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US-10534331-B2 · Jan 14, 2020 · US
Electrical device with soldered joint
US10770204B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10770204-B2 |
| Application number | US-201816611294-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 12, 2018 |
| Priority date | Jul 20, 2017 |
| Publication date | Sep 8, 2020 |
| Grant date | Sep 8, 2020 |
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- Title
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- Abstract
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- Assignees and inventors
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- Key dates
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- First independent claim
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- CPC / IPC classifications
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- Citations and related patents
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Abstract
Official abstract text for this publication.
An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.
First claim
Opening claim text (preview).
The invention claimed is: 1. An electrical device comprising: at least one soldered joint comprising a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device, and wherein the bearing surface of the first wire has a rounded end in plan view. 2. The device according to claim 1 , wherein the first wire has a further bend in a region of a flattened portion which is directed towards a contact surface. 3. The device according to claim 1 , wherein the first wire has a flattened portion in the region of the bearing surface. 4. The device according to claim 1 , wherein the device has at least one contact surface for the soldered joint which is coated with an electrically conductive metal. 5. The device according to claim 4 , wherein the bearing surface of the first wire is shorter than the contact surface. 6. The device according to claim 1 , wherein the first wire extends after the bend with a gap relative to a contact surface when viewed from the bearing surface. 7. The device according to claim 6 , wherein the soldered joint comprises a solder, a greater part of which is arranged in a region in which the first wire extends with the gap relative to the contact surface. 8. The device according to claim 1 , wherein the bend is arranged in the first wire at an end of a flattened portion where it develops into a region of a round cross-sectional shape. 9. The device according to claim 8 , further comprising a first wire insulation of a synthetic polymer material, which begins only in the region of round cross-sectional shape. 10. The device according to claim 1 , wherein the device comprises an NTC ceramic. 11. The device according to claim 1 , further comprising a polymer covering, which envelops the device, the soldered joint and the first wire to as far as behind a last bend. 12. The device according to claim 1 , further comprising a second contact surface, to which a second wire identical in form to the first wire is soldered. 13. An electrical device comprising: at least one soldered joint comprising a wire soldered at one end to the device, wherein the wire bears with a bearing surface on the device, wherein the wire has at least one bend in a region of the bearing surface of the wire on the device, wherein the wire has a flattened portion in the region of the bearing surface, and wherein the bend is arranged in the wire at an end of the flattened portion where it develops into a region of a round cross-sectional shape.
Assignees
Inventors
Classifications
by thick film techniques · CPC title
- H01C1/144Primary
the terminals or tapping points being welded or soldered · CPC title
Terminals or electrodes formed on resistive elements having negative temperature coefficient · CPC title
Soldered or welded connections · CPC title
between cables or wires and terminals · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10770204B2 cover?
- An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.
- Who is the assignee on this patent?
- Tdk Electronics Ag
- What technology area does this patent fall under?
- Primary CPC classification H01C1/144. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 08 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).