Chip-to-chip interface comprising a waveguide with a dielectric part and a conductive part, where the dielectric part transmits signals in a first frequency band and the conductive part transmits signals in a second frequency band

Patent metadata

Field	Value
Publication number	US-10777865-B2
Application number	US-201816145576-A
Country	US
Kind code	B2
Filing date	Sep 28, 2018
Priority date	Mar 28, 2016
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

The present invention relates to a waveguide for transmission of electromagnetic wave signals and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a waveguide for transmission of electromagnetic wave signals, comprising: a dielectric part; and a conductor part surrounding at least a part of the dielectric part, wherein a signal of a first frequency band is transmitted through the dielectric part, and a signal of a second frequency band lower than the first frequency band is transmitted through the conductor part.

First claim

What is claimed is:

1. A chip-to-chip interface apparatus, comprising:
a waveguide for transmission of electromagnetic wave signals; and
a microstrip circuit coupled to the waveguide,
wherein the waveguide comprises a dielectric part and a conductor part surrounding at least a part of the dielectric part,
wherein a signal of a first frequency band is transmitted through the dielectric part, and a signal of a second frequency band lower than the first frequency band is transmitted through the conductor part,
wherein the microstrip circuit transmits the signal of the first frequency band to be transmitted through the dielectric part and the signal of the second frequency band to be transmitted through the conductor part to the dielectric part and the conductor part, respectively, and
wherein the signal of the first frequency band is transmitted through a transition occurring in an impedance discontinuity surface between the waveguide and the microstrip circuit, and the signal of the second frequency band is transmitted through a physical connection line between the waveguide and the microstrip circuit.

2. The waveguide of claim 1 , wherein a direct current (DC) signal is transmitted through the conductor part.

3. The waveguide of claim 1 , wherein the dielectric part comprises two or more dielectrics having different permittivity.

4. The waveguide of claim 3 , wherein the two or more dielectrics comprise a first dielectric and a second dielectric, and the second dielectric surrounds at least a part of the first dielectric.

5. The waveguide of claim 1 , wherein a signal transmitted through the dielectric part is guided along a boundary between the dielectric part and the conductor part.

6. The waveguide of claim 1 , wherein interference between a signal transmission channel of the signal transmitted through the dielectric part and a signal transmission channel of the signal transmitted through the conductor part does not exceed a predetermined level.

7. The waveguide of claim 1 , wherein the conductor part comprises two or more conductor parts through which signals of two or more different frequency bands falling within the second frequency band are respectively transmitted.

Assignees

• Korea Advanced Inst Sci & Tech

Inventors

• Bae Hyeon Min
• Song Ha Il
• Lee Joon Yeong
• Yoon Tae Hoon
• Won Hyo Sup

Classifications

• H01P3/122 Primary

  Dielectric loaded (not air) · CPC title

• H01P3/16

  Dielectric waveguides, i.e. without a longitudinal conductor · CPC title

• H01P1/2138 Primary

  using hollow waveguide filters (H01P1/2131 takes precedence) · CPC title

• H01P5/107 Primary

  Hollow-waveguide/strip-line transitions · CPC title

• H01P3/081

  Microstriplines · CPC title