Blank card with scalable airflow impedance for electronic enclosures
US-2017347495-A1 · Nov 30, 2017 · US
US10779449B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-10779449-B1 |
| Application number | US-201916381615-A |
| Country | US |
| Kind code | B1 |
| Filing date | Apr 11, 2019 |
| Priority date | Apr 11, 2019 |
| Publication date | Sep 15, 2020 |
| Grant date | Sep 15, 2020 |
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An air-moving device with electromagnetic interference (EMI) reduction is provided. The air moving device, which may be embodied as a fan, includes a motor, one or more blades coupled to the motor, and each of the one or more blades comprising EMI absorbent material.
Opening claim text (preview).
What is claimed is: 1. A fan, for electromagnetic interference (EMI) reduction, comprising: a motor; an impeller attached to the motor; and the impeller comprising a hub and at least one blade arranged as a screw thread, the impeller configured as an auger and comprising an EMI absorbent material, wherein the at least one blade wraps around the hub for at least half a rotation. 2. The fan of claim 1 , wherein the impeller is coated with the EMI absorbent material. 3. The fan of claim 1 , further comprising: the EMI absorbent material comprising ferrite material having magnetic domains of an order of microscale or nanoscale. 4. The fan of claim 1 , further comprising: the EMI absorbent material comprising ferrite material having unaligned dipoles. 5. The fan of claim 1 , further comprising: the EMI absorbent material comprising powdered iron with at least one of a filler, bonding agent, glue or resin. 6. The fan of claim 1 , further comprising: the impeller comprising electrically conductive metal with an EMI absorbent coating. 7. The fan of claim 1 , further comprising: the impeller is electrically insulated or electrically connected relative to an enclosure of the fan. 8. The fan of claim 1 , wherein the EMI absorbent material comprises a magnetic field attenuation material. 9. The fan of claim 1 , wherein the fan is configured to be housed in an enclosure of a computing device. 10. The fan of claim 1 , wherein the at least one blade is gapless. 11. A fan-cooled enclosure with electromagnetic interference (EMI) reduction, comprising: an electrically grounded enclosure, having an aperture to support airflow, wherein the aperture is of sufficient size to admit EMI; a motorized fan coupled to the aperture to support the airflow; and the motorized fan having an impeller comprising a hub and at least one blade arranged as a screw thread, the impeller configured as an auger and comprising an EMI absorbent material, wherein the at least one blade wraps around the hub for at least half a rotation. 12. The fan-cooled enclosure of claim 11 , further comprising: electrical connection of the one or more blades to the enclosure. 13. The fan-cooled enclosure of claim 11 , further comprising: the one or more blades electrically isolated from or floating relative to the enclosure. 14. The fan-cooled enclosure of claim 11 , wherein the one or more blades comprising EMI absorbent material are each coated with ferrite material. 15. The fan-cooled enclosure of claim 11 , wherein the EMI absorbent material comprises powdered ferrite. 16. An air-moving device with electromagnetic interference (EMI) reduction, comprising: a motor; one or more blades arranged as screw threads coupled to a hub, wherein the one or more blades and the hub are configured as an auger and the hub is coupled to the motor, and wherein the one or more blades wrap around the hub for at least half a rotation; and each of the one or more blades and the hub consisting of EMI absorbent material. 17. The air-moving device of claim 16 , further comprising: the one or more blades arranged to rotate, driven by the motor. 18. The air-moving device of claim 16 , further comprising: the one or more blades arranged to reciprocate, driven by the motor. 19. The air-moving device of claim 16 , wherein the EMI absorbent material comprises ferrite in powdered form in at least one of a filler, bonding agent, glue or resin.
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