Device for cooling a power electronics circuit

Patent metadata

Field	Value
Publication number	US-10779446-B2
Application number	US-201716317210-A
Country	US
Kind code	B2
Filing date	Jul 10, 2017
Priority date	Jul 12, 2016
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

Device (1) for cooling at least one power electronics circuit (4), including: a liquid-cooled heatsink (2); and an interface plate (3) that is in thermal contact with the heatsink (2) and to which the one or more power electronics circuits (4) are attached, the interface plate (3), including at least one thermosiphon (6), being removably mounted on the heatsink (2) so as to be capable of being separated therefrom with the one or more electronic circuits (4) attached thereto.

First claim

The invention claimed is:

1. A cooling device for cooling at least one power electronics circuit, comprising:
a liquid-cooled heatsink; and
an interface plate in thermal contact with the heatsink and on which the power electronics circuit or circuits is or are fixed,
the interface plate, which comprises at least one thermosiphon, being mounted removably on the heatsink so that it can be detached therefrom with the electronics circuit or circuits fixed on it.

2. The cooling device as claimed in claim 1 , the interface plate being made of copper or of aluminum.

3. The cooling device as claimed in claim 1 , the interface plate having a face for accepting the circuit or circuits of which the extent is at least substantially equal to that of the heatsink with which the plate is in contact.

4. The cooling device as claimed in claim 1 , the interface plate, the circuit or circuits to be cooled, and the heatsink being superposed without appreciable overhang.

5. The cooling device as claimed in claim 1 , the interface plate comprising a first part completely covering the heatsink and a second part connected to the first by said at least one thermosiphon and surmounted by the circuit or circuits to be cooled.

6. The cooling device as claimed in claim 1 , the heatsink comprising one or more heat pipes.

7. An assembly comprising a cooling device as claimed in claim 1 and at least one electronics circuit to be cooled fixed on top.

8. The assembly as claimed in claim 7 , the power dissipated by each circuit being greater than or equal to 1 kW.

9. The assembly as claimed in claim 7 , the electronics circuit or circuits comprising and/or being made up of one or more power components selected from power transistors of the IGBT or MOSFET type.

10. A speed variator for an electric motor comprising an assembly as claimed in claim 7 .

11. An assembly comprising at least one power electronics circuit and a cooling device for cooling said at least one power electronics circuit, the cooling device comprising:
a liquid-cooled heatsink; and
an interface plate in thermal contact with the heatsink and on which the power electronics circuit or circuits is or are fixed,
the interface plate being mounted removably on the heatsink so that it can be detached therefrom with the electronics circuit or circuits fixed on it, the circuit or circuits to be cooled being laterally offset with respect to the heatsink.

12. An assembly comprising at least one power electronics circuit and a cooling device for cooling said at least one power electronics circuit, the cooling device comprising:
a liquid-cooled heatsink; and
an interface plate in thermal contact with the heatsink and on which the power electronics circuit or circuits is or are fixed,
the interface plate being mounted removably on the heatsink so that it can be detached therefrom with the electronics circuit or circuits fixed on it, each electronics circuit comprising a thermal sole plate, that comes into contact with the interface plate.

Assignees

• Leroy Somer Moteurs

Inventors

• Bourlier Ludovic
• Courage Aurelien
• Crespo Thierry

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H05K7/20936

  Liquid coolant with phase change · CPC title