Multilayered polyolefin-based films having a layer comprising a crystalline block copolymer composite or a block copolymer composite resin

Patent metadata

Field	Value
Publication number	US-10770609-B2
Application number	US-201816205472-A
Country	US
Kind code	B2
Filing date	Nov 30, 2018
Priority date	Jun 30, 2011
Publication date	Sep 8, 2020
Grant date	Sep 8, 2020

Abstract

Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.

First claim

What is claimed is:

1. A multilayer film structure comprising: a tie Layer B and a bottom Layer C;
B. the tie layer B has a top facial surface and a bottom facial surface;
C. the bottom layer C comprises a propylene-based polymer having at least one melting peak greater than 125 C and has a top facial surface and a bottom facial surface, and the top facial surface of Layer C is in adhering contact with the bottom facial surface of Layer B;
wherein the Layer B consists of (1) a block composite resin (BC), (2) an optional colorant, (3) an optional stabilizer, and (4) an optional antioxidant, the BC made from monomers consisting of propylene and ethylene, and the BC has
i) an ethylene-propylene copolymer (EP) comprising at least 80 mol % polymerized ethylene;
ii) a crystalline propylene-based polymer (CPP); and
iii) a diblock copolymer comprising (a) an ethylene-propylene block comprising at least 80 mol % polymerized ethylene and (b) a crystalline propylene block.

2. The multilayer film structure of claim 1 wherein the CPP comprises greater than 90 mol % polymerized propylene.

3. The multilayer film structure of claim 2 wherein the block composite resin in Layer B has two peak melting temperatures and a first peak melting temperature greater than 120° C.

4. The multilayer film structure of claim 1 wherein the crystalline propylene block (iii)(b) of the diblock copolymer is the same composition as the crystalline propylene-based polymer (CPP) of the block composite resin.

5. The multilayer film structure of claim 4 wherein the ethylene-propylene block (iii)(a) of the diblock copolymer is the same composition as the EP copolymer of the block composite resin.

6. The multilayer film structure of claim 1 wherein the Layer B block composite resin has an ethylene-propylene block amount in the range of from 30 to 70 weight % based on total weight of the diblock copolymer (iii).

7. The multilayer film structure of claim 1 wherein the block composite resin has a crystalline block composite index (CBCI) from 0.3 to 0.8.

8. The multilayer film structure of claim 1 wherein the tie Layer B is a blend with greater than 40 weight percent of the block composite resin.

9. The multilayer film structure of claim 1 comprising:
(A) a seal layer A having a top facial surface and a bottom facial surface, the bottom facial surface of layer a in adhering contact with the top facial surface of layer B.

10. The multilayer film structure of claim 9 wherein the layer A comprises a linear low density polyethylene (LLDPE).

11. The multilayer film structure of claim 10 wherein the layer A comprises a blend formulation of a linear low density polyethylene (LLDPE) comprising a polar ethylene copolymer in an amount from 10 weight % to 45 weight %.

12. The multilayer film structure of claim 9 wherein the layer A comprises a block composite resin and the layer A composition is different from the layer B composition.

13. The multilayer film structure of claim 9 wherein Layer A is from greater than 0 to 200 micrometer (μm) in thickness; Layer B is from 25 to 100 μm in thickness; and Layer C is from 150 to 350 μm in thickness.

14. The multilayer film structure of claim 1 wherein the block composite resin has a density from 0.905 g/cc to 0.912 g/cc.

15. The multilayer film structure of claim 1 comprising
a top seal Layer A comprising a blend formulation of a linear low density polyethylene (LLDPE) comprising a polar ethylene copolymer in an amount from 10 weight % to 45 weight %;
the bottom Layer C comprising the propylene-based polymer; and
the Layer B between Layer A and Layer C, the block composite resin with
i) an ethylene-propylene copolymer (EP) comprising at least 93 mol % polymerized ethylene;
ii) the crystalline propylene-based polymer; and
iii) a diblock copolymer comprising (a) an ethylene-propylene block comprising at least 93 mol % polymerized ethylene and (b) a crystalline propylene block.

16. An electronic device (ED) module comprising an electronic device and a multilayer film structure according to claim 1 .

17. The multilayer film structure of claim 1 wherein the Layer (B) consists of (1) the BC, (2) the colorant, (3) the stabilizer that is a UV stabilizer, and (4) the antioxidant.

18. The multilayer film structure of claim 1 wherein the Layer (B) consists of (1) the BC, (2) the colorant, and (3) the stabilizer that is a UV stabilizer.

19. The multilayer film structure of claim 1 wherein the Layer (B) consists of (1) the BC, and (2) the colorant.

Assignees

• Dow Gobal Tech Llc
• Dow Global Technologies Llc

Inventors

• Bonekamp Jeffrey E
• Hu Yushan
• Nickel Nichole E
• Chu Lih-Long
• Naumovitz John A
• Hofius Mark G

Classifications

• H10F71/00

  Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) · CPC title

• H10F19/85 Primary

  Protective back sheets · CPC title

• H10F19/804

  Materials of encapsulations · CPC title

• Y02E10/50

  Photovoltaic [PV] energy · CPC title

• B32B2457/12

  Photovoltaic modules · CPC title