FET operational temperature determination by gate structure resistance thermometry

Patent metadata

Field	Value
Publication number	US-10790787-B2
Application number	US-201916537862-A
Country	US
Kind code	B2
Filing date	Aug 12, 2019
Priority date	Jul 24, 2017
Publication date	Sep 29, 2020
Grant date	Sep 29, 2020

Abstract

Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.

First claim

What is claimed is:

1. A field-effect transistor with temperature sensing comprising:
a gate;
a floating gate plate adjacent to the gate and having an extended length;
a source contact;
a drain contact;
a first pair of contact tabs connected to the floating gate plate and separated by a first distance for applying a probe current through the floating gate plate; and
a second pair of contact tabs connected to the floating gate plate and separated by a second distance for sensing a voltage across a region of the floating gate plate through which the probe current flows.

2. The field-effect transistor of claim 1 , wherein the floating gate plate overlays at least a portion of the gate.

3. The field-effect transistor of claim 1 , wherein the floating gate plate exhibits a change in resistance with a change in temperature of the floating gate plate that is not less than 0.001 ohms/° C.

4. The field-effect transistor of claim 1 , wherein the first pair of contact tabs comprises a first thin-film resistor and a second thin-film resistor.

5. The field-effect transistor of claim 4 , wherein a resistance of the first thin-film resistor and of the second thin-film resistor is not less than 300 ohms.

6. The field-effect transistor of claim 4 , wherein the second pair of contact tabs comprises a third thin-film resistor and a fourth thin-film resistor.

7. The field-effect transistor of claim 6 , wherein a resistance of the third thin-film resistor and of the fourth thin-film resistor is not less than 300 ohms.

8. The field-effect transistor of claim 1 , further comprising a source of the probe current connected to the first pair of contact tabs.

9. The field-effect transistor of claim 8 , wherein the source of the probe current is configured to provide alternating current.

10. The field-effect transistor of claim 8 , wherein the alternating current has a frequency between 50 kilohertz and 5 megahertz.

11. The field-effect transistor of claim 1 , further comprising voltage-sensing circuitry connected to the second pair of contact tabs.

12. The field-effect transistor of claim 11 , wherein the voltage-sensing circuit provides an output signal to a feedback circuit that controls a power level of the field-effect transistor.

13. The field-effect transistor of claim 1 , wherein the field-effect transistor is incorporated in a power amplifier configured to amplify signals to a power level of not less than 0.25 Watt.

14. The field-effect transistor of claim 1 , further comprising an active area controlled by the gate, wherein the active area comprises GaN, GaAs, or InP.

15. The field-effect transistor of claim 1 , further comprising an active area controlled by the gate, wherein the active area comprises Si.

16. The field-effect transistor of claim 1 , wherein the field-effect transistor is an LDMOS FET, MOSFET, MISFET, or MODFET.

17. The field-effect transistor of claim 1 , wherein the field-effect transistor is an HEMT, HFET, or pHEMT.

18. A field-effect transistor with temperature sensing comprising:
a gate metal having an extended length with a first end and an opposing second end;
a source contact;
a drain contact;
a first contact tab connected to the gate metal near the first end for applying an alternating probe current to the gate metal;
a capacitor and resistor connected in series between a reference potential and an end region of the gate metal that is remote from the first end; and
a pair of contact tabs connected to separated regions of the gate metal for sensing a voltage drop along the gate metal in response to the alternating probe current.

19. The field-effect transistor of claim 18 , further comprising a source of the probe current connected to the first contact tab.

20. The field-effect transistor of claim 19 , wherein the alternating probe current has a frequency between 50 kilohertz and 5 megahertz.

21. The field-effect transistor of claim 18 , further comprising voltage-sensing circuitry connected to the pair of contact tabs.

22. The field-effect transistor of claim 21 , wherein the voltage-sensing circuit provides an output signal to a feedback circuit that controls a power level of the field-effect transistor.

23. The field-effect transistor of claim 18 , wherein the field-effect transistor is incorporated in a power amplifier configured to amplify signals to a power level of not less than 0.25 Watt.

24. The field-effect transistor of claim 18 , further comprising an active area controlled by the gate metal, wherein the active area comprises GaN, GaAs, or InP.

25. The field-effect transistor of claim 18 , further comprising an active area controlled by the gate metal, wherein the active area comprises Si.

26. The field-effect transistor of claim 18 , wherein the field-effect transistor is an LDMOS FET, MOSFET, MISFET, or MODFET.

27. The field-effect transistor of claim 18 , wherein the field-effect transistor is an HEMT, HFET, or pHEMT.

28. A field-effect transistor with temperature sensing comprising:
a gate metal having an extended length with a first end and a second end;
a source;
a drain; and
a first contact tab connected to a first end region of the gate metal near the first end and configured for applying an alternating probe current to the gate metal, wherein no other contact tab is connected to the gate metal for conducting the probe current and wherein essentially all of the probe current, when applied, couples to a source of the field-effect transistor.

29. The field-effect transistor of claim 28 , further comprising a pair of contact tabs connected to separated regions of the gate metal for sensing a voltage drop along the gate metal in response to the alternating probe current.

30. The field-effect transistor of claim 29 , further comprising voltage-sensing circuitry connected to the pair of contact tabs.

31. The field-effect transistor of claim 28 , wherein the alternating probe current has a frequency between 50 kilohertz and 5 megahertz.

32. The field-effect transistor of claim 28 , wherein the field-effect transistor is incorporated in a power amplifier configured to amplify signals to a power level of not less than 0.25 Watt.

33. The field-effect transistor of claim 28 , further comprising an active area controlled by the gate metal, wherein the active area comprises GaN, GaAs, or InP.

34. The field-effect transistor of claim 28 , further comprising an active area controlled by the gate metal, wherein the active area comprises Si.

35. The field-effect transistor of claim 28 , wherein the field-effect transistor is an LDMOS FET, MOSFET, MISFET, or MODFET.

36. The field-effect transistor of claim 28 , wherein the field-effect transistor is an HEMT, HFET, or pHEMT.

Assignees

• Macom Tech Solutions Holdings Inc

Inventors

• Mahon Simon John
• Hanson Allen W
• Lian Chuanxin
• Gao Frank
• Baskaran Rajesh
• Schwitter Bryan

Classifications

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10W20/20

  Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] · CPC title

• H10D64/257

  for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes (source or drain electrodes of TFTs H10D30/673) · CPC title

• H10D62/8503

  Nitride Group III-V materials, e.g. AlN or GaN · CPC title

• H10D62/85

  being Group III-V materials, e.g. GaAs · CPC title