Plug housing for a sensor device and plug module

US10777944B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10777944-B2
Application numberUS-201515509223-A
CountryUS
Kind codeB2
Filing dateJul 24, 2015
Priority dateSep 22, 2014
Publication dateSep 15, 2020
Grant dateSep 15, 2020

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A plug module includes a sensor device and a plug housing, the plug housing including a socket, an inner side of which includes a receptacle area for accommodating the sensor device, and a cover that is connected to the socket with the aid of a fastening device, where a plurality of electrically conductive straight contact pins are introduced into the cover in such a way that (a) particular first ends of the contact pins protrude into an internal volume of the plug housing and are situated above the receptacle area of the socket, and (b) particular second ends of the contact pins are situated in the area of a connector of the cover.

First claim

Opening claim text (preview).

What is claimed is: 1. A plug module, comprising: a plug housing, including: a socket having an inner side which includes a receptacle area located above and in a different plane than the inner side; a sensor device situated in the receptacle area of the socket; and a cover connected to the socket with a fastening device; wherein the fastening device is a locking device that includes elastic latching tabs, situated on a circumferential edge formed on a side of the cover facing the socket, and corresponding detents that are situated on an area of a side wall of the socket and with which the respective elastic latching tabs engage, wherein a plurality of electrically conductive and elastic straight contact pins are situated at a predetermined lateral distance from each other, are pressed onto and directly contact particular electrical contact surfaces of the sensor device, and are arranged in the cover so that particular first ends of the contact pins protrude into an internal volume of the plug housing and are situated above the receptacle area of the socket, and so that particular second ends of the contact pins are situated in an area of a connector of the cover, wherein an axis along a longest connector dimension of the connector and through an opening of the connector and extending through the cover is oriented perpendicularly with respect to an axis along a longest socket dimension of the socket, and wherein the cover and the connector only cover a portion of the inner side of the socket, wherein the longest connector dimension and the longest socket dimension are perpendicular to one another, wherein a temperature sensor is received by the socket, and wherein the temperature sensor includes plurality of electrically conductive contact bows that contact corresponding ones of the electrical contact surfaces of the sensor device, and wherein the plurality of electrically conductive and elastic straight contact pins are injected into the cover and are elastic. 2. The plug module of claim 1 , wherein the plurality of electrically conductive contact pins are configured to electrically connect, to the sensor device and via their respectively corresponding electrical contact surfaces, a plug that is connectable to the connector. 3. The plug module of claim 2 , wherein the sensor device is configured for measuring a pressure and is adhesively bonded to the socket in a pressure-resistant and air-tight manner, and a pressure feed of the sensor device is situated on an underside of the sensor device adjacent to the socket. 4. The plug module of claim 3 , wherein the temperature sensor is connected to the sensor device, is formed by a thermistor, is extrusion coated with plastic, is installed in the socket and hot-caulked. 5. The plug module of claim 2 , wherein the temperature sensor is connected to the sensor device, is formed by a thermistor, is extrusion coated with plastic, is installed in the socket and hot-caulked. 6. The plug module of claim 1 , wherein the sensor device is configured for measuring a pressure and is adhesively bonded to the socket in a pressure-resistant and air-tight manner, and a pressure feed of the sensor device is situated on an underside of the sensor device adjacent to the socket. 7. The plug module of claim 1 , wherein the temperature sensor is connected to the sensor device, is formed by a thermistor, is extrusion coated with plastic, is installed in the socket and hot-caulked.

Assignees

Inventors

Classifications

  • with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit · CPC title

  • H01R13/506Primary

    assembled by snap action of the parts · CPC title

  • with built-in electronic circuit (H01R13/70, H01R13/719 take precedence) · CPC title

  • the element being a non-linear resistance, e.g. thermistor (G01K7/26 takes precedence) · CPC title

  • Housings {(G01L19/0007, G01L19/0084, G01L19/0092, G01L19/04, G01L19/06 take precedence)} · CPC title

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Frequently asked questions

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What does patent US10777944B2 cover?
A plug module includes a sensor device and a plug housing, the plug housing including a socket, an inner side of which includes a receptacle area for accommodating the sensor device, and a cover that is connected to the socket with the aid of a fastening device, where a plurality of electrically conductive straight contact pins are introduced into the cover in such a way that (a) particular fir…
Who is the assignee on this patent?
Bosch Gmbh Robert
What technology area does this patent fall under?
Primary CPC classification H01R13/506. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 15 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).