System and method for in-process inspection within advanced manufacturing processes

US10794836B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-10794836-B1
Application numberUS-201715854384-A
CountryUS
Kind codeB1
Filing dateDec 26, 2017
Priority dateDec 27, 2016
Publication dateOct 6, 2020
Grant dateOct 6, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system and method can include a laser Doppler vibrometer (LDV) in optical communication with a part during manufacturing and a transducer in ultrasonic communication with the part during manufacturing. The system can also include a controller connected to both the LDV and the transducer. The controller may be configured to cause the transducer to vibrate the part during manufacturing at a predetermined frequency and the LDV may be configured to measure one or more mechanical response types of the part during manufacturing based on one or more optical characteristics of a reflected beam. The controller may further be configured to determine whether a defect is present in the part during manufacturing in response to the one or more mechanical response types of the part.

First claim

Opening claim text (preview).

What is claimed is: 1. A system for in-situ, in process inspection of advanced manufacturing processes, comprising: a laser Doppler vibrometer (LDV) in optical communication with a part during manufacturing, the LDV configured to emit a laser light and to measure a mechanical response of the part to vibrations using reflections off the part from the emitted laser light, the part comprising a plurality of layers; a transducer in ultrasonic communication with the part during manufacturing, the transducer configured to impart the vibrations on the part directly or indirectly; and a controller connected to both the LDV and the transducer and configured to cause the transducer to vibrate the part, the controller further configured to: compute a curve of amplitude versus spatial wavenumber for each layer of the part, convert received optical characteristics of the reflected beam into a map or representation of the mechanical response of the part in the amplitude or the spatial wavenumber that is indicative of structural features of the part, repeat the conversion of the received optical characteristics of the reflected beam into the map or representation for each harmonic of a plurality of harmonics of an excitation frequency of the vibrations or nonlinearly-mixed harmonics of multiple frequencies of the vibrations, and determine whether changes to the amplitude or the spatial wavenumber occur for a layer of the part. 2. The system of claim 1 , wherein the controller is in communication with the LDV and the transducer is configured to vibrate at a predetermined frequency. 3. The system of claim 1 , wherein the transducer is in ultrasonic communication with a platform during manufacturing. 4. The system of claim 1 , wherein the transducer is configured to transmit ultrasonic vibrations in a platform such that the part is subject to continuous vibrations. 5. The system of claim 1 , wherein the transducer is configured to transmit ultrasonic vibrations in a platform such that the part is subject to semi-continuous vibrations. 6. The system of claim 1 , wherein the transducer is configured to transmit ultrasonic vibrations in a platform such that the part is subject to intermittent vibrations. 7. The system of claim 1 , wherein the transducer is configured to transmit ultrasonic vibrations in the part such that the part is subject to continuous vibrations. 8. The system of claim 1 , wherein the transducer is configured to transmit ultrasonic vibrations in the part such that the part is subject to semi-continuous vibrations. 9. The system of claim 1 , wherein the transducer is configured to transmit ultrasonic vibrations in the part such that the part is subject to intermittent vibrations. 10. The system of claim 1 , wherein the transducer is configured to transmit ultrasonic vibrations via one or more wires, conduits, extensions, liquids, gases, mechanical, solid, or non-solid media, or any combination thereof. 11. The system of claim 1 , wherein the controller is configured to determine that a defect is present in the part during manufacturing when the changes to the amplitude or the spatial wavenumber in the layer of the part occur. 12. The system of claim 1 , wherein the LDV is configured to emit the laser light at a plurality of frequencies. 13. The system of claim 1 , wherein the LDV is in optical communication with a plurality of mirrors placed at predetermined locations to be in optical communication with areas of the part being manufactured. 14. The system of claim 1 , wherein the LDV is configured to transmit data to a data acquisition system. 15. The system of claim 1 , wherein the conversion of the optical characteristics of the reflected beam into the map or representation of the mechanical responses of the part is performed for each of the plurality of layers of the part, producing a map or representation for each layer, and the controller is further configured to assemble the maps or representations for the plurality of layers of the part together to produce a volume measurement of the entire part. 16. The system of claim 1 , wherein the measured mechanical response of the part comprises an amplitude and a phase for each point in an inspection area. 17. The system of claim 1 , wherein when changes to the amplitude or the spatial wavenumber are determined to occur for a layer of the part, the controller is further configured to infer local print quality from the changes to the amplitude or the spatial wavenumber. 18. The system of claim 17 , wherein the inferring of the local print quality comprises determining that an increased amplitude or a higher energy spatial wavenumber is indicative of a poorly bonded section of the part or determining that a harmonic response to the plurality of harmonics is indicative of cracking or microvoids. 19. A method for in-situ, in-process inspection of advanced manufacturing processes, comprising: transducing an ultrasonic vibration in a part during manufacturing directly or indirectly, by a transducer, wherein the part comprises a plurality of layers; emitting laser light at one or more frequencies, by a laser Doppler vibrometer (LDV); measuring, by the LDV, mechanical responses of the part to excitation during manufacturing based on one or more optical characteristics of a reflected beam from the emitted laser light reflected back from the part after each of the plurality of layers of the part is printed; computing, by a controller, a curve of amplitude versus spatial wavenumber for each layer of the part; converting, by the controller, the optical characteristics of the reflected beam into a map or representation of the mechanical responses of the part in the amplitude or the spatial wavenumber that is indicative of structural features of the part; and repeating, by the controller, the conversion of the received optical characteristics of the reflected beam into the map or representation for each harmonic of a plurality of harmonics of an excitation frequency of the vibrations or nonlinearly-mixed harmonics of multiple frequencies of the vibrations. 20. A system, comprising: a laser Doppler vibrometer (LDV) in optical communication with a part comprising a plurality of layers during manufacturing, the LDV configured to emit a laser light and to measure a mechanical response of the part to vibrations using reflections off the part from the emitted laser light; a transducer configured to impart the vibrations on the part directly or indirectly; and a controller connected to both the LDV and the transducer, the controller configured to: control the LDV, cause the transducer to vibrate the part, compute a curve of amplitude versus spatial wavenumber for each layer of the part, convert received optical characteristics of the reflected beam into a map or representation of the mechanical response of the part in the amplitude or the spatial wavenumber that is indicative of structural features of the part, and repeat the conversion of the received optical characteristics of the reflected beam into the map or representation for each harmonic of a plurality of harmonics of an excitation frequency of the vibrations or nonlinearly-mixed harmonics of multiple frequencies of the vibrations.

Assignees

Inventors

Classifications

  • G01H9/008Primary

    by using ultrasonic waves (measuring position using ultrasonic waves G01S15/02) · CPC title

  • Measuring arrangements characterised by the use of optical techniques · CPC title

  • Systems in which incident light is modified in accordance with the properties of the material investigated (where the material investigated is optically excited causing a change in wavelength of the incident light G01N21/63) · CPC title

  • Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges (G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002) · CPC title

  • using the Doppler effect · CPC title

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What does patent US10794836B1 cover?
A system and method can include a laser Doppler vibrometer (LDV) in optical communication with a part during manufacturing and a transducer in ultrasonic communication with the part during manufacturing. The system can also include a controller connected to both the LDV and the transducer. The controller may be configured to cause the transducer to vibrate the part during manufacturing at a pre…
Who is the assignee on this patent?
Triad Nat Security Llc
What technology area does this patent fall under?
Primary CPC classification G01H9/008. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 06 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).