Electronic component, diaphragm, and electronic device

Patent metadata

Field	Value
Publication number	US-10796837-B2
Application number	US-201816188430-A
Country	US
Kind code	B2
Filing date	Nov 13, 2018
Priority date	Jun 7, 2016
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

An electronic component includes an insulating base material including insulating base material layers, a first main surface that is a mounting surface, a coil, mounting electrodes provided on the first main surface, and a projection. The coil includes coil conductors provided on the insulating base material layers and a winding axis in a laminating direction of the insulating base material layers. The projection is provided in an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrodes therein, and provided along the coil conductors in planar view of the first main surface.

First claim

What is claimed is:

1. An electronic component comprising:
an insulating base material including a first main surface on a mounting surface side, the insulating base material including a plurality of insulating base material layers that are laminated in a lamination direction;
a coil including a coil conductor provided on at least one of the plurality of insulating base material layers and including a winding axis extending in the lamination direction;
a mounting electrode provided on the first main surface and connected to the coil;
a projection provided on at least an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrode; and
a recess or a through-hole provided in the electrode non-forming portion and disposed at a position including a coil opening of the coil when viewed from the lamination direction; wherein
the projection is provided along the coil conductor in a planar view of the first main surface;
the coil conductor is disposed across different positions in the lamination direction; and
a first portion of the coil conductor, which is positioned on an innermost peripheral side when viewed from a winding axis direction, is farther away from the first main surface in the lamination direction as compared to a second portion of the coil conductor which is located closest to the first main surface.

2. The electronic component according to claim 1 , wherein the plurality of insulating base material layers are made of a thermoplastic resin.

3. The electronic component according to claim 2 , wherein
the coil conductor includes a plurality of coil conductors; and
the plurality of coil conductors are provided on at least two insulating base material layers among the plurality of insulating base material layers.

4. The electronic component according to claim 2 , wherein
the plurality of insulating base material layers include a first insulating base material layer including the first main surface and a second insulating base material layer adjacent to the first insulating base material layer; and
at least one coil conductor is disposed at an interface between the first insulating base material layer and the second insulating base material layer.

5. The electronic component according to claim 4 , wherein
the coil conductor includes a plurality of coil conductors; and
the coil conductor disposed at the interface between the first insulating base material layer and the second insulating base material layer is larger than other coil conductors in a number of windings.

6. The electronic component according to claim 3 , wherein at least portions of a plurality of the coil conductors overlap each other when viewed from the lamination direction.

7. The electronic component according to claim 2 , further comprising:
a deformation preventing member provided on at least one of the first main surface and a second main surface opposite to the first main surface, the deformation preventing member having rigidity higher than that of the insulating base material; wherein
the insulating base material includes the second main surface.

8. The electronic component according to claim 1 , wherein an outer edge of a section in a direction orthogonal or substantially orthogonal to an extending direction of the coil conductor closest to the first main surface among the coil conductors has an arc shape.

9. The electronic component according to claim 1 , further comprising a dummy conductor provided on the insulating base material.

10. A diaphragm comprising:
a flexible support film including a routing conductor; and
an electronic component fixed to the support film by a conductive bonding material and an insulating bonding material; wherein
the electronic component includes:
an insulating base material including a first main surface on a mounting surface side, the insulating base material including a plurality of insulating base material layers that are laminated in a lamination direction;
a coil including a coil conductor provided on at least one of the plurality of insulating base material layers and including a winding axis extending in the lamination direction;
a mounting electrode provided on the first main surface and connected to the coil;
a projection provided on at least an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrode; and
a recess or a through-hole provided in the electrode non-forming portion and disposed at a position including a coil opening of the coil when viewed from the lamination;

the projection is provided along the coil conductor in a planar view of the first main surface;
the coil conductor is disposed across different positions in the lamination direction;
a first portion of the coil conductor, which is positioned on an innermost peripheral side when viewed from a winding axis direction, is farther away from the first main surface in the lamination direction as compared to a second portion of the coil conductor which is located closest to the first main surface;
the mounting electrode is connected to the routing conductor of the support film with the conductive bonding material interposed therebetween; and
in the first main surface, a bonding portion bonded to the support film with the insulating bonding material interposed therebetween includes the projection.

11. The diaphragm according to claim 10 , wherein the plurality of insulating base material layers are made of a thermoplastic resin.

12. The diaphragm according to claim 11 , wherein
the coil conductor includes a plurality of coil conductors; and
the plurality of coil conductors are provided on at least two insulating base material layers among the plurality of insulating base material layers.

13. The diaphragm according to claim 11 , wherein
the plurality of insulating base material layers include a first insulating base material layer including the first main surface and a second insulating base material layer adjacent to the first insulating base material layer; and
at least one coil conductor is disposed at an interface between the first insulating base material layer and the second insulating base material layer.

14. The diaphragm according to claim 13 , wherein
the coil conductor includes a plurality of coil conductors; and
the coil conductor disposed at the interface between the first insulating base material layer and the second insulating base material layer is larger than other coil conductors in a number of windings.

15. An electronic device comprising:
a mounting substrate; and
an electronic component mounted on the mounting substrate by a conductive bonding material and an insulating bonding material; wherein
the electronic component includes:
an insulating base material including a first main surface on a mounting surface side, the insulating base material including a plurality of insulating base material layers that are laminated in a lamination direction;
a coil including a coil conductor provided on at least one of the plurality of insulating base material layers and having a winding axis extending in the lamination direction;
a mounting electrode provided on the first main surface and connected to the coil;
a projection provided on at least an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrode; and
a recess or a through-hole provided in the electrode non-forming portion and disposed at a position including a coil opening of the coil when viewed from the lamination directio

Assignees

• Murata Manufacturing Co

Inventors

• Ito Shingo
• Gouchi Naoki
• Takeuchi Kosuke

Classifications

• H04R7/00

  Diaphragms for electromechanical transducers (in general F16J3/00); Cones (for musical instruments G10 ){(cones, diaphragms or the like, for emitting or receiving sound in general G10K13/00; Mounting thereof)} · CPC title

• H01F2017/004

  with the coil helically wound around an axis without a core · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K3/305

  Affixing by adhesive · CPC title

• H05K2201/10083

  Electromechanical or electro-acoustic component, e.g. microphone · CPC title