Composition for sintering, method for producing silver nanoparticles, circuit board, and method for manufacturing circuit board

Patent metadata

Field	Value
Publication number	US-10774231-B2
Application number	US-201916459925-A
Country	US
Kind code	B2
Filing date	Jul 2, 2019
Priority date	Jul 9, 2018
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

An object of the present invention is to provide a composition for sintering capable of suppressing a crack from occurring in a wiring after sintering. Provided is the composition for sintering including silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent. When the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less.

First claim

What is claimed is:

1. A composition for sintering, comprising:
silver nanoparticles;
an organic dispersant for coating the silver nanoparticles; and
a solvent,
wherein:
when the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less, and
when the composition for sintering is subjected to differential thermal analysis, no exothermic peak appears at 350° C. to 500° C.

2. The composition for sintering according to claim 1 , wherein a maximum value of particle size distribution of the silver nanoparticles is 250 nm or less.

3. The composition for sintering according to claim 1 , wherein a maximum value of particle size distribution of the silver nanoparticles is 200 nm or less.

4. The composition for sintering according to claim 1 , wherein the weight loss rate is 2.46% or less.

5. The composition for sintering according to claim 1 , wherein a boiling point of the solvent is less than 260° C.

6. The composition for sintering according to claim 5 , wherein the boiling point of the solvent is a peak temperature when only the solvent is measured by a differential thermal analyzer.

7. The composition for sintering according to claim 1 , wherein a minimum value of particle size distribution of the silver nanoparticles is 50 nm or less.

8. The composition for sintering according to claim 7 , wherein the minimum value of particle size distribution of the silver nanoparticles is 10 nm or less.

9. The composition for sintering according to claim 1 , wherein when the composition for sintering is measured by a differential thermal analyzer, two exothermic peaks appear in a range of 200° C. to 300° C.

10. The composition for sintering according to claim 9 , wherein of the two exothermic peaks, an exothermic peak on a low temperature side is the exothermic peak at least indicating evaporation of the solvent, and an exothermic peak on a high temperature side is the exothermic peak indicating sintering of the silver nanoparticles.

11. The composition for sintering according to claim 1 , wherein the organic dispersant is polyvinyl pyrrolidone.

12. The composition for sintering according to claim 1 , wherein the solvent is polyethylene glycol.

13. A method for manufacturing a circuit board, comprising:
applying the composition for sintering according to claim 1 on a substrate, to form a film; and
sintering the silver nanoparticles contained in the composition for sintering by heating the film, to form a wiring.

14. A circuit board comprising:
a substrate; and
wiring mounted on the substrate,
wherein:
at least a part of the wiring is made of a conductive material obtained by sintering silver nanoparticles,
the wiring includes voids between the sintered silver nanoparticles and the silver nanoparticles,
a ratio occupied by the voids in a cross-section of the wiring is 24.0% or less, and
a sum of peripheral edge lengths of all the voids in a unit area (2500 nm square) of the cross-section of the wiring is 117 nm or more and 331 nm or less.

15. The circuit board according to claim 14 , wherein the ratio occupied by the voids in the cross-section of the wiring is 15.9% or less.

16. The circuit board according to claim 14 , wherein a diameter of the silver nanoparticles is 100 nm or less.

17. A circuit board comprising:
a substrate; and
wiring mounted on the substrate,
wherein:
at least a part of the wiring is made of a conductive material obtained by sintering silver nanoparticles,
the wiring includes voids between the sintered silver nanoparticles and the silver nanoparticles,
a ratio occupied by the voids in a cross-section of the wiring is 24.0% or less, and
the ratio occupied by the voids in the cross-section of the wiring is 8.8% or more.

18. The circuit board according to claim 17 , wherein the ratio occupied by the voids in the cross-section of the wiring is 15.9% or less.

19. The circuit board according to claim 17 , wherein a diameter of the silver nanoparticles is 100 nm or less.

20. The circuit board according to claim 17 , wherein a sum of peripheral edge lengths of all the voids in a unit area (2500 nm square) of the cross-section of the wiring is 117 nm or more and 331 nm or less.

21. A method for producing silver nanoparticles for a composition for sintering that includes the silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent, wherein when the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less, and wherein when the composition for sintering is subjected to differential thermal analysis, no exothermic peak appears at 350° C. to 500° C., the method comprising:
depositing the silver nanoparticles coated with the organic dispersant by dropping a silver ion solution containing silver ions into an organic dispersant solution obtained by dissolving the organic dispersant in the solvent,
wherein by adjusting an amount of the organic dispersant dissolved in the solvent, the silver nanoparticles are produced so that the weight loss rate in the range of 260° C. to 600° C. is 2.92% or less when the composition for sintering is heated.

Assignees

• Stanley Electric Co Ltd

Inventors

• Fukushima Hiroto
• Hanya Akihiko

Classifications

• B22F1/0545

  Dispersions or suspensions of nanosized particles · CPC title

• B22F1/102

  Metallic powder coated with organic material · CPC title

• B22F9/24 Primary

  starting from liquid metal compounds, e.g. solutions · CPC title

• C09D11/52 Primary

  Electrically conductive inks · CPC title

• H05K1/181

  associated with surface mounted components · CPC title