Case heat dissipation unit of handheld electronic device

Patent metadata

Field	Value
Publication number	US-10785894-B2
Application number	US-201816033170-A
Country	US
Kind code	B2
Filing date	Jul 11, 2018
Priority date	Dec 11, 2013
Publication date	Sep 22, 2020
Grant date	Sep 22, 2020

Abstract

A case heat dissipation unit of handheld electronic device includes a back cover including a ceramic layer. A titanium metal layer or a stainless steel metal layer is disposed on the ceramic layer in a position corresponding to at least one heat source. The ceramic layer is an outer surface of the handheld electronic device and exposed to an external environment. The titanium metal layer or the stainless steel metal layer faces a receiving space of the handheld electronic device in contact with the heat source in the receiving space. The titanium metal layer or the stainless steel metal layer serves to absorb the heat generated by the heat source and transfer the heat to the ceramic layer for dissipating the heat.

First claim

What is claimed is:

1. A case heat dissipation unit for a handheld electronic device, comprising a back cover for assembling to a case of a handheld electronic device, the case defining a receiving space covered by a front face having a touch screen provided thereon, the back cover closing the receiving space and including an outer ceramic layer, and one of a titanium and a stainless steel inner layer being disposed on the ceramic layer and including a first portion in a position overlaying at least one heat source and a second portion extending away from the at least once heat source, the ceramic layer being an outer surface of the back cover of the handheld electronic device and exposed to an external environment, the one of a titanium and the stainless steel layer overlaying the receiving space of the handheld electronic device and in with the first portion in contact with the heat source in the receiving space, the one of the titanium and the stainless steel layer serving to conduct the heat generated by the heat source to the ceramic layer for dissipating the heat;
wherein only a predetermined area of the ceramic layer corresponding to the first and second portion of the titanium layer and stainless steel layer are shaped, so that the one of the titanium layer and stainless steel layer will not adversely affect operation of an antenna structure contained within said case.

2. The case heat dissipation unit of handheld electronic device as claimed in claim 1 , wherein at least one side of the receiving space is an open side, the back cover being correspondingly mated with the open side to close the receiving space.

3. The case heat dissipation unit of handheld electronic device as claimed in claim 1 , wherein when the inner layer is a titanium layer and includes pure titanium or a titanium alloy.

4. The case heat dissipation unit of handheld electronic device as claimed in claim 1 , wherein the ceramic layer and the one of the titanium and stainless steel inner layer are bonded to one another in a stacked relation.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Yang Hsiu-Wei

Classifications

• H04B1/036 Primary

  Cooling arrangements · CPC title

• F28F21/083

  from stainless steel · CPC title

• H04M1/0202

  Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03) · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title