Routing assembly and system using same

Patent metadata

Field	Value
Publication number	US-10797416-B2
Application number	US-201916454080-A
Country	US
Kind code	B2
Filing date	Jun 27, 2019
Priority date	Jan 11, 2016
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A routing assembly for an electronic device has a front face with an array of connectors ports and each of the connector ports contain a first connector mounted therein. A first end of a cable can be directly terminated to the first connectors and the cables can be embedded in a tray that is configured to extend toward a chip package. The cables extend from the tray and terminates to a second connector that can be connected to the chip package so as to provide a communication path between the first connector and the second connector that substantially bypasses a supporting circuit board.

First claim

We claim:

1. A routing assembly, comprising:
a frame with a front face that defines a plurality of ports in a one by N array, where N is at least two;
a connector housing aligned with each port, the connector housing formed of a metal material;
a tray extending from the frame, the tray including an interior opening;
a plurality of first connectors, one of each of the first connectors positioned in each of the connector housings;
a plurality of cables with first ends connected to the plurality of first connectors and second ends extending from the tray into the interior opening, the plurality of cables extending through the tray in a predetermined configuration; and
a plurality of second connectors mounted on the second ends, wherein the plurality of cables are configured to allow signals to pass between the first and second connectors while bypassing a circuit board.

2. The routing assembly of claim 1 , wherein the second connectors have a mating direction that is transverse to the tray.

3. The routing assembly of claim 1 , wherein the frame includes side supports that support the tray.

4. The routing assembly of claim 1 , wherein the tray extends from the front face in a cantilevered manner.

5. The routing assembly of claim 1 , wherein the tray is formed of a conductive material.

6. The routing assembly of claim 1 , wherein the cables extending from the 1 by N array extend a distance before entering the tray.

7. A system, comprising:
a box with a front side;
a motherboard positioned in the box, the motherboard supporting a chip package;
a routing assembly positioned in the box, the routing assembly including a front face that defines a 1 by N matrix of connector ports, where N is at least 2, the front face positioned at the front side, the routing assembly including a tray extending from the front face, the tray having an internal opening near the chip package;
a plurality of first connectors, each one of the plurality of first connectors positioned in one of the connector ports;
a plurality of cables positioned in the tray, each of the cables having a first end terminated to one of the plurality of first connectors and a second end the extends into the internal opening;
a plurality of second connectors mounted adjacent the chip package, the plurality of second connectors electrically connected to the chip package; and
a plurality of third connectors terminated to the second ends and positioned adjacent the chip package, the third connectors arranged in a pattern that extends along at least one side of the chip package, wherein the plurality of third connectors are mated to the second connectors so as to provide a signal path between the first and second connectors that substantially avoids traveling through the motherboard.

8. The system of claim 7 , wherein the tray extends from the front face in a cantilevered manner.

9. The system of claim 7 , wherein the tray is positioned below the motherboard.

10. The system of claim 7 , wherein the tray is positioned above the motherboard.

11. The system of claim 7 , wherein the motherboard supports a second row of connectors ports with a plurality of fourth connectors positioned therein, the fourth connectors electrically connected to the motherboard, wherein the first connectors communicate with the chip package via the cables and the fourth connectors communicate via traces in the motherboard.

12. The system of claim 7 , wherein the plurality of cables are in a preconfigured arrangement that positions the third connectors on two sides of the chip package.

13. The system of claim 7 , wherein the tray is formed of a conductive material.

Assignees

• Molex Llc

Inventors

• Lloyd Brian Keith
• Fitzgerald Gregory
• Reed Bruce
• Walz Gregory
• Isaac Ayman

Classifications

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H01R13/518

  for holding or embracing several coupling parts, e.g. frames · CPC title

• H01R12/79

  connecting to rigid printed circuits or like structures · CPC title

• G06F13/38

  Information transfer, e.g. on bus (G06F13/14 takes precedence) · CPC title

• H01R12/7076 Primary

  for connection between PCB and component, e.g. display · CPC title