Matrix detection device incorporating a metal mesh in a detection layer, and manufacturing method

Patent metadata

Field	Value
Publication number	US-10797111-B2
Application number	US-201515309272-A
Country	US
Kind code	B2
Filing date	Apr 24, 2015
Priority date	May 7, 2014
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A matrix-array detecting device including a stack comprising a matrix array of detecting-element pixels, and an active matrix array comprising a network of rows and columns for controlling the pixels and produced on the surface of a substrate, wherein the detecting-element pixels comprise: a common top electrode; a detecting layer; and discrete bottom electrodes; the device comprising a metallic mesh that is connected to the top electrode; that includes pads comprising at least one metal portion, the pads being incorporated into the detecting layer; and that is positioned in correspondence with the network of controlling rows and columns. A process for fabricating the matrix-array detecting device is also provided.

First claim

The invention claimed is:

1. A matrix-array detecting device including a stack comprising a matrix array of detecting-element pixels, and an active matrix array comprising a network of rows and columns for controlling the pixels and produced on the surface of a substrate, wherein:
the detecting-element pixels comprise:
a common top electrode;
a detecting layer; and
discrete bottom electrodes;

said device comprising a metallic mesh:
that is connected to said top electrode;
that includes pads comprising at least one metal portion, said pads being incorporated into said detecting layer; and
that is positioned in correspondence with said network of controlling rows and columns,

wherein at least one of said pads comprises a metal top portion and a bottom portion comprising a dielectric,
wherein the metal top portion is in contact with the common top electrode.

2. The matrix-array detecting device as claimed in claim 1 , wherein the detecting layer is a common detecting layer.

3. The matrix-array detecting device as claimed in claim 1 , wherein the detecting pixels are photodiodes.

4. The matrix-array detecting device as claimed in claim 1 , wherein the metallic mesh is separated from the network of controlling rows and columns by a dielectric layer of permittivity lower than about 2.5.

5. The matrix-array detecting device as claimed in claim 1 , wherein the bottom portion of said pads includes a positive photoresist.

6. The matrix-array detecting device as claimed in claim 1 , wherein detecting-element pixels comprise one or more organic materials.

7. The matrix-array detecting device as claimed in claim 6 , wherein the organic material is a blend of p-type polymer and n-type polymer.

8. The matrix-array detecting device as claimed in claim 1 , wherein the network of rows and columns for controlling said pixels is connected to a network of controlling transistors.

Assignees

• Commissariat Energie Atomique

Inventors

• Tallal Jamal
• Charlot Simon
• Daami Anis
• Verilhac Jean-Marie

Classifications

• H01L27/307

  Electricity · mapped topic

• H01L27/308 Primary

  Electricity · mapped topic

• H10K39/36 Primary

  Devices specially adapted for detecting X-ray radiation · CPC title

• H10K39/32

  Organic image sensors · CPC title