Sensor circuit and method for compensating for temperature changes

Patent metadata

Field	Value
Publication number	US-10791589-B2
Application number	US-201815879110-A
Country	US
Kind code	B2
Filing date	Jan 24, 2018
Priority date	Jan 26, 2017
Publication date	Sep 29, 2020
Grant date	Sep 29, 2020

Abstract

A sensor circuit and a method for compensating for temperature changes are provided. In accordance with an embodiment, sensor circuit includes at least one sensor for determining a measurement variable; a heating structure; and at least one compensation circuit. The compensation circuit is configured to acquire information about a temperature change in an environment of the sensor, and to counteract a temperature change in the sensor on the basis of the information by driving the heating structure.

First claim

What is claimed is:

1. A sensor circuit, comprising:
at least one sensor for determining a measurement variable;
a heating structure; and
at least one compensation circuit, wherein the compensation circuit is configured to acquire information about a temperature change in an environment of the sensor, and to counteract a temperature change in the sensor on the basis of the information by driving the heating structure,
wherein a power loss of the heating structure is adapted to a power loss of a device provided in the environment of the at least one sensor, such that a temperature influencing the at least one sensor is kept at a predefined value.

2. The sensor circuit as claimed in claim 1 , wherein the sensor is at least one of a microphone, a temperature sensor, a pressure sensor or a gas sensor.

3. The sensor circuit as claimed in claim 1 , wherein the compensation circuit is configured to counteract the temperature change by changing a power loss of the heating structure.

4. The sensor circuit as claimed in claim 3 , wherein the compensation circuit is configured to compensate for a temperature increase in the environment of the sensor by of reducing the power loss of the heating structure, and configured to compensate for a temperature reduction in the environment of the sensor by increasing the power loss of the heating structure.

5. The sensor circuit as claimed in claim 3 , wherein the heating structure comprises at least one variable resistor, wherein the at least one variable resistor generates the power loss, or
wherein the heating structure comprises at least one field effect transistor configured to generate the power loss.

6. The sensor circuit as claimed in claim 3 , wherein the heating structure comprises at least one distributed digital field effect transistor array having a nonuniform distribution of a compensating heating power in the array, wherein the at least one distributed digital field effect transistor array is configured to generate the power loss.

7. The sensor circuit as claimed in claim 1 , wherein the compensation circuit is disposed alongside the at least one sensor in the sensor circuit.

8. The sensor circuit as claimed in claim 1 , wherein the compensation circuit is configured to acquire the information about the temperature change in the environment of the sensor in the form of a periodic and/or a discrete switch-on and switch-off sequence, and
wherein the compensation circuit is further configured to activate or to deactivate the heating structure oppositely to the switch-on and switch-off sequence.

9. The sensor circuit as claimed in claim 1 ,
wherein the compensation circuit comprises a switching device, a voltage supply and the heating structure in a series connection; and
wherein the compensation circuit further comprises an inverter, wherein the inverter is connected upstream of the switching device, and the switching device is an electromechanically actuatable switch.

10. The sensor circuit as claimed in claim 9 , wherein the compensation circuit further comprises a differential amplifier and a digital-to-analog converter, wherein the differential amplifier is connected upstream of the switching device and an input of the differential amplifier is coupled to an output of the digital-to-analog converter, wherein the digital-to-analog converter is configured to acquire the information about the temperature change in the environment of the sensor circuit as a digital signal,
wherein the differential amplifier is configured to produce an output signal that activates or deactivates the switching device, and
wherein the switching device is a transistor.

11. The sensor circuit as claimed in claim 1 , wherein the sensor circuit is provided in a smartphone or in a tablet.

12. The sensor circuit as claimed in claim 1 , wherein the sensor circuit is a Micro-Electro-Mechanical System (MEMS) or an application-specific integrated circuit (ASIC).

13. The sensor circuit as claimed in claim 1 , wherein the information comprises an envelope signal of a radio-frequency power amplifier or a time division multiple access (TDMA) signal of a power amplifier.

14. A method for compensating for temperature changes, comprising:
acquiring information about a temperature change in an environment of at least one sensor; and
driving a heating structure on the basis of the acquired information in order to counteract a temperature change in the at least one sensor,
wherein a power loss of the heating structure is adapted to a power loss of a device provided in the environment of the at least one sensor, such that a temperature influencing the at least one sensor is kept at a predefined value.

15. The method as claimed in claim 14 , wherein acquiring the information comprises receiving information regarding operation of a power amplifier and/or regarding operation of an antenna in a smartphone or in a tablet.

16. The method as claimed in claim 14 ,
wherein driving the heating structure comprises counteracting a temperature increase in the environment of the at least one sensor by reducing a power loss of the heating structure, and
wherein driving the heating structure comprises counteracting a temperature decrease in the environment of the at least one sensor by increasing the power loss of the heating structure;
wherein counteracting a temperature increase in the environment of the at least one sensor comprises deactivating the heating structure; and
wherein counteracting a temperature decrease in the environment of the at least one sensor comprises activating the heating structure.

17. The method as claimed in claim 14 , wherein acquiring the information and driving the heating structure are carried out dynamically.

18. The method as claimed in claim 14 ,
wherein adapting the power loss of the heating structure comprises adapting a supply voltage or a resistance value of a resistor to the power loss of the device provided in the environment of the at least one sensor.

19. The method as claimed in claim 18 , wherein the power loss of the heating structure is repeatedly adapted to the power loss of the device provided in the environment of the at least one sensor.

Assignees

• Infineon Technologies Ag

Inventors

• Krumbein Ulrich
• Simbuerger Werner
• Straeussnigg Dietmar
• Wiesbauer Andreas

Classifications

• G01N33/0073 Primary

  Control unit therefor · CPC title

• G01L9/125

  with temperature compensating means (non electric temperature compensating means G01L19/04) · CPC title

• H04R9/022

  Cooling arrangements · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• G01L19/0092

  Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature (G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26) · CPC title