Board-to-board contactless connectors and methods for the assembly thereof

Patent metadata

Field	Value
Publication number	US-10772192-B2
Application number	US-201615145589-A
Country	US
Kind code	B2
Filing date	May 3, 2016
Priority date	May 3, 2016
Publication date	Sep 8, 2020
Grant date	Sep 8, 2020

Abstract

The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.

First claim

What is claimed is:

1. A device comprising:
a first circuit board comprising a first contactless communications unit (CCU) mounted to a first surface of the first circuit board;
a second circuit board comprising a second CCU mounted to a second surface of the second circuit board, wherein the second circuit board is positioned below the first circuit board such that the first and second surfaces face each other and that a contactless board-to-board connection is established via the first and second CCUs, wherein each of the first and second CCUs comprises:
a printed circuit board;
a silicon die having a first side and a second side, wherein the first side is mounted to the printed circuit board;
a dielectric layer disposed on the second side of the silicon die;
a transducer disposed on the dielectric layer directly above the second side of the silicon die;
a ground plane adjustment layer disposed on or within the dielectric layer, wherein the ground plane adjustment layer defines an effective ground plane for the transducer, and wherein the silicon die is an actual ground plane for the transducer and wherein the effective ground plane is different than the actual ground plane; and
a collimating structure operative as a lens; and

a conduit structure mounted to the first and second circuit boards, wherein the conduit structure comprises a EHF channel for directing contactless signals being communicated between the first and second CCUs.

2. The device of claim 1 , wherein the contactless board-to-board connection enables contactless transmission of data between the first and second CCUs.

3. The device of claim 1 , further comprising a plurality of post members that securely couple the first and second circuit boards in a fixed position with respect to each other.

4. The device of claim 3 , wherein at least one of the post members comprises a conductor for conveying power between the first and second circuit boards.

5. The device of claim 1 , further comprising at least one conductor coupled between the first and second circuit boards.

6. The device of claim 5 , wherein the at least one conductor is a leaf spring or a wire.

7. The device of claim 1 , wherein the collimating structure is operative to correct for a phase shift associated with the transducer.

8. The device of claim 1 , wherein the second circuit board comprises a third CCU, the device further comprising:
another circuit board comprising a fourth CCU, wherein the third and fourth CCUs form a contactless board-to-component connector for enabling contactless data transfer between the third and fourth CCUs.

9. The device of claim 1 , wherein a gap separation between the first and second CCUs is controlled and wherein alignment axes associated with the first and second CCUs are substantially co-aligned.

10. The device of claim 1 , wherein each of the first and second CCUs further comprises a mold that encapsulates the silicon die, the transducer, and the collimating structure.

11. The device of claim 1 , wherein each of the first and second CCUs further comprises a mold that encapsulates the silicon die and transducer, wherein the collimating structure resides external to the mold.

12. The device of claim 1 , wherein a physical distance between the actual ground plane and the transducer is less than one fourth of a radiating wavelength of contactless signals being transmitted or received by the first and second CCUs.

13. The device of claim 12 , wherein an effective distance between the actual ground plane and the transducer is approximately one fourth of a radiating wavelength of contactless signals being transmitted or received by the first and second CCUs.

14. A device comprising:
a first circuit board comprising a first contactless communications unit (CCU) mounted to a first surface of the first circuit board;
a second circuit board comprising a second CCU mounted to a second surface of the second circuit board, wherein the second circuit board is positioned below the first circuit board such that the first and second surfaces face each other and that a contactless board-to-board connection is established via the first and second CCUs, wherein each of the first and second CCUs comprises:
a printed circuit board;
a silicon die having a first side and a second side, wherein the first side is mounted to the printed circuit board;
a dielectric layer disposed on the second side of the silicon die;
a transducer disposed on the dielectric layer directly above the second side of the silicon die; and
a ground plane adjustment layer disposed on or within the dielectric layer, wherein the ground plane adjustment layer defines an effective ground plane for the transducer, and wherein the silicon die is an actual ground plane for the transducer and wherein the effective ground plane is different than the actual ground plane; and

a conduit structure mounted to the first and second circuit boards, wherein the conduit structure comprises a EHF channel for directing contactless signals being communicated between the first and second CCUs.

15. The device of claim 14 , wherein a physical distance between the actual ground plane and the transducer is less than one fourth of a radiating wavelength of contactless signals being transmitted or received by the first and second CCUs.

16. The device of claim 15 , wherein an effective distance between the actual ground plane and the transducer is approximately one fourth of a radiating wavelength of contactless signals being transmitted or received by the first and second CCUs.

Assignees

• Keyssa Systems Inc

Inventors

• Isaac Roger D
• Abdulla Mostafa Naguib

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title