Electronic device providing a temperature sensor or a current source delivering a temperature independent current

US10795396B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10795396-B2
Application numberUS-201916572130-A
CountryUS
Kind codeB2
Filing dateSep 16, 2019
Priority dateSep 24, 2018
Publication dateOct 6, 2020
Grant dateOct 6, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic device includes a module that delivers a positive temperature coefficient output voltage at an output terminal. A thermistor includes a first MOS transistor operating in weak inversion mode and having a negative temperature coefficient drain-source resistance and whose source is coupled to the output terminal. A current source coupled to the output terminal operates to impose the drain-source current of the first transistor.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electronic device, comprising: a circuit module having a first output terminal that is configured to deliver a positive temperature coefficient output voltage; wherein the circuit module comprises: a thermistor having a first MOS transistor configured to operate in weak inversion mode and have a negative temperature coefficient drain-source resistance and whose source is coupled to said first output terminal, and a current source having a control terminal coupled to the first output terminal and configured to impose a drain-source current of the first MOS transistor. 2. The device according to claim 1 , wherein the current source comprises a second MOS transistor having a gate that is coupled to the first output terminal, the second MOS transistor being configured to operate in strong inversion mode and have a gate leakage current configured to impose the drain-source current of the first MOS transistor. 3. The device according to claim 2 , wherein the first and second MOS transistors are NMOS transistors. 4. The device according to claim 2 , wherein the gate leakage current of the second MOS transistor has a same order of magnitude as the drain-source current of the first MOS transistor. 5. The device according to claim 4 , wherein a thickness of a gate oxide of the second MOS transistor is less than 2 nm. 6. The device according to claim 2 , further comprising: a negative temperature coefficient MOS transistor having a gate that is coupled to a drain of the first MOS transistor, a source that is coupled to a source of the second MOS transistor of the circuit module, and a drain that is coupled to a drain of the second MOS transistor, wherein the sources of the second MOS transistor and the negative temperature coefficient MOS transistor form a second output. 7. The device according to claim 6 , wherein the negative temperature coefficient MOS transistor is an NMOS transistor. 8. The device according to claim 6 , wherein said second output generates a substantially temperature-independent output current. 9. The device according to claim 6 , produced on a silicon-on-insulator substrate, wherein each of the first MOS transistor, the second MOS transistor and the negative temperature coefficient MOS transistor has a back gate, and the back gates are coupled together to receive a common voltage. 10. The device according to claim 9 , wherein the silicon-on-insulator substrate is a fully or partly depleted silicon-on-insulator substrate. 11. The device according to claim 6 , wherein the device is a component of an electronic appliance selected from the group consisting of a cellular mobile telephone, a tablet and a laptop computer. 12. The device according to claim 1 , wherein said circuit module forms a temperature sensor with an output voltage at said first output terminal varying proportionally to temperature. 13. The device according to claim 1 , produced in an integrated manner. 14. The device according to claim 13 , produced on a silicon-on-insulator substrate. 15. The device according to claim 14 , wherein the silicon-on-insulator substrate is a fully or partly depleted silicon-on-insulator substrate. 16. The device according to claim 1 , produced on a silicon-on-insulator substrate, wherein each of the first MOS transistor and the second MOS transistor has a back gate, and the back gates are coupled together to receive a common voltage. 17. The device according to claim 1 , wherein the device is a component of an electronic appliance selected from the group consisting of a cellular mobile telephone, a tablet and a laptop computer. 18. An electronic device, comprising: a first MOS transistor configured as a thermistor and having a source coupled to a first output terminal, a drain coupled to a supply voltage node and a gate coupled to the drain such that the first MOS transistor operates in a weak inversion mode with a negative temperature coefficient drain-source resistance; and a second MOS transistor configured as a current source and having a gate coupled to the first output terminal to impose a drain-source current of the first MOS transistor, a drain and a source. 19. The device according to claim 18 , wherein the second MOS transistor operates in strong inversion mode and has a gate leakage current which imposes the drain-source current of the first MOS transistor. 20. The device according to claim 18 , wherein the first and second MOS transistors are NMOS transistors. 21. The device according to claim 18 , wherein an output voltage at said first output terminal varies proportionally to temperature. 22. The device according to claim 18 , produced on a silicon-on-insulator substrate, wherein each of the first MOS transistor and the second MOS transistor has a back gate, and the back gates are coupled together to receive a common voltage. 23. An electronic device, comprising: a first MOS transistor configured as a thermistor and having a source coupled to a first node, a drain coupled to a control node and a gate coupled to a supply voltage node; a second MOS transistor configured as a current source and having a gate coupled to the first node to impose a drain-source current of the first MOS transistor, a drain coupled to the supply voltage node and a source coupled to an output node; and a third MOS transistor having a gate coupled to the control node, a drain coupled to the supply voltage node and a source coupled to the output node. 24. The device according to claim 23 , wherein the first, second and third MOS transistors are NMOS transistors. 25. The device according to claim 23 , wherein the output node generates a current which is substantially temperature-independent. 26. The device according to claim 23 , produced on a silicon-on-insulator substrate, wherein each of the first MOS transistor, the second MOS transistor and the third MOS transistor has a back gate, and the back gates are coupled together to receive a common voltage. 27. The device according to claim 26 , wherein the silicon-on-insulator substrate is a fully or partly depleted silicon-on-insulator substrate.

Assignees

Inventors

Classifications

  • for modifying the output characteristic, e.g. linearising · CPC title

  • using semiconducting elements having PN junctions (G01K7/02, G01K7/16, G01K7/30 take precedence) · CPC title

  • G05F3/245Primary

    producing a voltage or current as a predetermined function of the temperature · CPC title

  • G05F1/567Primary

    for temperature compensation · CPC title

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What does patent US10795396B2 cover?
An electronic device includes a module that delivers a positive temperature coefficient output voltage at an output terminal. A thermistor includes a first MOS transistor operating in weak inversion mode and having a negative temperature coefficient drain-source resistance and whose source is coupled to the output terminal. A current source coupled to the output terminal operates to impose the …
Who is the assignee on this patent?
St Microelectronics Sa
What technology area does this patent fall under?
Primary CPC classification G05F3/245. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 06 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).