Low work function electron beam filament assembly

US10796876B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10796876-B2
Application numberUS-201815983967-A
CountryUS
Kind codeB2
Filing dateMay 18, 2018
Priority dateMar 22, 2016
Publication dateOct 6, 2020
Grant dateOct 6, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A filament assembly can include: a button having a planar emitter region with one or more apertures extending from an emission surface of the planar emitter region to an internal surface opposite of the emission surface; an inlet electrical lead coupled to the button at a first side; an outlet electrical lead coupled to the button at a second side opposite of the first side; and a low work function object positioned adjacent to the internal surface of the planar emitter region and retained to the button. The planar emitter region can include a plurality of apertures. The low work function object can include a porous ceramic material having the barium, and may have a polished external surface. An electron gun can include the filament assembly. An additive manufacturing system can include the electron gun having the filament assembly.

First claim

Opening claim text (preview).

What is claimed is: 1. A filament assembly comprising: a button having a planar emitter region with one or more apertures extending from an emission surface of the planar emitter region to an internal surface opposite of the emission surface; an inlet electrical lead coupled to the button at a first side; an outlet electrical lead coupled to the button at a second side opposite of the first side; and a low work function object positioned adjacent to the internal surface of the planar emitter region and retained to the button, wherein: the low work function object includes barium and is configured to evolve barium therefrom when heated; the low work function material of the low work function object includes a porous ceramic material having the barium; the porous ceramic material includes a refractory metal distributed with a ceramic that includes barium oxide, calcium oxide, and an other oxide; the other oxide includes at least one of aluminum oxide, samarium oxide, or magnesium oxide; and the refractory metal makes up at least 50% of the low work function object by weight. 2. The filament assembly of claim 1 , wherein the planar emitter region comprises a plurality of apertures. 3. The filament assembly of claim 1 , further comprising a retainer member coupled with the button to form a housing having an internal chamber, wherein the low work function object is retained within the internal chamber. 4. The filament assembly of claim 3 , wherein at least one of the button or retainer member includes tantalum. 5. The filament assembly of claim 1 , further comprising a basket having the low work function object located in the basket. 6. The filament assembly of claim 5 , wherein the basket includes tantalum foil. 7. The filament assembly of claim 1 , wherein the low work function object further comprises an additive metal that includes at least one of nickel, iridium, osmium, titanium, molybdenum, or tantalum. 8. An electron gun comprising: a cathode; the filament assembly of claim 1 adjacent to the cathode with a gap therebetween; and an anode spaced apart from the cathode. 9. An additive manufacturing system comprising: the electron gun of claim 8 ; and a wire feeder configured to feed wire into a path of an electron beam emitted from the filament assembly. 10. A plasma bridge neutralizer comprising: a chamber having a gas inlet; and the filament assembly of claim 1 located in the chamber with the planar emitter region facing gas in the chamber. 11. A method of emitting electrons from a filament assembly, the method comprising: providing the filament assembly of claim 1 ; passing current from the inlet electrical lead through the filament assembly to the outlet electrical lead; and heating the filament assembly until electrons are emitted from the planar emitter region of the button. 12. A method of manufacturing the filament assembly of claim 1 , the method comprising: forming the button to have a body with a planar emitter region; forming the one or more apertures through the body at the planar emitter region; positioning the low work function object adjacent to the internal surface of the planar emitter region; and attaching the inlet electrical lead and outlet electrical lead to opposite sides of the button. 13. The method of claim 12 , further comprising polishing the low work function object by one of: abrasive polishing with a dry abrasive; ion beam polishing; or abrasive polishing with a dry abrasive followed by ion beam polishing. 14. The filament assembly of claim 1 , wherein the one or more apertures are transmissive to electrons. 15. The filament assembly of claim 1 , wherein the one or more apertures allow migration of atoms and/or molecules from the low work function object to the emissive surface. 16. The filament assembly of claim 1 , wherein the refractory metal includes tungsten. 17. The filament assembly of claim 1 , wherein the low work function object has a polished external surface. 18. A filament assembly comprising: a button having a planar emitter region with one or more apertures extending from an emission surface of the planar emitter region to an internal surface opposite of the emission surface; an inlet electrical lead coupled to the button at a first side; an outlet electrical lead coupled to the button at a second side opposite of the first side; a low work function object positioned adjacent to the internal surface of the planar emitter region and retained to the button; and a cylindrical tantalum foil associated with the button. 19. The filament assembly of claim 18 , wherein the cylindrical tantalum foil extends from the button away from the low work function object. 20. A method of emitting electrons from a filament assembly, the method comprising: providing a filament assembly comprising: a button having a planar emitter region with one or more apertures extending from an emission surface of the planar emitter region to an internal surface opposite of the emission surface; an inlet electrical lead coupled to the button at a first side; an outlet electrical lead coupled to the button at a second side opposite of the first side; and a low work function object positioned adjacent to the internal surface of the planar emitter region and retained to the button; passing current from the inlet electrical lead through the filament assembly to the outlet electrical lead; heating the filament assembly until electrons are emitted from the planar emitter region of the button; decontaminating the button by flash heating the button to a first temperature that vaporizes one or more contaminants such that the low work function object is at a second temperature that is lower than the first temperature so that barium is not evolved therefrom; cooling the button to an operational temperature; and heating the low work function object to the operational temperature.

Assignees

Inventors

Classifications

  • by mechanical means · CPC title

  • Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS] · CPC title

  • by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF] · CPC title

  • Nozzles · CPC title

  • Hollow cathodes · CPC title

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What does patent US10796876B2 cover?
A filament assembly can include: a button having a planar emitter region with one or more apertures extending from an emission surface of the planar emitter region to an internal surface opposite of the emission surface; an inlet electrical lead coupled to the button at a first side; an outlet electrical lead coupled to the button at a second side opposite of the first side; and a low work func…
Who is the assignee on this patent?
Univ Colorado State Res Found
What technology area does this patent fall under?
Primary CPC classification B33Y30/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 06 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).