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US-2024401725-A1 · Dec 5, 2024 · US
Surface-modified adhesives
US10773490B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10773490-B2 |
| Application number | US-201013510504-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 18, 2010 |
| Priority date | Nov 20, 2009 |
| Publication date | Sep 15, 2020 |
| Grant date | Sep 15, 2020 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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Abstract
Official abstract text for this publication.
Surface-modified adhesives may be prepared by contacting an adhesive layer to an at least partially discontinuous layer on a releasing substrate and removing the adhesive layer such that at least a portion of the at least partially discontinuous layer adheres to the adhesive surface. The modified adhesive surface remains an adhesive surface. The modified adhesive layer can be used to prepare adhesive articles, including articles containing multiple surface-modified adhesive layers.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of modifying the surface of an adhesive comprising: providing an adhesive layer, wherein the adhesive layer consists of a pressure sensitive adhesive or a heat activated adhesive; providing a releasing substrate with an at least partially discontinuous layer on the surface of the substrate; contacting the adhesive layer to the at least partially discontinuous layer on the surface of the substrate; and removing the adhesive layer from the surface of the substrate, such that the at least partially discontinuous layer at least partially adheres to the surface of the adhesive layer upon removal to form a modified adhesive layer surface, and wherein the modified adhesive layer surface remains a pressure sensitive or heat activated adhesive surface such that the adhesive surface is capable of bonding to a substrate, and wherein the at least partially discontinuous layer is a metal grid or mesh with a thickness of no greater than 500 nanometers. 2. The method of claim 1 , wherein the adhesive layer consists of an optically clear adhesive. 3. The method of claim 1 , wherein the adhesive layer consists of a pressure sensitive adhesive. 4. The method of claim 1 , wherein the releasing substrate comprises a release liner.
Assignees
Inventors
Classifications
Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title
characterised by release liners · CPC title
Carbon, e.g. graphite particles · CPC title
Metal · CPC title
Layered products comprising {a layer of} paper or cardboard · CPC title
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Frequently asked questions
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- What does patent US10773490B2 cover?
- Surface-modified adhesives may be prepared by contacting an adhesive layer to an at least partially discontinuous layer on a releasing substrate and removing the adhesive layer such that at least a portion of the at least partially discontinuous layer adheres to the adhesive surface. The modified adhesive surface remains an adhesive surface. The modified adhesive layer can be used to prepare ad…
- Who is the assignee on this patent?
- Hao Encai, Sherman Audrey A, Schaffer Kevin R, and 8 more
- What technology area does this patent fall under?
- Primary CPC classification B32B7/10. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Sep 15 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).