powder is heated to a temperature 30 degrees C. higher than the melting point of the resin powder at a temperature rising speed of 10 degrees C. per minute, cooled down to −30 degrees C. or lower at a temperature falling speed of 10 degrees C. per minute, and heated to the temperature 30 degrees C. higher than the melting point at a temperature rising speed of 10 degrees C. per minute for a second time, and both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146 regulation, and
(3): C×1>C×2, where C×1 represents a crystallinity of the resin powder obtained by X-ray diffraction measuring and C×2 represents a crystallinity obtained by X-ray diffraction measuring as the resin powder is heated to the temperature 30 degrees C. higher than the melting point thereof at a temperature rising speed of 10 degrees C. per minute, cooled down to −30 degrees C. or lower at a temperature falling speed of 10 degrees C. per minute, and thereafter heated to the temperature 30 degrees C. higher than the melting point at a temperature rising speed of 10 degrees C. per minute in nitrogen atmosphere.

13. A device for manufacturing a solid freeform fabrication object, comprising:
a layer forming device configured to form a layer comprising the resin powder of claim 1 ; and
a powder adhesion device configured to cause particles of the resin powder to adhere to each other in a selected area of the layer.

14. The device according to claim 12 , wherein the powder adhesion device comprises an electromagnetic wave irradiating device.

Assignees

• Iida Sohichiroh
• Yaguchi Shigenori
• Iwatsuki Hitoshi
• Suzuki Yasuo
• Tamoto Nozomu
• Higuchi Shinzo
• Saito Akira
• Yamashita Yasuyuki
• KAMODA Kiichi
• Ricoh Co Ltd

Inventors

• Iida Sohichiroh
• Yaguchi Shigenori
• Iwatsuki Hitoshi
• Suzuki Yasuo
• Tamoto Nozomu
• Higuchi Shinzo
• Saito Akira
• Yamashita Yasuyuki
• KAMODA Kiichi

Classifications

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title

• B29B9/16 Primary

  Auxiliary treatment of granules · CPC title

• B29K2077/10

  Aromatic polyamides [polyaramides] or derivatives thereof · CPC title

• B29C64/10

  Processes of additive manufacturing · CPC title

• B29K2067/003

  PET, i.e. poylethylene terephthalate · CPC title