Multilayer electronic component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10770232-B2
Application number	US-201816044898-A
Country	US
Kind code	B2
Filing date	Jul 25, 2018
Priority date	Sep 29, 2017
Publication date	Sep 8, 2020
Grant date	Sep 8, 2020

Abstract

A multilayer electronic component for enhancing damp proof reliability includes: a capacitor body including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second electrodes through third and fourth surfaces of the capacitor body; first and second conductive layers disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively; first and second plating layers covering surfaces of the first and second conductive layers; and a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers and having an entire thickness of 10 nm to 200 nm.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a capacitor body including first and second surfaces facing each other, third and fourth surfaces connected to the first and second surfaces and facing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and facing each other, and including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second internal electrodes through the third and fourth surfaces;
a first conductive layer and a second conductive layer disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively;
a first plating layer and a second plating layer covering surfaces of the first and second conductive layers; and
a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers and having an entire thickness of 10 nm to 200 nm,
wherein the plurality of coating layers is arranged and configured such that at least a portion of the surface of the capacitor body is exposed to an outside of the capacitor body through at least one gap between adjacent portions of the plurality of coating layers.

2. The multilayer electronic component of claim 1 , wherein at least some of the plurality of coating layers are formed of different materials.

3. The multilayer electronic component of claim 2 , wherein the plurality of coating layers are configured with a double-layered structure, and an internal coating layer of the plurality of coating layers includes aluminum oxide (Al 2 O 3 ) and an external coating layer of the plurality of coating layers includes any one of silicon dioxide (SiO 2 ) or titanium dioxide (TiO 2 ).

4. The multilayer electronic component of claim 1 , wherein the plurality of coating layers are further disposed on a portion between the first conductive layer and the first plating layer and a portion between the second conductive layer and the second plating layer.

5. The multilayer electronic component of claim 1 , wherein the first and second plating layers include a nickel (Ni) plating layer disposed on the first and second conductive layers, and a tin (Sn) plating layer disposed on the nickel (Ni) plating layer.

6. A multilayer electronic component comprising:
a capacitor body including first and second surfaces facing each other, third and fourth surfaces connected to the first and second surfaces and facing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and facing each other, and including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second internal electrodes through the third and fourth surfaces;
a first conductive layer and a second conductive layer disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively;
a first plating layer and a second plating layer covering surfaces of the first and second conductive layers; and
a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers,
wherein at least some of the plurality of coating layers are formed of different materials, and
wherein the plurality of coating layers is arranged and configured such that at least a portion of the surface of the capacitor body is exposed to an outside of the capacitor body through at least one gap between adjacent portions of the plurality of coating layers.

7. The multilayer electronic component of claim 6 , wherein the plurality of coating layers have an entire thickness of 10 nm to 200 nm.

8. The multilayer electronic component of claim 6 , wherein the plurality of coating layers are configured with a double-layered structure, and an internal coating layer of the plurality of coating layers includes aluminum oxide (Al 2 O 3 ) and an external coating layer of the plurality of coating layers includes any one of silicon dioxide (SiO 2 ) or titanium dioxide (TiO 2 ).

9. The multilayer electronic component of claim 6 , wherein the plurality of coating layers are further disposed on a portion between the first conductive layer and the first plating layer and a portion between the second conductive layer and the second plating layer.

10. The multilayer electronic component of claim 6 , wherein the first and second plating layers include a nickel (Ni) plating layer disposed on the first and second conductive layers, and a tin (Sn) plating layer disposed on the nickel (Ni) plating layer.

Assignees

• Samsung Electro Mech

Inventors

• Han Seung Hun
• Cho Sung Min
• Oh Dong Joon

Classifications

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/1209

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title