MEMS assembly

Patent metadata

Field	Value
Publication number	US-10793419-B2
Application number	US-201916270315-A
Country	US
Kind code	B2
Filing date	Feb 7, 2019
Priority date	Mar 1, 2018
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A MEMS assembly includes a housing having an internal volume V, wherein the housing has a sound opening to the internal volume V, a MEMS component in the housing adjacent to the sound opening, and a layer element arranged at least regionally at a surface region of the housing that faces the internal volume V, wherein the layer element includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.

First claim

What is claimed is:

1. A MEMS assembly comprising:
a housing having an internal volume,
a MEMS component in the housing, and
a layer element arranged at least regionally at a surface region of the housing that faces the internal volume,
wherein the layer element comprises a layer material having a lower thermal conductivity than a housing material of the housing that adjoins the layer element, wherein the housing comprises a substrate and a covering element configured to be electrically conductive at least regionally, and wherein at least a portion of the covering element directly faces the internal volume.

2. The MEMS assembly as claimed in claim 1 , wherein the layer element comprises a layer material having a higher heat capacity than the housing material of the housing that adjoins the layer element.

3. The MEMS assembly as claimed in claim 1 , wherein the layer element is arranged at least regionally at the covering element.

4. The MEMS assembly as claimed in claim 1 , wherein the thermal conductivity of the layer material of the layer element is lower by a factor of at least five than the thermal conductivity of the housing material of the housing that adjoins the layer element.

5. The MEMS assembly as claimed in claim 2 , wherein the heat capacity of the layer material of the layer element is higher at least by a factor of five than the heat capacity of the housing material of the housing that adjoins the layer element.

6. The MEMS assembly as claimed in claim 5 , wherein the layer element or a layer sequence comprising the layer element and the housing material of the housing that adjoins said layer element is configured as a thermal low-pass filter arrangement for temperature changes with a change cut-off frequency f cut-off ≤20 Hz.

7. The MEMS assembly as claimed in claim 6 , wherein the thermal low-pass filter arrangement at least reduces introduction of thermal fluctuations on account of pulsed electromagnetic interference radiation having a pulse frequency of 20 Hz or higher into the internal volume of the housing.

8. The MEMS assembly as claimed in claim 1 , wherein the covering element is configured as electrically conductive and is electrically connected to a conductive structure at the substrate.

9. The MEMS assembly as claimed in claim 1 , wherein the MEMS component furthermore comprises a circuit device in the internal volume of the housing.

10. The MEMS assembly as claimed in claim 9 , wherein the MEMS component is configured as a MEMS sound transducer or a MEMS microphone comprising a membrane structure and an assigned counterelectrode structure.

11. The MEMS assembly as claimed in claim 10 , wherein the circuit device is electrically coupled to the MEMS component, wherein the circuit device is furthermore configured to detected an output signal of the MEMS component on the basis of a deflection of the membrane structure relative to the counterelectrode structure, said deflection being brought about by an acoustic sound pressure change.

12. The MEMS assembly as claimed in claim 1 , wherein the layer element comprises a plastics material or a glass material as layer material.

13. The MEMS assembly as claimed in claim 12 , wherein the layer element comprises a multilayered layer material having a plurality of plastics material layers and/or glass material layers.

14. The MEMS assembly as claimed in claim 12 , wherein the plastics material comprises a polyimide material and/or an SU-8 material.

15. The MEMS assembly as claimed in claim 1 , wherein the covering element comprises a conductive, metallic housing material.

16. The MEMS assembly as claimed in claim 1 , wherein the housing comprises an opening to the internal volume, and wherein the MEMS component is configured in the housing adjacent to the opening.

Assignees

• Infineon Technologies Ag

Inventors

• Fueldner Marc
• De Milleri Niccolo
• Goller Bernd
• Krumbein Ulrich
• Lohninger Gerhard
• Tosolini Giordano
• Wiesbauer Andreas

Classifications

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title

• B81B2207/09

  Packages · CPC title