Universal photonic adaptor for coupling an optical connector to an optoelectronic substrate

Patent metadata

Field	Value
Publication number	US-10795086-B2
Application number	US-201916555242-A
Country	US
Kind code	B2
Filing date	Aug 29, 2019
Priority date	Mar 7, 2017
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A photonic adaptor has a first face side to couple the photonic adaptor to an optical connector and a second face side to couple the photonic adaptor to an optoelectronic substrate. The photonic adaptor comprises a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor. The photonic adaptor comprises at least one alignment pin projecting out of at least the first face side of the photonic adaptor. The at least one alignment pin is configured to be inserted in the optical connector to align optical fibers of an optical cable to the optical fibers of the photonic adaptor.

First claim

What is claimed is:

1. An optoelectronic assembly for mounting to a carrier substrate, comprising:
an optoelectronic substrate including optical waveguides, wherein a respective front face of the optical waveguides terminates at a face side of the optoelectronic substrate;
a photonic adaptor comprising:
a first face side for coupling the photonic adaptor to an optical connector;
a second face side for coupling the photonic adaptor to an optoelectronic substrate;
a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor so that a respective first front side of the optical fibers terminates at the first face side of the photonic adaptor and a respective second front side of the optical fibers terminates at the second face side of the photonic adaptor, and
at least one alignment pin projecting out of at least the first face side of the photonic adaptor, wherein the at least one alignment pin is configured to be inserted in the optical connector terminating an optical cable to align optical fibers of the optical cable to the optical fibers of the photonic adaptor;

a coupling and alignment layer including a mating structure being configured to receive the at least one alignment pin of the photonic adaptor to mate the photonic adaptor to the optoelectronic substrate;
wherein the mating structure and the at least one alignment pin are formed such that, in a mated state of the photonic adaptor and the optoelectronic substrate, the optical fibers of the photonic adaptor and the optical waveguides of the optoelectronic substrate are aligned to each other for transferring light between the optical fibers of the photonic adaptor and the optical waveguides of the optoelectronic substrate, and
the at least one alignment pin is arranged in the mating structure of the coupling and alignment layer and the at least one alignment pin is secured to the mating structure by soldering or laser welding.

2. The optoelectronic assembly of claim 1 , wherein the at least one alignment pin has a first portion projecting out of the first face side of the photonic adaptor, the first portion of the at least one alignment pin being configured to be inserted in the optical connector to couple the optical connector to the photonic adaptor and to align the optical fibers of the optical adaptor and the optical fibers of the optical cable for transferring light between the optical fibers of the photonic adaptor and the optical fibers of the optical cable, and the at least one alignment pin has a second portion projecting out of the second face side of the optical adaptor, the second portion of the at least one alignment pin being configured to be inserted in the mating structure of the coupling and alignment layer being mounted at the optoelectronic substrate to couple the photonic adaptor to the optoelectronic substrate and to align the optical fibers of the photonic adaptor and optical waveguides of the optoelectronic substrate for transferring light between the optical waveguides of the optoelectronic substrate and the optical fibers of the photonic adaptor.

3. The optoelectronic assembly of claim 1 , comprising:
a supporting substrate including at least one first groove to receive the at least one alignment pin; and
a first covering substrate being arranged relative to the supporting substrate such that the at least one alignment pin is fixed between the supporting substrate and the first covering substrate.

4. The optoelectronic assembly of claim 3 , wherein the supporting substrate comprises a plurality of second grooves, and each of the plurality of the second grooves is configured to receive one of the plurality of the optical fibers of the photonic adaptor.

5. The optoelectronic assembly of claim 4 , wherein the at least one alignment pin is attached to the at least one first groove, and the plurality of the optical fibers of the photonic adaptor are attached to the second grooves of the supporting substrate by means of an adhesive.

6. The optoelectronic assembly of claim 3 , comprising a second covering substrate being arranged on a surface of the supporting substrate, the surface of the supporting substrate being directed to the first covering substrate, wherein the plurality of optical fibers of the photonic adaptor are covered by the second covering substrate.

7. The optoelectronic assembly of claim 1 , wherein a center axis of the at least one alignment pin and a respective center axis of the plurality of the optical fibers of the photonic adaptor are arranged with an offset to each other in a direction perpendicular to the respective center axis of the at least one alignment pin and the plurality of the optical fibers of the photonic adaptor.

8. The optoelectronic assembly of claim 1 , wherein the mating structure is formed by at least one cut-out region in the material of the coupling and alignment layer.

9. The optoelectronic assembly of claim 1 , wherein the coupling and alignment layer is arranged on top of the optoelectronic substrate.

10. The optoelectronic assembly of claim 9 , comprising a heat spreader being mounted on top of the coupling and alignment layer.

11. The optoelectronic assembly of claim 1 , wherein an alignment structure is provided in the material of the top surface of the optoelectronic substrate.

12. The optoelectronic assembly of claim 1 , comprising:
a heat spreader being directly mounted on a first surface the optoelectronic substrate, wherein the coupling and alignment layer are arranged on a second surface of the optoelectronic substrate.

13. The optoelectronic assembly of claim 1 , wherein the coupling and alignment layer comprise a metal or a glass.

14. The optoelectronic assembly of claim 1 , wherein the coupling and alignment layer comprise one or more metallized glass through vias.

15. The optoelectronic assembly of claim 1 , wherein the optical fibers of the photonic adaptor and the optical waveguides of the optoelectronic substrate are optically coupled by a direct contact between the front faces of the optical waveguides of the optoelectronic substrate and the second front sides of the optical fibers of the photonic adaptor.

16. The optoelectronic assembly of claim 1 , wherein the optical fibers of the photonic adaptor and the optical waveguides of the optoelectronic substrate are optically coupled by optical lenses, and wherein a respective one of the optical lenses is arranged at the second face side of the photonic adaptor in front of the respective second front side of the optical fibers of the photonic adaptor.

17. The optoelectronic assembly of claim 1 , wherein the optical fibers of the photonic adaptor and the optical waveguides of the optoelectronic substrate are optically coupled by a respective flexible waveguide being arranged between the respective second front side of the optical fibers of the photonic adaptor and the optical waveguides of the optoelectronic substrate for an evanescent coupling of light.

18. The optoelectronic assembly of claim 1 , wherein the optical fibers of the photonic adaptor and the optical waveguides of the optoelectronic substrate are optically coupled by a respective optical mirror being arranged between the respective second front side of the optical fibers of the photonic adaptor and the optical waveguides of the optoelectronic substrate.

19. The optoelectronic assembly of claim 1 , wherein the optical fibers of the photonic adaptor and the optical waveguides of the optoelectronic substrate are optically coupled by a

Assignees

• Corning Optical Communications LLC

Inventors

• Matiss Andreas
• Sutherland James Scott

Classifications

• G02B6/02314

  Plurality of longitudinal structures extending along optical fibre axis, e.g. holes · CPC title

• G02B6/262 Primary

  Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G02B6/4214

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• G02B6/4231

  with intermediate elements, e.g. rods and balls, between the elements · CPC title