Two-dimensional data matrix structure and the fabrication method thereof

Patent metadata

Field	Value
Publication number	US-10772195-B2
Application number	US-201815980739-A
Country	US
Kind code	B2
Filing date	May 16, 2018
Priority date	Apr 20, 2018
Publication date	Sep 8, 2020
Grant date	Sep 8, 2020

Abstract

A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.

First claim

What is claimed is:

1. A two-dimensional data matrix structure, comprising:
a first substrate;
a first metal layer disposed on the first substrate, wherein the first metal layer has a plurality of sections and a plurality of empty regions that are formed according to a two-dimensional data matrix pattern, and each of the empty regions is between two of the sections;
a second substrate disposed on the first metal layer; and
a second metal layer disposed on the second substrate, wherein the first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, positions of the through holes correspond to positions of the empty regions, the second substrate and the second metal layer commonly have a plurality of blind holes, positions of the blind holes correspond to positions of the sections, the sections of the first metal layer are exposed through the blind holes, and a configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.

2. The two-dimensional data matrix structure of claim 1 , wherein the first metal layer and the second metal layer are electrically insulated from each other.

3. The two-dimensional data matrix structure of claim 1 , wherein diameters of the blind holes and diameters of the through holes are in a range from 250 nm to 270 nm.

4. The two-dimensional data matrix structure of claim 3 , wherein the diameters of the blind holes and the diameters of the through holes are substantially the same.

5. The two-dimensional data matrix structure of claim 1 , wherein widths of the sections of the first metal layer are greater than diameters of the blind holes.

6. The two-dimensional data matrix structure of claim 1 , further comprising:
a third metal layer disposed on a surface of the first substrate facing away from the first metal layer.

7. The two-dimensional data matrix structure of claim 1 , wherein the first substrate and the second substrate respectively has a first sidewall and a second sidewall facing one of the through holes, one of the sections of the first metal layer has a third sidewall facing one of the through holes, and the third sidewall is recessed in the first sidewall and the second sidewall.

8. A fabrication method of a two-dimensional data matrix structure, comprising:
forming a first metal layer on the first substrate, wherein the first metal layer has a plurality of sections and a plurality of empty regions that are formed according to a two-dimensional data matrix pattern;
forming a second substrate on the first metal layer;
forming a second metal layer on the second substrate; and
forming a plurality of through holes in the first substrate, the second substrate and the second metal layer and forming a plurality of blind holes in the second substrate and the second metal layer by using a laser, wherein positions of the through holes correspond to positions of the empty regions, positions of the blind holes correspond to positions of the sections, and a configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.

9. The fabrication method of a two-dimensional data matrix structure of claim 8 , further comprising:
performing a surface treatment on the second metal layer before forming the through holes and the blind holes by using a laser.

10. The fabrication method of a two-dimensional data matrix structure of claim 8 , further comprising:
positioning a plurality of positions of a plurality of two-dimensional matrix holes on the second metal layer according to the two-dimensional data matrix pattern before forming the through holes and the blind holes by using a laser, wherein the positions of the two-dimensional matrix holes are the positions of the through holes and the blind holes.

Assignees

• Unimicron Technology Corp

Inventors

• Chang jun-jie
• Chang Shian-Tang
• Sung Dung-Ying

Classifications

• H05K3/0026 Primary

  by laser ablation · CPC title

• B32B3/266

  characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12 · CPC title

• H05K2201/09827

  Tapered, e.g. tapered hole, via or groove · CPC title

• H05K1/0266 Primary

  Marks, test patterns or identification means · CPC title

• B23K2103/166

  Multilayered materials · CPC title