Insulating material and wiring member

US10796815B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10796815-B2
Application numberUS-201716309012-A
CountryUS
Kind codeB2
Filing dateJun 28, 2017
Priority dateJun 29, 2016
Publication dateOct 6, 2020
Grant dateOct 6, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided an insulating material including a composite resin material comprising an organic resin and minute particles containing a metal element. The organic resin includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such an insulating material is used as an insulating layer of a wiring member (wiring board, covered electric wire, etc.) including a conductor and the insulating layer which covers the conductor.

First claim

Opening claim text (preview).

The invention claimed is: 1. An insulating material, comprising: a composite resin material comprising an organic resin and minute particles containing a metal element, wherein the organic resin comprises a resin material comprising a polyester as a main backbone thereof and having an alkoxy group, the polyester includes at least one of polycarbonate and polyarylate, the alkoxy group and the main backbone of the resin material are bound together by ester binding, the minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm, and the metal element is contained in the composite resin material in an amount of greater than or equal to 0.05% by mass but less than or equal to 5.0% by mass. 2. The insulating material according to claim 1 , wherein a ratio by mole of the alkoxy group to a whole of ester binding contained in the composite resin material is greater than or equal to 0.05% but less than or equal to 11%. 3. The insulating material according to claim 1 , wherein the metal element is at least one element selected from Si, Ti, Zr, and Al. 4. The insulating material according to claim 1 , wherein the organic resin further comprises at least one resin material selected from a resin material group consisting of poly phenylene ether, a cyclic olefin resin, and a polyetherimide resin. 5. A wiring member, comprising: a conductor; and an insulating layer which covers the conductor, the insulating layer comprising the insulating material according to claim 1 . 6. The wiring member according to claim 5 , wherein the conductor includes circuit wiring disposed on a substrate. 7. The wiring member according to claim 5 , wherein the conductor includes an electric wire.

Assignees

Inventors

Classifications

  • Disposition of insulation · CPC title

  • Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties · CPC title

  • plastics; resins; waxes · CPC title

  • comprising conductive layers or films on insulating-supports · CPC title

  • Linear aromatic polyesters · CPC title

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Frequently asked questions

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What does patent US10796815B2 cover?
There is provided an insulating material including a composite resin material comprising an organic resin and minute particles containing a metal element. The organic resin includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such…
Who is the assignee on this patent?
Kyocera Corp
What technology area does this patent fall under?
Primary CPC classification H01B3/42. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 06 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).