Additive manufacturing

US10792906B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10792906-B2
Application numberUS-201615074617-A
CountryUS
Kind codeB2
Filing dateMar 18, 2016
Priority dateMar 18, 2015
Publication dateOct 6, 2020
Grant dateOct 6, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of additive manufacturing metal components includes selecting a first component to be formed in a layer-by-layer process, and providing at least a second component to be formed in the same layer-by layer process. The components being selected such that the stresses created in the components during additive manufacturing are substantially balanced. The method further includes separating the components after completion of the layer-by-layer process.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of additive manufacturing metal components, the method comprising the steps of: selecting a first component to be formed in a layer-by-layer process during which layers of a powder are melted iteratively to form a structure; selecting at least a second component to be formed in the same layer-by layer process; forming the structure, wherein the structure comprises the first component, the second component, and a linking arrangement connecting the first component and the second component simultaneously via the layer-by-layer process, wherein in a direction of buildup a last-formed end of the first component and a last-formed end of the second component extend above and are thereby not in direct contact with the linking arrangement; and separating the first component from the second component after completion of the layer-by-layer process; wherein the structure is configured such that stresses formed in the first component are balanced by stresses formed in the second component. 2. The method of claim 1 , wherein the linking arrangement is sacrificial. 3. The method of claim 1 , wherein the structure comprises an additional component and a further additional component. 4. The method of claim 1 , wherein the first and second components are treated to remove residual stress prior to the step of separating the first and second components. 5. The method of claim 1 , wherein the first and second components are formed on a common substrate. 6. The method of claim 5 , further comprising: removing the first and second components from the common substrate; wherein the first and second components are treated to remove residual stress prior to the removing the first and second components from the common substrate. 7. The method of claim 1 , further comprising: producing a plurality of pairs of the first component and the second component during a single process. 8. The method of claim 1 , wherein the layer-by-layer process comprises powder bed selective laser manufacturing. 9. A method of powder bed selective laser manufacturing of metal components, the method comprising the steps of: forming a structure in a layer-by-layer process during which layers of a powder are melted iteratively; wherein the structure comprises, in sequence along a closed curve shape of the structure, a first component, a first linking arrangement connected to the first component, a second component connected to the first linking arrangement, a second linking arrangement connected to the second component, a third component connected to the second linking arrangement, and a third linking arrangement connected to the third component; and separating the first component, the second component, and the third component after completion of the layer-by-layer process; wherein no part of the structure is formed within the closed curve shape during the layer-by-layer process. 10. The method of claim 9 , wherein the linking arrangements comprise sacrificial structures. 11. The method of claim 9 , wherein the structure is formed on a substrate. 12. The method of claim 10 , wherein the structure are formed on a substrate. 13. The method of claim 9 , wherein each linking arrangement comprises a curved link. 14. A method of additive manufacturing metal components, comprising: forming a first component, a second component, and a linking arrangement simultaneously in a layer-by-layer process during which layers of a powder are melted iteratively; wherein a first-formed end of the first component is set apart from a first-formed end of the second component, wherein a last-formed end of the first component abuts or joins a last-formed end of the second component, and wherein the linking arrangement connects the first component to the second component; and separating the linking arrangement from the first component and from the second component after completion of the layer-by-layer process.

Assignees

Inventors

Classifications

  • B22F10/28Primary

    Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • Platforms or substrates · CPC title

  • by thermal means (control of energy beam parameters for post heating B22F10/364) · CPC title

  • characterised by structural features · CPC title

  • Process efficiency · CPC title

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What does patent US10792906B2 cover?
A method of additive manufacturing metal components includes selecting a first component to be formed in a layer-by-layer process, and providing at least a second component to be formed in the same layer-by layer process. The components being selected such that the stresses created in the components during additive manufacturing are substantially balanced. The method further includes separating…
Who is the assignee on this patent?
Siemens Ag, Siemens Aktiengesellchaft
What technology area does this patent fall under?
Primary CPC classification B22F10/28. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 06 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).