Method for manufacturing camera modules and a camera module array

Patent metadata

Field	Value
Publication number	US-10798277-B2
Application number	US-201816133259-A
Country	US
Kind code	B2
Filing date	Sep 17, 2018
Priority date	Sep 21, 2017
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A method for manufacturing a camera module, the camera module including a circuit carrier, an image sensor and an optical system holder, including: mounting the image sensor on the circuit carrier; applying a protective layer to the circuit carrier, in which the image sensor is not covered by the protective layer and the protective layer simultaneously forms the optical system holder.

First claim

What is claimed is:

1. A method for manufacturing a camera module, the method comprising:
mounting an image sensor on a circuit carrier;
applying a protective layer to the circuit carrier;
wherein the image sensor is not covered by the protective layer and the protective layer forms an optical system holder, which holds the circuit carrier, on which is mounted the image sensor,
wherein the camera module includes the circuit carrier, the image sensor and the optical system holder, and
wherein a camera module array is fabricated on a conductor foil and is made up of at least four camera modules including the camera module, the at least four camera modules being situated in rows and columns.

2. The method of claim 1 , further comprising:
applying at least one optical element with the aid of an injection molding process, so that the camera module includes the at least one optical element.

3. The method of claim 1 , wherein the circuit carrier includes a further protective layer, so that at least one electronic component is embedded between the protective layer and the further protective layer.

4. The method of claim 1 , further comprising:
attaching soldering points to the camera module.

5. The method of claim 1 , wherein the protective layer is applied with a local pressure molding process, in which a molding compound is added to a separating foil and is subsequently pressed locally onto the circuit carrier and/or onto components mounted on the circuit carrier.

6. The method of claim 5 , wherein the molding compound is impervious to light in a cured state, the molding compound, which is made of epoxy resin.

7. The method of claim 1 , wherein an optical element is shaped as a lens in an injection molding process.

8. The method of claim 1 , wherein the conductor foil includes a glass fiber-reinforced epoxy foil with attached strip conductors.

9. The method of claim 1 , further comprising:
attaching soldering bumps to the camera module.

10. A method for manufacturing a camera module array, which includes at least four camera modules, the method comprising:
manufacturing an array of camera modules, each of the camera modules being made by performing the following:
mounting an image sensor on a circuit carrier;
applying a protective layer to the circuit carrier;
wherein the image sensor is not covered by the protective layer and the protective layer forms an optical system holder, which holds the circuit carrier, on which is mounted the image sensor, and
wherein the camera module includes the circuit carrier, the image sensor and the optical system holder;

wherein the camera modules are mechanically connected to one another, the circuit carriers of the camera modules are connected to one another, and the circuit carrier is formed by a cohesive conductor foil, and
wherein the camera module array is fabricated on the conductor foil and is made up of the at least four camera modules, the camera modules being situated in rows and columns.

11. A method for manufacturing a camera module, the method comprising:
manufacturing a camera module array, made up of at least two camera modules, by performing the following:
manufacturing an array of camera modules, each of the camera modules being made by performing the following:
mounting an image sensor on a circuit carrier;
applying a protective layer to the circuit carrier;
wherein the image sensor is not covered by the protective layer and the protective layer forms an optical sensor holder, which holds the circuit carrier, on which is mounted the image sensor, and
wherein the camera module includes the circuit carrier, the image sensor and the optical system holder;

wherein the camera modules are mechanically connected to one another, the circuit carriers of the camera modules are connected to one another, and the circuit carrier is formed by a cohesive conductor foil; and

separating the camera modules.

12. The method of claim 11 , wherein the camera modules are separated with the aid of a milling cutter and/or a saw.

Assignees

• Bosch Gmbh Robert

Inventors

• Bochow Anne
• Matusek Adrian Severin
• Fischer Alexander
• Reppich Andreas
• Kugler Andreas
• Denes Istvan

Classifications

• H04N23/55 Primary

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N5/2257

  Electricity · mapped topic

• H04N5/2254 Primary

  Electricity · mapped topic