Shorting pattern between pads of a camera module

Patent metadata

Field	Value
Publication number	US-10779403-B2
Application number	US-201816136315-A
Country	US
Kind code	B2
Filing date	Sep 20, 2018
Priority date	Sep 20, 2018
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

An apparatus includes a substrate, a first conductive pad and a second conductive pad, both disposed on the substrate, an electrically conductive trace, and a fusible alloy layer. The electrically conductive trace is laid out between the first and second pads, and is configured to conduct electrical current between the first and second pads, and has a serpentine pattern having multiple bends. The fusible alloy layer is disposed on the first pad and over a portion of the trace including no more than a predefined number of the bends.

First claim

The invention claimed is:

1. Apparatus, comprising:
a substrate;
a first conductive pad and a second conductive pad, both disposed on the substrate;
an electrically conductive trace having a serpentine pattern comprising at least first and second bends, wherein the serpentine pattern is laid out within a margin area located between a first edge of the first pad and a second edge of the second pad, such that a first end of the serpentine pattern ends at the first conductive pad, and a second end of the serpentine pattern ends at the second conductive pad; and
a fusible alloy layer, which is disposed on the first pad and over the first bend of the serpentine pattern, wherein the serpentine pattern is shaped to prevent the fusible alloy from reaching the second bend and the second pad.

2. The apparatus according to claim 1 , wherein the fusible alloy is configured to maintain physical contact with a surface of the electrically conductive trace and is further configured not to maintain contact with material located between the at least first and second bends.

3. The apparatus according to claim 2 , wherein the material comprises a surface of the substrate.

4. The apparatus according to claim 1 , wherein the fusible alloy is configured to retain a portion thereof on the first pad.

5. The apparatus according to claim 1 , wherein the fusible alloy comprises a braze alloy.

6. The apparatus according to claim 1 , wherein the fusible alloy comprises a solder alloy.

7. The apparatus according to claim 1 , wherein the first conductive pad surrounds the second conductive pad.

8. The apparatus according to claim 1 , wherein the first and second edges are facing one another.

9. The apparatus according to claim 1 , wherein the first and second edges are not facing one another.

10. The apparatus according to claim 1 , wherein the fusible alloy layer is configured to flow between the first pad and the electrically conductive trace.

11. The apparatus according to claim 1 , and comprising a device coupled to the second pad.

12. The apparatus according to claim 11 , wherein the device comprises a high-power vertical-cavity surface-emitting laser (VCSEL).

13. The apparatus according to claim 11 , wherein the device comprises an image sensor.

14. A camera module, comprising:
an optoelectronic assembly, comprising:
a substrate;
a first conductive pad and a second conductive pad, both disposed on the substrate;
an electrically conductive trace having a serpentine pattern comprising at least first and second bends, wherein the serpentine pattern is laid out within a margin area located between a first edge of the first pad and a second edge of the second pad, such that a first end of the serpentine pattern ends at the first conductive pad, and a second end of the serpentine pattern ends at the second conductive pad;
a fusible alloy layer, which is disposed on the first pad and over the first bend of the serpentine pattern, wherein the serpentine pattern is shaped to prevent the fusible alloy from reaching the second bend and the second pad; and

optics assembly, which comprises an optical path, and which is configured to transfer the optical signals to or from the device.

Assignees

• Apple Inc

Inventors

• Morita Masahito
• Webster Steven

Classifications

• H04N23/50

  Constructional details · CPC title

• H05K1/0296 Primary

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K2201/10151

  Sensor · CPC title