Optoelectronic device with a support member

Patent metadata

Field	Value
Publication number	US-10795103-B2
Application number	US-201816175652-A
Country	US
Kind code	B2
Filing date	Oct 30, 2018
Priority date	Oct 30, 2018
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

Optoelectronic devices with a support member and methods of manufacturing or assembling the same are provided. An example of an optoelectronic device according to the present disclosure includes a substrate and an optical component and an electronic component disposed thereon or therein. The optoelectronic device further includes a ferrule coupled to the optical fiber and an optical socket receiving the ferrule therein. The optoelectronic device includes a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member.

First claim

The invention claimed is:

1. An optoelectronic device comprising:
a substrate;
an optical interposer disposed on the substrate;
an electronic component disposed on the optical interposer;
an optical component disposed on or in the optical interposer in one or both of electrical and optical communication with the electronic component;

an optical fiber,
a ferrule coupled to the optical fiber;
an optical socket receiving the ferrule therein, the optical socket to align the ferrule and the optical component when the ferrule is received therein and the optical socket is mounted on the substrate, the optical socket bondable to support members having different dimensions;
a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member, the support member bonded to both the substrate and the optical socket to support the optical socket on the substrate, wherein the support member is bonded directly to the interposer.

2. An optoelectronic device comprising:
a substrate;
an optical interposer disposed on the substrate;
an electronic component disposed on the optical interposer;
an optical component disposed on or in the optical interposer in one or both of electrical and optical communication with the electronic component;

an optical fiber;
a ferrule coupled to the optical fiber;
an optical socket receiving the ferrule therein, the optical socket to align the ferrule and the optical component when the ferrule is received therein and the optical socket is mounted on the substrate, the optical socket bondable to support members having different dimensions;
a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member, the support member bonded to both the substrate and the optical socket to support the optical socket on the substrate, wherein the support member is cantilevered over at least a portion of the optical interposer.

3. An optoelectronic device comprising:
a substrate;
an optical interposer disposed on the substrate;
an electronic component disposed on the optical interposer;
an optical component disposed on or in the optical interposer in one or both of electrical and optical communication with the electronic component;

an optical fiber;
a ferrule coupled to the optical fiber;
an optical socket receiving the ferrule therein, the optical socket to align the ferrule and the optical component when the ferrule is received therein and the optical socket is mounted on the substrate, the optical socket bondable to support members having different dimensions, the optical socket and ferrule including corresponding alignment features to align the ferrule within the optical socket when received therein;
a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member, the support member bonded to both the substrate and the optical socket to support the optical socket on the substrate;
wherein the optical component comprises a lens and wherein the optical socket aligns the ferrule and the lens when the ferrule is received therein and the optical socket is mounted on the substrate.

4. The optoelectronic device of claim 3 , wherein the support member is dimensioned to straddle opposing sides of the interposer.

5. The optoelectronic device of claim 3 , wherein the support member comprises a recessed enclosure including walls extending along two or more sides of the optical component.

6. The optoelectronic device of claim 5 , wherein a through opening of the recessed enclosure allows optical signals to pass therethrough between the optical component and the optical fiber coupled to the ferrule and the walls enclose an optical path between the optical component and the optical fiber to reduce entry of contaminants therein.

7. The optoelectronic device of claim 3 , wherein the support member is constructed out of one or more of sheet metal, plastic, or a material able to withstand multiple solder reflow temperature cycles.

8. The optoelectronic device of claim 3 , wherein the optical socket is removable from the support member without damaging one or both of the optical interposer and optical component.

9. The optoelectronic device of claim 3 , wherein the support member is soldered to the substrate or adhered to the substrate with an adhesive.

10. The optoelectronic device of claim 3 , wherein the support member is adhered to the optical socket with an adhesive or bonded to the optical socket by localized melting of a portion of the socket or support member.

11. The optoelectronic device of claim 3 , wherein the support member comprises a substantially U-shaped configuration, the support member including a support surface extending between two opposing sidewalls, the optical socket bonded to the support surface and the substrate bonded to the two opposing sidewalls.

12. The optoelectronic device of claim 3 , wherein the support member is constructed without micron-level tolerance alignment features to align the ferrule and the optical component.

13. The optoelectronic device of claim 3 , wherein the substrate is disposed over a circuit board and the support member is bonded to the circuit board.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Rosenberg Paul Kessler
• Mathai Sagi
• Tan Michael Renne Ty

Classifications

• G02B6/428 Primary

  containing printed circuit boards [PCB] · CPC title

• G02B6/4224

  using visual alignment markings, e.g. index methods · CPC title

• G02B6/38

  having fibre to fibre mating means · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G02B6/4237

  Welding · CPC title