Apparatuses and methods for blue-cut lenses

US10768448B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10768448-B2
Application numberUS-201716335206-A
CountryUS
Kind codeB2
Filing dateSep 20, 2017
Priority dateSep 20, 2016
Publication dateSep 8, 2020
Grant dateSep 8, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A blue-cut wafer can be coupled to a lens, such that the blue-cut wafer can be configured to reduce by absorption at least a portion of light having a first wavelength range from 400 nanometers to 500 nanometers, preferably from 400 nanometers to 460 nanometers. The blue-cut wafer can permit light having a second wavelength range, the second wavelength range being greater than the first wavelength range, and homogenize a color appearance and a blue-cut performance level of the blue-cut wafer based on the blue-cut wafer having a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A blue-cut wafer, comprising: one or more of blue blocking dyes blended with a thermoplastic resin injection molded into the blue-cut wafer; or a thermoplastic blue-cut film thermoformed into the blue-cut wafer; wherein: the blue-cut wafer is configured to reduce by absorption at least a portion of light having a first wavelength range from 400 nanometers to 500 nanometers; the blue-cut wafer has a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer; and a color appearance and a blue-cut performance level of the blue-cut wafer are homogenized in such a manner as ΔE≤1, where ΔE is a color difference between a wafer center and a wafer edge calculated using color-difference formula CIE76. 2. The blue-cut wafer of claim 1 , wherein the blue-cut wafer includes a selection of a difference between an edge thickness and a center thickness of the blue-cut wafer based on a selected range of thickness of the blue-cut wafer. 3. The blue-cut wafer of claim 2 , wherein the blue-cut wafer is configured to permit light having a second wavelength range, the second wavelength range including wavelengths outside the first wavelength range. 4. The blue-cut wafer of claim 1 , wherein the blue-cut wafer includes one or more additional layers providing one or more of polarization, near-infrared cut, additional light filters, and color balancing. 5. A method of manufacturing a transparent optical article comprising the blue-cut wafer of claim 1 , comprising: blending blue blocking dyes with a thermoplastic resin injection molded into a blue-cut wafer or thermoforming a blue-cut film into the blue-cut wafer, calculating a thickness variation range of the blue-cut wafer; calculating a maximum edge thickness and minimum edge thickness of the blue-cut wafer; and integrating the blue-cut wafer onto a lens via one or more of front-side lamination, direct injection, in-molding lamination, or bi-injection. 6. The method of claim 5 , further comprising: selecting a difference between an edge thickness and a center thickness of the blue-cut wafer based on the thickness variation range of the blue-cut wafer. 7. The method of claim 6 , further comprising: selecting a blue-cut wafer thickness less than 1.5 millimeters. 8. The method of claim 6 , further comprising: selecting a blue-cut wafer thickness less than 1.3 millimeters. 9. The method of claim 6 , further comprising: selecting a blue-cut wafer thickness less than 1.1 millimeters. 10. The method of claim 5 , wherein the homogenized color appearance and blue-cut performance level of the blue-cut wafer is based on the blue-cut wafer having a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer. 11. The method of claim 5 , further comprising: permitting, via the blue-cut wafer, light having a second wavelength range outside the first wavelength range.

Assignees

Inventors

Classifications

  • Optical brightening agents, organic pigments · CPC title

  • Production of filters · CPC title

  • G02C7/104Primary

    having spectral characteristics for purposes other than sun-protection · CPC title

  • G02B5/223Primary

    containing organic substances, e.g. dyes, inks or pigments · CPC title

  • Optical elements and systems for visual disorders other than refractive errors, low vision · CPC title

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What does patent US10768448B2 cover?
A blue-cut wafer can be coupled to a lens, such that the blue-cut wafer can be configured to reduce by absorption at least a portion of light having a first wavelength range from 400 nanometers to 500 nanometers, preferably from 400 nanometers to 460 nanometers. The blue-cut wafer can permit light having a second wavelength range, the second wavelength range being greater than the first wavelen…
Who is the assignee on this patent?
Essilor Int
What technology area does this patent fall under?
Primary CPC classification G02C7/104. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 08 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).