Method and system for measuring geometric parameters of through holes

Patent metadata

Field	Value
Publication number	US-10794679-B2
Application number	US-201715632919-A
Country	US
Kind code	B2
Filing date	Jun 26, 2017
Priority date	Jun 29, 2016
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.

First claim

The invention claimed is:

1. A method of measuring geometric parameters of through holes in a substrate, comprising:
positioning a camera comprising an image sensor and a lens having a depth of field greater than a thickness of the substrate at a measuring station, the image sensor having a pixel count of at least 10 megapixels and a pixel size of 1.7 microns or less;
positioning a select sub-volume of the substrate within a field of view of the camera and within the depth of field, wherein the select sub-volume has a front side, a back side, and at least one through hole,
the front side being positioned in opposing relation to the lens, and
the at least one through hole having a first side at the front side of the select sub-volume and a second side at the back side of the select sub-volume;

illuminating the select sub-volume by directing light from a light source comprising a telecentric illuminator at the back side of the select sub-volume, wherein the camera and light source are arranged on opposite sides of the substrate;
capturing an image of the select sub-volume on the image sensor; and
processing the image to measure at least a minimum transverse dimension of the through hole along a length of the through, the minimum transverse dimension of the through hole being disposed between the first side and the second side of the through hole.

2. The method of claim 1 , wherein the substrate has a thickness of 1 mm or less.

3. The method of claim 1 , wherein the lens is a telecentric lens.

4. The method of claim 1 , further comprising effecting a lateral relative motion between the camera and the substrate to position another sub-volume of the substrate within the field of view of the camera and within the depth of field.

5. The method of claim 4 , further comprising illuminating the another sub-volume with light, capturing an image of the another sub-volume on the image sensor, and processing the image of the another sub-volume to determine at least one geometric parameter of at least one hole in the another sub-volume.

6. The method of claim 5 , wherein illuminating the another sub-volume comprises effecting a lateral relative motion between a source of the light and the substrate such that the another sub-volume is within an illumination volume of the light.

7. The method of claim 1 , wherein processing the image comprises detecting changes in contrast in the image.

8. The method of claim 1 , wherein the minimum transverse dimension is a minimum diameter of the through hole between the first side and the second side of the through hole.

9. The method of claim 1 , wherein the through hole comprises an hour glass cross-sectional profile.

10. A system for measuring geometric parameters of through holes in a substrate, comprising:
a camera comprising an image sensor and a lens having a depth of field greater than a thickness of the substrate, the image sensor having a pixel count of at least 10 megapixels and a pixel size of 1.7 microns or less, the camera positioned at a select working distance relative to the substrate such that a select sub-volume of the substrate is within a field of view of the camera and within the depth of field;
a lighting arrangement comprising a telecentric illuminator for illuminating the select sub-volume; and
a processor configured to receive image data from the camera and measure from the image data at least a minimum transverse dimension of a through hole in the select sub-volume along a length of the through hole,
wherein the select sub-volume has a front side and a back side, the front side being in opposing relation relative to the lens,
wherein the lighting arrangement comprises a light source positioned to direct a light beam at the back side of the select sub-volume, the camera and light source being arranged on opposite sides of the substrate, and
wherein the at least one through hole has a first side at the front side of the select sub-volume and a second side at the back side of the select sub-volume and the minimum transverse dimension of the through hole is disposed between the first side and the second side of the through hole.

11. The system of claim 10 , wherein the lens is a telecentric lens.

12. The system of claim 10 , further comprising a translation mechanism coupled to the substrate and operable to translate the substrate laterally relative to the camera.

13. The system of claim 10 , wherein the minimum transverse dimension is a minimum diameter of the through hole between the first side and the second side of the through hole.

14. The system of claim 10 , wherein the through hole comprises an hour glass cross-sectional profile.

Assignees

• Corning Inc

Inventors

• Goers Uta-Barbara
• Sharps Robert Wendell

Classifications

• G01B11/12 Primary

  internal diameters · CPC title

• G01B11/08

  for measuring diameters · CPC title

• G01B7/13

  Internal diameters · CPC title

• G01B7/12 Primary

  for measuring diameters · CPC title

• G06T2207/10028

  Range image; Depth image; 3D point clouds · CPC title