Lapping carrier system with optimized carrier insert

Patent metadata

Field	Value
Publication number	US-10792786-B2
Application number	US-201815894081-A
Country	US
Kind code	B2
Filing date	Feb 12, 2018
Priority date	Feb 12, 2018
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

Embodiments of the present disclosure demonstrate a lapping carrier system for a bar to be lapped. The lapping carrier system may be configured with a single piece insert whose bridge is separated from a plurality of joints of the carrier insert by a varying distance. The varying distance can be greater at a medial portion of the bridge than at an end portion of the bridge to collectively form a parabolic shape. In some embodiments, a lapping insert can include a bridge with its length longer than the bar. In some embodiments in a lapping insert, the centerline between the end joint edge and the end finger edge extends beyond the edge of bar.

First claim

What is claimed is:

1. An apparatus comprising a bridge of a carrier insert positioned on one edge of the carrier insert and connectable to a bar separated from a first joint of the carrier insert by a first distance at a medial portion of the bridge and separated from a second joint of the carrier insert by a second distance, the second joint positioned closer to an edge of the bridge than the first joint, the first distance being greater than the second distance.

2. The apparatus of claim 1 , wherein the first joint is aligned with a medial portion of the bar, the second joint aligned with an end portion of the bar.

3. The apparatus of claim 1 , wherein the first joint continuously extends to a slot.

4. The apparatus of claim 3 , wherein the first joint has a joint width that is greater than a slot width of the slot.

5. The apparatus of claim 3 , wherein the first joint and slot physically separate fingers of the carrier insert.

6. The apparatus of claim 1 , wherein the bridge having a length longer than the bar.

7. The apparatus of claim 1 , wherein the second joint has a different joint width than the first joint, enabling for the joint edge on edge fingers to move outwards.

8. The apparatus of claim 1 , wherein a centerline between an end joint edge and an end finger edge extends beyond an edge of bar.

9. The apparatus of claim 1 , wherein the bar comprises a plurality of transducing heads.

10. An apparatus comprising a bridge of a carrier insert positioned on one edge of the carrier insert and connectable to a bar separated from a plurality of joints of the carrier insert by a varying distance, the varying distance being greater at a medial portion of the bridge than at an end portion of the bridge.

11. The apparatus of claim 10 , wherein the plurality of joints collectively have a parabolic shape.

12. The apparatus of claim 10 , wherein the bridge is separated from the plurality of joints by a bridge body.

13. The apparatus of claim 12 , wherein the bridge body is continuously solid.

14. The apparatus of claim 10 , wherein the carrier insert is formed as a single piece of material.

15. The apparatus of claim 10 , wherein the plurality of joints define a plurality of fingers, each finger of the plurality of fingers being individually articulated to apply force to different portions of the bar.

16. The apparatus of claim 10 , wherein the varying distance continuously decreases from the medial portion of the bar to the end portion of the bar.

17. A method comprising:
attaching a bar to a bridge of a carrier insert, the bridge separated from a plurality of joints of the carrier insert by a varying distance, the varying distance being greater at a medial portion of bar than at an end portion of the bar; and
lapping the bar against an abrasive surface to form an air bearing surface for at least one transducing head of the bar.

18. The method of claim 17 , wherein the bar is formed by slicing a wafer into multiple chunks and subsequently slicing at least one chunk into multiple bars.

19. The method of claim 17 , further comprising cutting the bar into multiple separate transducing heads after the lapping step.

20. The method of claim 17 , wherein a variable resistance sensor detects target lapping height of the transducing head by measuring resistance during lapping.

Assignees

• Seagate Technology Llc

Inventors

• Xiong Yuhong
• Habermas Andrew David
• Goh Kok Yen
• Hew Pengkoon

Classifications

• G11B5/3173

  Batch fabrication, i.e. producing a plurality of head structures in one batch · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title

• B24B37/048

  of sliders and magnetic heads of hard disc drives or the like · CPC title

• B24B37/30 Primary

  for single side lapping of plane surfaces · CPC title

• G11B5/3169

  Working or finishing the interfacing surface of heads, e.g. lapping of heads · CPC title