Apparatus for enhancing display readability in an environment with strong ambient light
US-2015378178-A1 · Dec 31, 2015 · US
US10768448B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10768448-B2 |
| Application number | US-201716335206-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 20, 2017 |
| Priority date | Sep 20, 2016 |
| Publication date | Sep 8, 2020 |
| Grant date | Sep 8, 2020 |
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A blue-cut wafer can be coupled to a lens, such that the blue-cut wafer can be configured to reduce by absorption at least a portion of light having a first wavelength range from 400 nanometers to 500 nanometers, preferably from 400 nanometers to 460 nanometers. The blue-cut wafer can permit light having a second wavelength range, the second wavelength range being greater than the first wavelength range, and homogenize a color appearance and a blue-cut performance level of the blue-cut wafer based on the blue-cut wafer having a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer.
Opening claim text (preview).
The invention claimed is: 1. A blue-cut wafer, comprising: one or more of blue blocking dyes blended with a thermoplastic resin injection molded into the blue-cut wafer; or a thermoplastic blue-cut film thermoformed into the blue-cut wafer; wherein: the blue-cut wafer is configured to reduce by absorption at least a portion of light having a first wavelength range from 400 nanometers to 500 nanometers; the blue-cut wafer has a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer; and a color appearance and a blue-cut performance level of the blue-cut wafer are homogenized in such a manner as ΔE≤1, where ΔE is a color difference between a wafer center and a wafer edge calculated using color-difference formula CIE76. 2. The blue-cut wafer of claim 1 , wherein the blue-cut wafer includes a selection of a difference between an edge thickness and a center thickness of the blue-cut wafer based on a selected range of thickness of the blue-cut wafer. 3. The blue-cut wafer of claim 2 , wherein the blue-cut wafer is configured to permit light having a second wavelength range, the second wavelength range including wavelengths outside the first wavelength range. 4. The blue-cut wafer of claim 1 , wherein the blue-cut wafer includes one or more additional layers providing one or more of polarization, near-infrared cut, additional light filters, and color balancing. 5. A method of manufacturing a transparent optical article comprising the blue-cut wafer of claim 1 , comprising: blending blue blocking dyes with a thermoplastic resin injection molded into a blue-cut wafer or thermoforming a blue-cut film into the blue-cut wafer, calculating a thickness variation range of the blue-cut wafer; calculating a maximum edge thickness and minimum edge thickness of the blue-cut wafer; and integrating the blue-cut wafer onto a lens via one or more of front-side lamination, direct injection, in-molding lamination, or bi-injection. 6. The method of claim 5 , further comprising: selecting a difference between an edge thickness and a center thickness of the blue-cut wafer based on the thickness variation range of the blue-cut wafer. 7. The method of claim 6 , further comprising: selecting a blue-cut wafer thickness less than 1.5 millimeters. 8. The method of claim 6 , further comprising: selecting a blue-cut wafer thickness less than 1.3 millimeters. 9. The method of claim 6 , further comprising: selecting a blue-cut wafer thickness less than 1.1 millimeters. 10. The method of claim 5 , wherein the homogenized color appearance and blue-cut performance level of the blue-cut wafer is based on the blue-cut wafer having a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer. 11. The method of claim 5 , further comprising: permitting, via the blue-cut wafer, light having a second wavelength range outside the first wavelength range.
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